{"id":"https://openalex.org/W2167704237","doi":"https://doi.org/10.1109/nems.2009.5068670","title":"Finite elements study of high mechanical stress in nanostructures for innovative NEMS sensors","display_name":"Finite elements study of high mechanical stress in nanostructures for innovative NEMS sensors","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W2167704237","doi":"https://doi.org/10.1109/nems.2009.5068670","mag":"2167704237"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2009.5068670","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2009.5068670","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101520759","display_name":"Xin Xu","orcid":"https://orcid.org/0000-0002-6665-9989"},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Xin Xu","raw_affiliation_strings":["IMEP-LAHC, Grenoble Institute of technology, Grenoble, France","IMEP-LAHC, Minatec, Grenoble Institute of Technology (INPG), Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEP-LAHC, Grenoble Institute of technology, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I4210139715"]},{"raw_affiliation_string":"IMEP-LAHC, Minatec, Grenoble Institute of Technology (INPG), Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I4210139715","https://openalex.org/I899635006"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058234157","display_name":"B. Bercu","orcid":null},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Bogdan Bercu","raw_affiliation_strings":["IMEP-LAHC, Grenoble Institute of technology, Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEP-LAHC, Grenoble Institute of technology, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I4210139715"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045794429","display_name":"F. Lime","orcid":"https://orcid.org/0000-0002-1024-6480"},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Francois Lime","raw_affiliation_strings":["IMEP-LAHC, Grenoble Institute of technology, Grenoble, France","IMEP-LAHC, Minatec, Grenoble Institute of Technology (INPG), Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEP-LAHC, Grenoble Institute of technology, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I4210139715"]},{"raw_affiliation_string":"IMEP-LAHC, Minatec, Grenoble Institute of Technology (INPG), Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I4210139715","https://openalex.org/I899635006"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041534832","display_name":"L. Mont\u00e8s","orcid":"https://orcid.org/0000-0002-3678-0163"},"institutions":[{"id":"https://openalex.org/I106785703","display_name":"Institut polytechnique de Grenoble","ror":"https://ror.org/05sbt2524","country_code":"FR","type":"education","lineage":["https://openalex.org/I106785703","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I4210139715","display_name":"Institut de Micro\u00e9lectronique, Electromagn\u00e9tisme et Photonique","ror":"https://ror.org/03taa9n66","country_code":"FR","type":"facility","lineage":["https://openalex.org/I106785703","https://openalex.org/I1294671590","https://openalex.org/I4210095849","https://openalex.org/I4210139715","https://openalex.org/I70900168","https://openalex.org/I899635006"]},{"id":"https://openalex.org/I899635006","display_name":"Universit\u00e9 Grenoble Alpes","ror":"https://ror.org/02rx3b187","country_code":"FR","type":"education","lineage":["https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Laurent Montes","raw_affiliation_strings":["IMEP-LAHC, Grenoble Institute of technology, Grenoble, France","IMEP-LAHC, Minatec, Grenoble Institute of Technology (INPG), Grenoble, France"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IMEP-LAHC, Grenoble Institute of technology, Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I4210139715"]},{"raw_affiliation_string":"IMEP-LAHC, Minatec, Grenoble Institute of Technology (INPG), Grenoble, France","institution_ids":["https://openalex.org/I106785703","https://openalex.org/I4210139715","https://openalex.org/I899635006"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"676","last_page":"681"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/nanoelectromechanical-systems","display_name":"Nanoelectromechanical systems","score":0.9508448839187622},{"id":"https://openalex.org/keywords/piezoresistive-effect","display_name":"Piezoresistive effect","score":0.7664384841918945},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7198927402496338},{"id":"https://openalex.org/keywords/pressure-sensor","display_name":"Pressure sensor","score":0.6669015288352966},{"id":"https://openalex.org/keywords/nanowire","display_name":"Nanowire","score":0.6106720566749573},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.5171244144439697},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.5031360983848572},{"id":"https://openalex.org/keywords/bending","display_name":"Bending","score":0.4648617208003998},{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"Flexible electronics","score":0.462015300989151},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.4511052370071411},{"id":"https://openalex.org/keywords/nanostructure","display_name":"Nanostructure","score":0.44360747933387756},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.43949103355407715},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.41298091411590576},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.37495988607406616},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2742503881454468},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.22762036323547363},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21058517694473267},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.13446924090385437},{"id":"https://openalex.org/keywords/nanoparticle","display_name":"Nanoparticle","score":0.07751607894897461}],"concepts":[{"id":"https://openalex.org/C173409883","wikidata":"https://www.wikidata.org/wiki/Q175593","display_name":"Nanoelectromechanical