{"id":"https://openalex.org/W2167116781","doi":"https://doi.org/10.1109/nems.2009.5068621","title":"Low temperature direct bonding for hermetic wafer level packaging","display_name":"Low temperature direct bonding for hermetic wafer level packaging","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W2167116781","doi":"https://doi.org/10.1109/nems.2009.5068621","mag":"2167116781"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2009.5068621","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2009.5068621","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100642165","display_name":"Lei Nie","orcid":"https://orcid.org/0000-0003-2557-2673"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]},{"id":"https://openalex.org/I4210138186","display_name":"Wuhan National Laboratory for Optoelectronics","ror":"https://ror.org/03c9ncn37","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210138186"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Lei Nie","raw_affiliation_strings":["Division of Optoelectronic Materials and Micro-Nano Manufacture, Wuhan National Laboratory of Optoelectronics, Wuhan, China","School of Mechanical Science & Engineering, HuaZhong University of Science and Technology, Wuhan, China"],"affiliations":[{"raw_affiliation_string":"Division of Optoelectronic Materials and Micro-Nano Manufacture, Wuhan National Laboratory of Optoelectronics, Wuhan, China","institution_ids":["https://openalex.org/I4210138186"]},{"raw_affiliation_string":"School of Mechanical Science & Engineering, HuaZhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102777487","display_name":"Tielin Shi","orcid":"https://orcid.org/0000-0003-1788-3121"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]},{"id":"https://openalex.org/I4210138186","display_name":"Wuhan National Laboratory for Optoelectronics","ror":"https://ror.org/03c9ncn37","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210138186"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tielin Shi","raw_affiliation_strings":["Division of Optoelectronic Materials and Micro-Nano Manufacture, Wuhan National Laboratory of Optoelectronics, Wuhan, China","School of Mechanical Science & Engineering, HuaZhong University of Science and Technology, Wuhan, China"],"affiliations":[{"raw_affiliation_string":"Division of Optoelectronic Materials and Micro-Nano Manufacture, Wuhan National Laboratory of Optoelectronics, Wuhan, China","institution_ids":["https://openalex.org/I4210138186"]},{"raw_affiliation_string":"School of Mechanical Science & Engineering, HuaZhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032400858","display_name":"Zirong Tang","orcid":"https://orcid.org/0000-0001-8535-5852"},"institutions":[{"id":"https://openalex.org/I4210138186","display_name":"Wuhan National Laboratory for Optoelectronics","ror":"https://ror.org/03c9ncn37","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210138186"]},{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zirong Tang","raw_affiliation_strings":["Division of Optoelectronic Materials and Micro-Nano Manufacture, Wuhan National Laboratory of Optoelectronics, Wuhan, China","School of Mechanical Science & Engineering, HuaZhong University of Science and Technology, Wuhan, China"],"affiliations":[{"raw_affiliation_string":"Division of Optoelectronic Materials and Micro-Nano Manufacture, Wuhan National Laboratory of Optoelectronics, Wuhan, China","institution_ids":["https://openalex.org/I4210138186"]},{"raw_affiliation_string":"School of Mechanical Science & Engineering, HuaZhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100327227","display_name":"Shiyuan Liu","orcid":"https://orcid.org/0000-0002-0756-1439"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shiyuan Liu","raw_affiliation_strings":["State Key Laboratory of Digital Manufacturing Equipment and Technology, HuaZhong University of Science and Technology, Wuhan, China"],"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Digital Manufacturing Equipment and Technology, HuaZhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5013330870","display_name":"Guanglan Liao","orcid":"https://orcid.org/0000-0002-1849-5473"},"institutions":[{"id":"https://openalex.org/I47720641","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53","country_code":"CN","type":"education","lineage":["https://openalex.org/I47720641"]},{"id":"https://openalex.org/I4210138186","display_name":"Wuhan National Laboratory for Optoelectronics","ror":"https://ror.org/03c9ncn37","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210138186"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guanglan Liao","raw_affiliation_strings":["Division of Optoelectronic Materials and Micro-Nano Manufacture, Wuhan National Laboratory of Optoelectronics, Wuhan, China","School of Mechanical Science & Engineering, HuaZhong University of Science and Technology, Wuhan, China"],"affiliations":[{"raw_affiliation_string":"Division of Optoelectronic Materials and Micro-Nano Manufacture, Wuhan National Laboratory of Optoelectronics, Wuhan, China","institution_ids":["https://openalex.org/I4210138186"]},{"raw_affiliation_string":"School of Mechanical Science & Engineering, HuaZhong University of