{"id":"https://openalex.org/W4391382625","doi":"https://doi.org/10.1109/mwscas57524.2023.10406141","title":"A Compact and Accurate MOS-based Temperature Sensor for Thermal Management","display_name":"A Compact and Accurate MOS-based Temperature Sensor for Thermal Management","publication_year":2023,"publication_date":"2023-08-06","ids":{"openalex":"https://openalex.org/W4391382625","doi":"https://doi.org/10.1109/mwscas57524.2023.10406141"},"language":"en","primary_location":{"id":"doi:10.1109/mwscas57524.2023.10406141","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mwscas57524.2023.10406141","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5014077604","display_name":"Ruohan Yang","orcid":"https://orcid.org/0000-0003-0279-7212"},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ruohan Yang","raw_affiliation_strings":["Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA","Department of Electrical and Computer Engineering, Iowa State University, Iowa, USA"],"affiliations":[{"raw_affiliation_string":"Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA","institution_ids":["https://openalex.org/I173911158"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Iowa, USA","institution_ids":["https://openalex.org/I173911158"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035794838","display_name":"Bryce Gadogbe","orcid":"https://orcid.org/0009-0004-9930-0894"},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bryce Gadogbe","raw_affiliation_strings":["Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA","Department of Electrical and Computer Engineering, Iowa State University, Iowa, USA"],"affiliations":[{"raw_affiliation_string":"Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA","institution_ids":["https://openalex.org/I173911158"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Iowa, USA","institution_ids":["https://openalex.org/I173911158"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108357375","display_name":"R.L. Geiger","orcid":null},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Randall L. Geiger","raw_affiliation_strings":["Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA","Department of Electrical and Computer Engineering, Iowa State University, Iowa, USA"],"affiliations":[{"raw_affiliation_string":"Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA","institution_ids":["https://openalex.org/I173911158"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Iowa, USA","institution_ids":["https://openalex.org/I173911158"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101873076","display_name":"Degang Chen","orcid":"https://orcid.org/0000-0002-5938-6329"},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Degang Chen","raw_affiliation_strings":["Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA","Department of Electrical and Computer Engineering, Iowa State University, Iowa, USA"],"affiliations":[{"raw_affiliation_string":"Iowa State University,Department of Electrical and Computer Engineering,Iowa,USA","institution_ids":["https://openalex.org/I173911158"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Iowa, USA","institution_ids":["https://openalex.org/I173911158"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5014077604"],"corresponding_institution_ids":["https://openalex.org/I173911158"],"apc_list":null,"apc_paid":null,"fwci":0.5326,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.6194012,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"594","last_page":"598"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.7821999788284302,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.7821999788284302,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.6973000168800354,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.6958000063896179,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.7053990960121155},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5229999423027039},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.5114699602127075},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4946736991405487},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4518444538116455},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.440673291683197},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.33828842639923096},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.19067472219467163},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16918644309043884},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.14646896719932556},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.07797577977180481}],"concepts":[{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.7053990960121155},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5229999423027039},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.5114699602127075},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4946736991405487},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4518444538116455},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.440673291683197},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.33828842639923096},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.19067472219467163},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16918644309043884},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.14646896719932556},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.07797577977180481}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mwscas57524.2023.10406141","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mwscas57524.2023.10406141","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.75,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1506245543","https://openalex.org/W1932208055","https://openalex.org/W1968417187","https://openalex.org/W1969794630","https://openalex.org/W1983466643","https://openalex.org/W2005390090","https://openalex.org/W2030049410","https://openalex.org/W2086202544","https://openalex.org/W2129021068","https://openalex.org/W2133201500","https://openalex.org/W2523775370","https://openalex.org/W2790039338","https://openalex.org/W2794038749","https://openalex.org/W2895608533","https://openalex.org/W2897048066","https://openalex.org/W2946134567","https://openalex.org/W2951966032","https://openalex.org/W2990976435","https://openalex.org/W3015637263","https://openalex.org/W3022434015","https://openalex.org/W3092394966","https://openalex.org/W4210581725"],"related_works":["https://openalex.org/W2371237473","https://openalex.org/W1986859584","https://openalex.org/W4385859326","https://openalex.org/W4283264975","https://openalex.org/W4251379543","https://openalex.org/W2888620174","https://openalex.org/W2790704114","https://openalex.org/W3014461567","https://openalex.org/W2086636458","https://openalex.org/W4390188998"],"abstract_inverted_index":{"A":[0,54],"compact":[1],"MOS-based":[2],"temperature":[3,18,34,45,55,108],"sensor":[4,35,68,109],"is":[5,36,58,76,110],"designed":[6,59],"for":[7,24],"on-chip":[8],"thermal":[9,25],"sensing":[10,29,100],"with":[11,83],"extremely":[12],"high":[13],"accuracy":[14],"over":[15],"the":[16,32,44,48,72,106],"critical":[17],"range":[19],"(75\u00b0C":[20],"to":[21,51,60,69,114,120],"95\u00b0C)":[22],"required":[23],"management":[26],"applications.":[27],"The":[28,74,102],"element":[30],"of":[31,47,66,93,105],"proposed":[33,107],"a":[37,84],"single":[38],"diode":[39],"connected":[40],"NMOS":[41],"transistor":[42],"using":[43],"dependence":[46],"threshold":[49],"voltage":[50,88],"sense":[52],"temperature.":[53],"measurement":[56],"system":[57],"combine":[61],"correlated":[62],"multiple":[63],"output":[64],"voltages":[65],"each":[67],"significantly":[70],"improve":[71],"accuracy.":[73],"circuit":[75],"implemented":[77],"in":[78],"TSMC":[79],"180":[80],"nm":[81],"process":[82],"1.8":[85],"V":[86],"supply":[87],"and":[89,116],"requires":[90],"an":[91],"area":[92],"32":[94],"\u03bcm":[95],"<sup":[96],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[97],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[98],"per":[99],"unit.":[101],"worst-case":[103],"inaccuracy":[104],"+0.09\u00b0C/\u22120.1\u00b0C":[111],"from":[112,118],"75\u00b0C":[113],"95\u00b0C":[115],"+0.6\u00b0C/\u22120.4\u00b0C":[117],"\u221220\u00b0C":[119],"120\u00b0C.":[121]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}