systems","level":4,"score":0.9508448839187622},{"id":"https://openalex.org/C198490522","wikidata":"https://www.wikidata.org/wiki/Q1932915","display_name":"Piezoresistive effect","level":2,"score":0.7664384841918945},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7198927402496338},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.6669015288352966},{"id":"https://openalex.org/C74214498","wikidata":"https://www.wikidata.org/wiki/Q631739","display_name":"Nanowire","level":2,"score":0.6106720566749573},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5171244144439697},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5031360983848572},{"id":"https://openalex.org/C87210426","wikidata":"https://www.wikidata.org/wiki/Q1072476","display_name":"Bending","level":2,"score":0.4648617208003998},{"id":"https://openalex.org/C84967400","wikidata":"https://www.wikidata.org/wiki/Q1066289","display_name":"Flexible electronics","level":2,"score":0.462015300989151},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.4511052370071411},{"id":"https://openalex.org/C186187911","wikidata":"https://www.wikidata.org/wiki/Q1093894","display_name":"Nanostructure","level":2,"score":0.44360747933387756},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.43949103355407715},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.41298091411590576},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.37495988607406616},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2742503881454468},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.22762036323547363},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21058517694473267},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.13446924090385437},{"id":"https://openalex.org/C155672457","wikidata":"https://www.wikidata.org/wiki/Q61231","display_name":"Nanoparticle","level":2,"score":0.07751607894897461},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C15083742","wikidata":"https://www.wikidata.org/wiki/Q261659","display_name":"Nanomedicine","level":3,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2009.5068670","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2009.5068670","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.44999998807907104,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1533058090","https://openalex.org/W1961940038","https://openalex.org/W2029869373","https://openalex.org/W2038667420","https://openalex.org/W2040227936","https://openalex.org/W2049819040","https://openalex.org/W2052444621","https://openalex.org/W2063263662","https://openalex.org/W2090921749","https://openalex.org/W2098745517","https://openalex.org/W2117810651","https://openalex.org/W2166884695","https://openalex.org/W3133968805","https://openalex.org/W3211431153","https://openalex.org/W4238525890","https://openalex.org/W4377003399","https://openalex.org/W6631977990","https://openalex.org/W6662844808","https://openalex.org/W6790732194"],"related_works":["https://openalex.org/W4285099144","https://openalex.org/W2294335124","https://openalex.org/W4317346967","https://openalex.org/W1514561573","https://openalex.org/W2013168879","https://openalex.org/W1527636689","https://openalex.org/W1852323362","https://openalex.org/W1902246597","https://openalex.org/W2203580760","https://openalex.org/W3043704364"],"abstract_inverted_index":{"Mechanical":[0],"stress":[1,49,165],"is":[2,12],"increasingly":[3],"applied":[4],"in":[5,35,50,78,102,123],"micro-electronics.":[6],"For":[7,27],"instance,":[8],"strained":[9],"silicon":[10],"technology":[11],"widely":[13],"used":[14],"to":[15,149,167],"improve":[16],"carrier":[17],"mobility":[18],"and":[19,80,88,128,153,166],"therefore":[20],"driver":[21],"current":[22,132],"for":[23,46],"advanced":[24],"MOS":[25],"transistors.":[26],"micro-electromechanical":[28],"systems,":[29],"piezoresistive":[30],"effects":[31],"are":[32],"universally":[33],"employed":[34],"pressure":[36,75,103,171],"sensors.":[37,172],"In":[38],"this":[39,67],"paper":[40],"we":[41,70],"present":[42],"an":[43],"original":[44],"method":[45],"studying":[47],"mechanical":[48,154,164],"nano-devices":[51],"placed":[52],"on":[53,93],"ultra-thin":[54],"membranes,":[55],"which":[56,133],"has":[57],"several":[58],"advantages":[59],"compared":[60],"with":[61],"the":[62,72,85,94,117,121,130,136,141,151,157,160],"conventional":[63],"four-point-bending":[64],"method.":[65,144],"Using":[66],"new":[68],"architecture,":[69],"investigate":[71,116],"innovative":[73,169],"NEMS":[74,170],"sensor":[76],"properties":[77,155],"static":[79],"dynamic":[81,118,125],"modes.":[82],"We":[83,96,114],"study":[84],"optimal":[86],"orientation":[87],"position":[89],"of":[90,120,156,162],"a":[91,99],"nanowire":[92],"membrane.":[95],"show":[97],"that":[98],"large":[100,163],"improvement":[101],"measurement":[104],"sensitivity":[105],"can":[106],"be":[107],"obtained":[108],"by":[109,140],"adopting":[110],"tunnel":[111,131,138],"junction":[112],"technology.":[113],"also":[115],"multi-bends":[119],"nanostructure":[122,158],"its":[124],"deformation":[126],"modes":[127],"calculate":[129],"passes":[134],"through":[135],"multi":[137],"junctions":[139],"transport":[142],"matrix":[143],"Finally,":[145],"our":[146],"work":[147],"helps":[148],"understand":[150],"electrical":[152],"under":[159],"influence":[161],"design":[168]},"counts_by_year":[{"year":2012,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}