{"id":"https://openalex.org/W2106809680","doi":"https://doi.org/10.1109/nems.2009.5068533","title":"Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration","display_name":"Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W2106809680","doi":"https://doi.org/10.1109/nems.2009.5068533","mag":"2106809680"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2009.5068533","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2009.5068533","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5051825160","display_name":"Min Miao","orcid":"https://orcid.org/0000-0001-8205-6419"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I78675632","display_name":"Beijing Information Science & Technology University","ror":"https://ror.org/04xnqep60","country_code":"CN","type":"education","lineage":["https://openalex.org/I78675632"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Min Miao","raw_affiliation_strings":["Information and Telecom Engineering Dept., Beijing Information Science and Technology University, Beijing, China","National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Information and Telecom Engineering Dept., Beijing Information Science and Technology University, Beijing, China","institution_ids":["https://openalex.org/I78675632"]},{"raw_affiliation_string":"National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102422388","display_name":"Yufeng Jin","orcid":"https://orcid.org/0009-0002-9038-0248"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yufeng Jin","raw_affiliation_strings":["National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091406049","display_name":"Hongguang Liao","orcid":"https://orcid.org/0000-0002-0169-4046"},"institutions":[{"id":"https://openalex.org/I4210128628","display_name":"Peking University Shenzhen Hospital","ror":"https://ror.org/03kkjyb15","country_code":"CN","type":"healthcare","lineage":["https://openalex.org/I4210128628"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hongguang Liao","raw_affiliation_strings":["Shenzhen Graduate School of Peking University, Shenzhen, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shenzhen Graduate School of Peking University, Shenzhen, China","institution_ids":["https://openalex.org/I4210128628"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102190762","display_name":"Liwei Zhao","orcid":null},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liwei Zhao","raw_affiliation_strings":["National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101518464","display_name":"Yunhui Zhu","orcid":"https://orcid.org/0000-0002-5336-1227"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yunhui Zhu","raw_affiliation_strings":["National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110268983","display_name":"Xin Sun","orcid":"https://orcid.org/0009-0002-6499-3868"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xin Sun","raw_affiliation_strings":["National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5087908324","display_name":"Yunxia Guo","orcid":"https://orcid.org/0000-0002-4974-6642"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yunxia Guo","raw_affiliation_strings":["National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Micro/Nano Fabrication Technology, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"90","last_page":"93"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.6237099766731262},{"id":"https://openalex.org/keywords/microsystem","display_name":"Microsystem","score":0.5873845219612122},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5482524037361145},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5441747903823853},{"id":"https://openalex.org/keywords/system-in-package","display_name":"System in package","score":0.487865686416626},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4790954887866974},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.4708276093006134},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.45390215516090393},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.4290342926979065},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.4267970025539398},{"id":"https://openalex.org/keywords/vhdl-ams","display_name":"VHDL-AMS","score":0.4244469404220581},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4140045642852783},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3864624500274658},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.326285719871521},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.294217586517334},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27348989248275757},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.26671093702316284},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.2491527795791626},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.21155676245689392}],"concepts":[{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.6237099766731262},{"id":"https://openalex.org/C151054161","wikidata":"https://www.wikidata.org/wiki/Q379385","display_name":"Microsystem","level":2,"score":0.5873845219612122},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5482524037361145},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5441747903823853},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.487865686416626},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4790954887866974},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.4708276093006134},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.45390215516090393},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.4290342926979065},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.4267970025539398},{"id":"https://openalex.org/C2776513426","wikidata":"https://www.wikidata.org/wiki/Q2744740","display_name":"VHDL-AMS","level":4,"score":0.4244469404220581},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4140045642852783},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3864624500274658},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.326285719871521},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.294217586517334},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27348989248275757},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.26671093702316284},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2491527795791626},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.21155676245689392},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C42935608","wikidata":"https://www.wikidata.org/wiki/Q190411","display_name":"Field-programmable gate array","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C42143788","wikidata":"https://www.wikidata.org/wiki/Q173341","display_name":"Hardware description language","level":3,"score":0.0},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2009.5068533","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2009.5068533","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.44999998807907104}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1970819096","https://openalex.org/W1988715457","https://openalex.org/W2090551936","https://openalex.org/W2158942937","https://openalex.org/W2161555133"],"related_works":["https://openalex.org/W274763344","https://openalex.org/W1514903510","https://openalex.org/W1515979396","https://openalex.org/W1636281465","https://openalex.org/W192636932","https://openalex.org/W2163891117","https://openalex.org/W2003632191","https://openalex.org/W2062396011","https://openalex.org/W2038246670","https://openalex.org/W2070149802"],"abstract_inverted_index":{"This":[0],"paper":[1],"reports":[2],"the":[3,9,19,62,109,112],"designing/simulation":[4],"and":[5,38,80,129],"experimental":[6],"investigation":[7],"into":[8],"Deep":[10],"RIE-based":[11],"micro-fabrication":[12],"of":[13,61,77,111,114],"through-Si-via":[14],"(TSV)":[15],"which":[16],"acts":[17],"as":[18],"vital":[20],"vertical":[21],"interconnect":[22],"for":[23,48,74,83,97,108],"compact":[24],"3-D":[25,115],"system-in-package":[26],"integration.":[27],"An":[28],"in-house":[29],"developed":[30],"process":[31,67],"simulator":[32,63],"based":[33,117],"on":[34],"cell/string":[35],"evolution":[36],"algorithm":[37],"physical":[39],"modeling":[40],"is":[41,64,95],"used":[42],"to":[43],"explore":[44],"suitable":[45],"DRIE":[46],"conditions":[47],"drilling":[49],"vias":[50],"with":[51,56,66,88,124],"various":[52],"sections,":[53],"especially":[54],"those":[55],"tapered":[57],"profile.":[58],"The":[59,102],"effectiveness":[60],"verified":[65],"trials.":[68],"Optimal":[69],"deposition":[70],"parameters":[71],"are":[72],"obtained":[73],"conformal":[75],"formation":[76],"insulation,":[78],"barrier":[79],"seed":[81],"layers":[82],"electro-plating":[84],"via":[85],"filling.":[86,101],"Combined":[87],"additives,":[89],"Periodic":[90],"Pulse":[91],"Reverse":[92],"current":[93],"plating":[94],"utilized":[96],"satisfying":[98],"bottom-up":[99],"blind-via":[100],"research":[103],"have":[104],"laid":[105],"firm":[106],"groundwork":[107],"demonstration":[110],"prospect":[113],"packaging":[116],"microsystem":[118],"integration,":[119],"combining":[120],"heterogeneous":[121],"micro/nano":[122],"devices":[123],"ICs,":[125],"in":[126],"consumer,":[127],"industrial":[128],"defense":[130],"electronics.":[131]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2016,"cited_by_count":2},{"year":2014,"cited_by_count":2},{"year":2012,"cited_by_count":7}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}