{"id":"https://openalex.org/W2068507054","doi":"https://doi.org/10.1109/nems.2009.5068526","title":"The analysis and structural design of micro SOI pressure sensors","display_name":"The analysis and structural design of micro SOI pressure sensors","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W2068507054","doi":"https://doi.org/10.1109/nems.2009.5068526","mag":"2068507054"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2009.5068526","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2009.5068526","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085821286","display_name":"Bian Tian","orcid":"https://orcid.org/0000-0001-5484-8363"},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Bian Tian","raw_affiliation_strings":["Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","institution_ids":[]},{"raw_affiliation_string":"State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China","institution_ids":["https://openalex.org/I87445476"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056618863","display_name":"Yulong Zhao","orcid":"https://orcid.org/0000-0001-9186-3204"},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yulong Zhao","raw_affiliation_strings":["Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","institution_ids":[]},{"raw_affiliation_string":"State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China","institution_ids":["https://openalex.org/I87445476"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062577404","display_name":"Zhuangde Jiang","orcid":"https://orcid.org/0000-0002-8452-6768"},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhuangde Jiang","raw_affiliation_strings":["Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","institution_ids":[]},{"raw_affiliation_string":"State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China","institution_ids":["https://openalex.org/I87445476"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100450721","display_name":"Ling Zhang","orcid":"https://orcid.org/0000-0001-8206-3408"},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ling Zhang","raw_affiliation_strings":["Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","institution_ids":[]},{"raw_affiliation_string":"State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China","institution_ids":["https://openalex.org/I87445476"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015094815","display_name":"Nansheng Liao","orcid":"https://orcid.org/0000-0002-0735-0500"},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Nansheng Liao","raw_affiliation_strings":["Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","institution_ids":[]},{"raw_affiliation_string":"State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China","institution_ids":["https://openalex.org/I87445476"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073779383","display_name":"Yuanhao Liu","orcid":"https://orcid.org/0000-0001-6375-7789"},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuanhao Liu","raw_affiliation_strings":["Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","institution_ids":[]},{"raw_affiliation_string":"State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China","institution_ids":["https://openalex.org/I87445476"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5071976013","display_name":"Chao Meng","orcid":"https://orcid.org/0000-0002-2126-6954"},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chao Meng","raw_affiliation_strings":["Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mechanical Manufacturing System, Institute of Precision Engineering, Jiao Tong University, China","institution_ids":[]},{"raw_affiliation_string":"State Key Laboratory for Mechanical Manufacturing System, Institute of Precision Engineering, Xi'an, Jiaotong University, 710049, China","institution_ids":["https://openalex.org/I87445476"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5085821286"],"corresponding_institution_ids":["https://openalex.org/I87445476"],"apc_list":null,"apc_paid":null,"fwci":1.2204,"has_fulltext":false,"cited_by_count":13,"citation_normalized_percentile":{"value":0.8070383,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"55","last_page":"58"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.9149219393730164},{"id":"https://openalex.org/keywords/piezoresistive-effect","display_name":"Piezoresistive effect","score":0.8515129685401917},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7247085571289062},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6769976615905762},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6590396165847778},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.6565920114517212},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.65607750415802},{"id":"https://openalex.org/keywords/sensitivity","display_name":"Sensitivity (control systems)","score":0.5593711137771606},{"id":"https://openalex.org/keywords/pressure-sensor","display_name":"Pressure sensor","score":0.5349147915840149},{"id":"https://openalex.org/keywords/anisotropy","display_name":"Anisotropy","score":0.48127907514572144},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4778725206851959},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.4621933102607727},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.430507630109787},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.42907586693763733},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.4230608642101288},{"id":"https://openalex.org/keywords/diaphragm","display_name":"Diaphragm (acoustics)","score":0.41372811794281006},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.2904950976371765},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.1925138533115387},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.17291322350502014},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1508128046989441},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.1358279287815094},{"id":"https://openalex.org/keywords/vibration","display_name":"Vibration","score":0.1269797682762146},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.11848026514053345},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.0646410584449768}],"concepts":[{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.9149219393730164},{"id":"https://openalex.org/C198490522","wikidata":"https://www.wikidata.org/wiki/Q1932915","display_name":"Piezoresistive effect","level":2,"score":0.8515129685401917},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7247085571289062},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6769976615905762},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6590396165847778},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.6565920114517212},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.65607750415802},{"id":"https://openalex.org/C21200559","wikidata":"https://www.wikidata.org/wiki/Q7451068","display_name":"Sensitivity (control systems)","level":2,"score":0.5593711137771606},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.5349147915840149},{"id":"https://openalex.org/C85725439","wikidata":"https://www.wikidata.org/wiki/Q466686","display_name":"Anisotropy","level":2,"score":0.48127907514572144},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4778725206851959},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.4621933102607727},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.430507630109787},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.42907586693763733},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.4230608642101288},{"id":"https://openalex.org/C164292776","wikidata":"https://www.wikidata.org/wiki/Q5271779","display_name":"Diaphragm (acoustics)","level":3,"score":0.41372811794281006},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.2904950976371765},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1925138533115387},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.17291322350502014},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1508128046989441},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.1358279287815094},{"id":"https://openalex.org/C198394728","wikidata":"https://www.wikidata.org/wiki/Q3695508","display_name":"Vibration","level":2,"score":0.1269797682762146},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.11848026514053345},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0646410584449768},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2009.5068526","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2009.5068526","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6000000238418579,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1997569429","https://openalex.org/W2082031831","https://openalex.org/W2110014151","https://openalex.org/W2119335613","https://openalex.org/W2127209667","https://openalex.org/W2373012297"],"related_works":["https://openalex.org/W4239023021","https://openalex.org/W2911329264","https://openalex.org/W1967579400","https://openalex.org/W1998236707","https://openalex.org/W4381745617","https://openalex.org/W4225089255","https://openalex.org/W3007811894","https://openalex.org/W2368943318","https://openalex.org/W2761655050","https://openalex.org/W2094335211"],"abstract_inverted_index":{"A":[0],"kind":[1,66,89],"of":[2,27,36,59,64,67,90],"micro":[3],"piezoresistive":[4,69],"pressure":[5],"sensor":[6],"with":[7],"stable":[8],"performances":[9],"under":[10],"high":[11,52,102],"temperature":[12,53,75,104],"is":[13,84],"designed":[14],"based":[15],"on":[16,19,43],"the":[17,24,34,57,82],"silicon":[18],"insulator":[20],"(SOI).":[21],"Through":[22],"analyzing":[23],"stress":[25],"distribution":[26],"diaphragm":[28],"by":[29],"finite":[30],"element":[31],"method":[32],"(FEM),":[33],"model":[35],"structure":[37],"was":[38],"established.":[39],"The":[40,78],"fabrication":[41],"operated":[42],"SOI":[44,68],"wafer,":[45],"which":[46],"can":[47],"be":[48],"used":[49],"in":[50],"extreme":[51],"environments,":[54],"and":[55,74,106],"applied":[56],"technology":[58],"anisotropy":[60],"chemical":[61],"etching.":[62],"Performances":[63],"this":[65,88],"sensor,":[70],"including":[71],"size,":[72,96],"sensitivity,":[73,103],"were":[76],"investigated.":[77],"result":[79],"shows":[80],"that":[81],"precision":[83],"0.57%":[85],"FS.":[86],"Therefore,":[87],"design":[91],"not":[92],"only":[93],"has":[94,101],"smaller":[95],"simplicity":[97],"preparation":[98],"but":[99],"also":[100],"coefficient":[105],"accuracy.":[107]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-05-05T08:41:31.759640","created_date":"2025-10-10T00:00:00"}