Science and Technology, Wuhan, China","institution_ids":["https://openalex.org/I47720641"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5100642165"],"corresponding_institution_ids":["https://openalex.org/I4210138186","https://openalex.org/I47720641"],"apc_list":null,"apc_paid":null,"fwci":0.2991,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.66090297,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"110","issue":null,"first_page":"472","last_page":"475"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8954428434371948},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.7420679330825806},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.6872410774230957},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.66873699426651},{"id":"https://openalex.org/keywords/bonding-strength","display_name":"Bonding strength","score":0.6355512142181396},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.5471885800361633},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5423300266265869},{"id":"https://openalex.org/keywords/anodic-bonding","display_name":"Anodic bonding","score":0.5044857263565063},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.4865659773349762},{"id":"https://openalex.org/keywords/direct-bonding","display_name":"Direct bonding","score":0.47914808988571167},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4230878949165344},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.37044668197631836},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3463340103626251},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.11329984664916992}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8954428434371948},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.7420679330825806},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.6872410774230957},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.66873699426651},{"id":"https://openalex.org/C2984173401","wikidata":"https://www.wikidata.org/wiki/Q2914535","display_name":"Bonding strength","level":2,"score":0.6355512142181396},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.5471885800361633},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5423300266265869},{"id":"https://openalex.org/C201414436","wikidata":"https://www.wikidata.org/wiki/Q567503","display_name":"Anodic bonding","level":3,"score":0.5044857263565063},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.4865659773349762},{"id":"https://openalex.org/C2778071519","wikidata":"https://www.wikidata.org/wiki/Q5280309","display_name":"Direct bonding","level":3,"score":0.47914808988571167},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4230878949165344},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.37044668197631836},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3463340103626251},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.11329984664916992},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2009.5068621","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2009.5068621","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321883","display_name":"Huazhong University of Science and Technology","ror":"https://ror.org/00p991c53"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1979960932","https://openalex.org/W2059222777","https://openalex.org/W2065505695","https://openalex.org/W2078478482","https://openalex.org/W2079618867"],"related_works":["https://openalex.org/W4241278528","https://openalex.org/W2582960117","https://openalex.org/W2887301363","https://openalex.org/W1990895528","https://openalex.org/W3080102995","https://openalex.org/W1906666741","https://openalex.org/W651005398","https://openalex.org/W3008251946","https://openalex.org/W2090223096","https://openalex.org/W2328166803"],"abstract_inverted_index":{"A":[0],"novel":[1],"hermetic":[2,103],"wafer":[3,25],"level":[4],"packaging":[5],"technology":[6],"is":[7],"presented":[8],"in":[9,83,96],"this":[10,48],"paper,":[11],"which":[12,34],"was":[13,77,105,113],"realized":[14],"by":[15,59],"the":[16,30,45,67,74,88,94],"aid":[17],"of":[18,47,53,62,69,93],"low":[19],"temperature":[20],"direct":[21],"bonding.":[22],"One":[23],"silicon":[24],"with":[26],"etched":[27],"cavities":[28,95],"and":[29,38,66,81,90,111],"other":[31],"bare":[32],"wafer,":[33],"acted":[35],"as":[36],"cover":[37],"substrate":[39],"respectively,":[40],"were":[41,56,99],"bonded":[42,97],"to":[43],"demonstrate":[44],"feasibility":[46],"technology.":[49],"The":[50,101],"bonding":[51,91],"surfaces":[52],"both":[54],"wafers":[55,98],"activated":[57],"hydrophilically":[58],"a":[60],"series":[61],"wet":[63],"chemical":[64],"treatments":[65],"data":[68],"contact":[70],"angle":[71],"measurement":[72],"showed":[73],"activating":[75],"process":[76],"efficient.":[78],"After":[79],"prebonding":[80],"annealing":[82],"350\u00b0":[84],"for":[85],"5":[86],"hours,":[87],"hermeticity":[89],"strength":[92,112],"evaluated.":[100],"average":[102],"performance":[104],"1.175\u00d710":[106],"<sup":[107],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[108],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">\u22128</sup>":[109],"Pa\u22c5m3/s":[110],"7.8Mpa.":[114]},"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}