{"id":"https://openalex.org/W4402727811","doi":"https://doi.org/10.1109/mwscas60917.2024.10658720","title":"Sub-THz Integrated Circuits: Challenges and Opportunities","display_name":"Sub-THz Integrated Circuits: Challenges and Opportunities","publication_year":2024,"publication_date":"2024-08-11","ids":{"openalex":"https://openalex.org/W4402727811","doi":"https://doi.org/10.1109/mwscas60917.2024.10658720"},"language":"en","primary_location":{"id":"doi:10.1109/mwscas60917.2024.10658720","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/mwscas60917.2024.10658720","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5014516145","display_name":"A. Banerjee","orcid":"https://orcid.org/0000-0001-7671-9669"},"institutions":[{"id":"https://openalex.org/I39422238","display_name":"University of Illinois Chicago","ror":"https://ror.org/02mpq6x41","country_code":"US","type":"education","lineage":["https://openalex.org/I39422238"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Aritra Banerjee","raw_affiliation_strings":["University of Illinois Chicago,Department of Electrical and Computer Engineering,Chicago,Illinois,USA,60607"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Illinois Chicago,Department of Electrical and Computer Engineering,Chicago,Illinois,USA,60607","institution_ids":["https://openalex.org/I39422238"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5014516145"],"corresponding_institution_ids":["https://openalex.org/I39422238"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"764","last_page":"768"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11803","display_name":"Superconducting and THz Device Technology","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/3103","display_name":"Astronomy and Astrophysics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/terahertz-radiation","display_name":"Terahertz radiation","score":0.6182741522789001},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.564306914806366},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.47597187757492065},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4661693871021271},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.361444890499115},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3610149025917053},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3262978494167328},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.25668710470199585},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18245524168014526}],"concepts":[{"id":"https://openalex.org/C107816215","wikidata":"https://www.wikidata.org/wiki/Q647887","display_name":"Terahertz radiation","level":2,"score":0.6182741522789001},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.564306914806366},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.47597187757492065},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4661693871021271},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.361444890499115},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3610149025917053},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3262978494167328},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.25668710470199585},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18245524168014526}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mwscas60917.2024.10658720","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/mwscas60917.2024.10658720","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":60,"referenced_works":["https://openalex.org/W321215454","https://openalex.org/W1644985135","https://openalex.org/W1648168223","https://openalex.org/W1997684229","https://openalex.org/W1998340256","https://openalex.org/W2017358755","https://openalex.org/W2026869690","https://openalex.org/W2032262202","https://openalex.org/W2056674558","https://openalex.org/W2077567523","https://openalex.org/W2150095727","https://openalex.org/W2152016785","https://openalex.org/W2188438365","https://openalex.org/W2477696862","https://openalex.org/W2520264874","https://openalex.org/W2526253744","https://openalex.org/W2582457364","https://openalex.org/W2583356736","https://openalex.org/W2583697675","https://openalex.org/W2610194370","https://openalex.org/W2744381322","https://openalex.org/W2783301227","https://openalex.org/W2885034942","https://openalex.org/W2887540436","https://openalex.org/W2898893121","https://openalex.org/W2902821083","https://openalex.org/W2921422139","https://openalex.org/W2924115410","https://openalex.org/W2955897898","https://openalex.org/W2983659745","https://openalex.org/W3004408435","https://openalex.org/W3016043301","https://openalex.org/W3019811968","https://openalex.org/W3048058122","https://openalex.org/W3091981430","https://openalex.org/W3093809857","https://openalex.org/W3125284724","https://openalex.org/W3161389208","https://openalex.org/W3196554860","https://openalex.org/W3209581628","https://openalex.org/W4210784215","https://openalex.org/W4210921952","https://openalex.org/W4220813314","https://openalex.org/W4226018536","https://openalex.org/W4254692476","https://openalex.org/W4280630878","https://openalex.org/W4285047753","https://openalex.org/W4293519274","https://openalex.org/W4297099715","https://openalex.org/W4308069503","https://openalex.org/W4310054369","https://openalex.org/W4317793308","https://openalex.org/W4322577872","https://openalex.org/W4323022442","https://openalex.org/W4385192441","https://openalex.org/W4387415123","https://openalex.org/W4388270716","https://openalex.org/W4388623751","https://openalex.org/W4391892591","https://openalex.org/W6638196047"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2033952283","https://openalex.org/W2762687161","https://openalex.org/W2353254830","https://openalex.org/W2351210568","https://openalex.org/W2028421553","https://openalex.org/W2890072373","https://openalex.org/W3215142653","https://openalex.org/W4241196849","https://openalex.org/W1487051936"],"abstract_inverted_index":{"Integrated":[0],"circuits":[1],"(ICs)":[2],"at":[3],"sub-terahertz":[4],"(sub-THz)":[5],"frequencies":[6],"can":[7],"enable":[8],"many":[9],"applications":[10,41],"including":[11],"high":[12,18],"data":[13],"rate":[14],"wireless":[15],"communication":[16],"and":[17,29,33,45,53,63],"resolution":[19],"radar.":[20],"This":[21],"paper":[22],"reviews":[23],"recent":[24],"advances":[25],"in":[26,48,65],"sub-THz":[27,40,60],"ICs":[28],"discusses":[30],"different":[31,66],"challenges":[32],"opportunities.":[34],"Comparisons":[35],"of":[36,59],"IC":[37],"technologies":[38,67],"for":[39],"are":[42,55,68],"presented.":[43],"Challenges":[44],"advanced":[46],"techniques":[47],"modeling,":[49],"circuits,":[50],"systems,":[51],"packaging,":[52],"measurements":[54],"shown.":[56],"State-of-the-art":[57],"implementations":[58],"power":[61],"amplifiers":[62],"transceivers":[64],"also":[69],"discussed.":[70]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}