{"id":"https://openalex.org/W2168455094","doi":"https://doi.org/10.1109/nems.2009.5068548","title":"Etch-back in DDSOG process by ultrasonic agitation and application to tunneling gyroscope fabrication","display_name":"Etch-back in DDSOG process by ultrasonic agitation and application to tunneling gyroscope fabrication","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W2168455094","doi":"https://doi.org/10.1109/nems.2009.5068548","mag":"2168455094"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2009.5068548","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2009.5068548","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100608322","display_name":"Lingyun Wang","orcid":"https://orcid.org/0000-0002-3786-3905"},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Lingyun Wang","raw_affiliation_strings":["Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, Fujian, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, Fujian, China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038588244","display_name":"Yibo Zeng","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yibo Zeng","raw_affiliation_strings":["Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, Fujian, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, Fujian, China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5107835478","display_name":"Wenwang Li","orcid":"https://orcid.org/0009-0002-2629-9613"},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenwang Li","raw_affiliation_strings":["Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, Fujian, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, Fujian, China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113664117","display_name":"Daoheng Sun","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Daoheng Sun","raw_affiliation_strings":["Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, Fujian, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, Fujian, China","institution_ids":["https://openalex.org/I191208505"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5100608322"],"corresponding_institution_ids":["https://openalex.org/I191208505"],"apc_list":null,"apc_paid":null,"fwci":0.3041,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.6667071,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"156","last_page":"159"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11272","display_name":"Nanowire Synthesis and Applications","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8495540618896484},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7413877844810486},{"id":"https://openalex.org/keywords/ultrasonic-sensor","display_name":"Ultrasonic sensor","score":0.6657174825668335},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.6585819721221924},{"id":"https://openalex.org/keywords/anodic-bonding","display_name":"Anodic bonding","score":0.6110875606536865},{"id":"https://openalex.org/keywords/gyroscope","display_name":"Gyroscope","score":0.5758081674575806},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.5380041599273682},{"id":"https://openalex.org/keywords/surface-roughness","display_name":"Surface roughness","score":0.5161929726600647},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4881749749183655},{"id":"https://openalex.org/keywords/surface-finish","display_name":"Surface finish","score":0.4789486527442932},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.4645499885082245},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3453139662742615},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.13879171013832092},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.0846705436706543},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.07286655902862549}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8495540618896484},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7413877844810486},{"id":"https://openalex.org/C81288441","wikidata":"https://www.wikidata.org/wiki/Q20736125","display_name":"Ultrasonic sensor","level":2,"score":0.6657174825668335},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.6585819721221924},{"id":"https://openalex.org/C201414436","wikidata":"https://www.wikidata.org/wiki/Q567503","display_name":"Anodic bonding","level":3,"score":0.6110875606536865},{"id":"https://openalex.org/C158488048","wikidata":"https://www.wikidata.org/wiki/Q483400","display_name":"Gyroscope","level":2,"score":0.5758081674575806},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5380041599273682},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.5161929726600647},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4881749749183655},{"id":"https://openalex.org/C71039073","wikidata":"https://www.wikidata.org/wiki/Q3439090","display_name":"Surface finish","level":2,"score":0.4789486527442932},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.4645499885082245},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3453139662742615},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.13879171013832092},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0846705436706543},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.07286655902862549},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2009.5068548","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2009.5068548","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320325434","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1639777823","https://openalex.org/W1974439509","https://openalex.org/W1990370600","https://openalex.org/W2001476809","https://openalex.org/W2021059758","https://openalex.org/W2039095678","https://openalex.org/W2091467685","https://openalex.org/W2114766284","https://openalex.org/W2134732074","https://openalex.org/W2147628985","https://openalex.org/W6681965701"],"related_works":["https://openalex.org/W1889129279","https://openalex.org/W4387451989","https://openalex.org/W2532412374","https://openalex.org/W4362730893","https://openalex.org/W2357965514","https://openalex.org/W2103548986","https://openalex.org/W2046355759","https://openalex.org/W2588244836","https://openalex.org/W161822665","https://openalex.org/W2113780364"],"abstract_inverted_index":{"The":[0,76],"etch-back":[1,56],"of":[2,33,55,96,110],"anodic":[3],"bonded":[4],"silicon-on-glass":[5,22],"wafer":[6,39],"using":[7],"ultrasonic":[8,46,73,111],"agitation":[9,112],"to":[10,126],"obtain":[11],"uniform":[12],"silicon":[13,105],"film":[14],"and":[15,64,117,124],"good":[16],"surface":[17,65],"finish":[18],"in":[19,28,130],"deeply":[20],"dissolved":[21],"(DDSOG)":[23],"process":[24,132],"has":[25,49],"been":[26,41,50],"studied":[27],"KOH":[29],"solution.":[30],"Etch-back":[31],"characteristics":[32,54],"p-type":[34],"(100)":[35],"4":[36],"inch":[37],"SOG":[38],"have":[40],"explored":[42],"under":[43,70],"the":[44,53,59,84,88,119],"different":[45],"power.":[47],"It":[48],"observed":[51,123],"that":[52],"such":[57,113],"as":[58,114],"etch":[60,62],"rate,":[61],"uniformity":[63,78],"roughness":[66,90],"were":[67],"evidently":[68],"improved":[69],"120":[71],"W":[72],"power":[74],"agitation.":[75],"etching":[77],"was":[79,99,149],"less":[80],"than":[81],"plusmn1%":[82],"on":[83],"whole":[85],"wafer.":[86],"And":[87],"root-mean-square":[89],"(R":[91],"<sub":[92],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[93],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">rms</sub>":[94],")":[95],"20.6":[97],"nm":[98],"achieved":[100],"after":[101],"360":[102],"mum":[103,146],"thickness":[104,147],"being":[106],"etched.":[107],"Some":[108],"shortcomings":[109],"damaging":[115],"membrane":[116],"reducing":[118],"bonding":[120],"intensity":[121],"are":[122],"how":[125],"overcome":[127],"these":[128],"disadvantages":[129],"DDSOG":[131],"is":[133],"also":[134],"discussed.":[135],"Using":[136],"this":[137],"technology,":[138],"a":[139],"tunneling":[140],"gyroscope":[141],"with":[142],"an":[143],"out-of-plane,":[144],"30":[145],"beam":[148],"successfully":[150],"fabricated.":[151]},"counts_by_year":[],"updated_date":"2026-03-25T13:04:00.132906","created_date":"2025-10-10T00:00:00"}