{"id":"https://openalex.org/W2760738388","doi":"https://doi.org/10.1109/mwscas.2017.8053012","title":"Self-powered system-on-chip for substrate computing and ultrasonic communications","display_name":"Self-powered system-on-chip for substrate computing and ultrasonic communications","publication_year":2017,"publication_date":"2017-08-01","ids":{"openalex":"https://openalex.org/W2760738388","doi":"https://doi.org/10.1109/mwscas.2017.8053012","mag":"2760738388"},"language":"en","primary_location":{"id":"doi:10.1109/mwscas.2017.8053012","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mwscas.2017.8053012","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5065404274","display_name":"Yarub Alazzawi","orcid":"https://orcid.org/0000-0002-8173-3374"},"institutions":[{"id":"https://openalex.org/I204465549","display_name":"Washington University in St. Louis","ror":"https://ror.org/01yc7t268","country_code":"US","type":"education","lineage":["https://openalex.org/I204465549"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Yarub Alazzawi","raw_affiliation_strings":["Department of Electrical and Systems Engineering, Washington University in St. Louis, Saint Louis, MO, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Systems Engineering, Washington University in St. Louis, Saint Louis, MO, USA","institution_ids":["https://openalex.org/I204465549"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5034498144","display_name":"Shantanu Chakrabartty","orcid":"https://orcid.org/0000-0002-1688-6286"},"institutions":[{"id":"https://openalex.org/I204465549","display_name":"Washington University in St. Louis","ror":"https://ror.org/01yc7t268","country_code":"US","type":"education","lineage":["https://openalex.org/I204465549"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shantanu Chakrabartty","raw_affiliation_strings":["Department of Electrical and Systems Engineering, Washington University in St. Louis, Saint Louis, MO, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Systems Engineering, Washington University in St. Louis, Saint Louis, MO, USA","institution_ids":["https://openalex.org/I204465549"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5065404274"],"corresponding_institution_ids":["https://openalex.org/I204465549"],"apc_list":null,"apc_paid":null,"fwci":0.43,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.65687697,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"671","last_page":"674"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11392","display_name":"Energy Harvesting in Wireless Networks","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11392","display_name":"Energy Harvesting in Wireless Networks","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11230","display_name":"Innovative Energy Harvesting Technologies","score":0.9940000176429749,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":0.989300012588501,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.8819063901901245},{"id":"https://openalex.org/keywords/energy-harvesting","display_name":"Energy harvesting","score":0.7387576103210449},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.6363762617111206},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.626343846321106},{"id":"https://openalex.org/keywords/ultrasonic-sensor","display_name":"Ultrasonic sensor","score":0.5494363903999329},{"id":"https://openalex.org/keywords/chassis","display_name":"Chassis","score":0.499143123626709},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.48626554012298584},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4588696360588074},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.44526782631874084},{"id":"https://openalex.org/keywords/piezoelectricity","display_name":"Piezoelectricity","score":0.43975651264190674},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.4298505187034607},{"id":"https://openalex.org/keywords/energy","display_name":"Energy (signal processing)","score":0.39365315437316895},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.38573750853538513},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.34120339155197144},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3301117420196533},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3167542815208435},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.2757505774497986},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.1813197135925293},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.12665534019470215},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.11322584748268127}],"concepts":[{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.8819063901901245},{"id":"https://openalex.org/C101518730","wikidata":"https://www.wikidata.org/wiki/Q930236","display_name":"Energy harvesting","level":3,"score":0.7387576103210449},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.6363762617111206},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.626343846321106},{"id":"https://openalex.org/C81288441","wikidata":"https://www.wikidata.org/wiki/Q20736125","display_name":"Ultrasonic sensor","level":2,"score":0.5494363903999329},{"id":"https://openalex.org/C512993513","wikidata":"https://www.wikidata.org/wiki/Q1068107","display_name":"Chassis","level":2,"score":0.499143123626709},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48626554012298584},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4588696360588074},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.44526782631874084},{"id":"https://openalex.org/C100082104","wikidata":"https://www.wikidata.org/wiki/Q183759","display_name":"Piezoelectricity","level":2,"score":0.43975651264190674},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.4298505187034607},{"id":"https://openalex.org/C186370098","wikidata":"https://www.wikidata.org/wiki/Q442787","display_name":"Energy (signal processing)","level":2,"score":0.39365315437316895},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.38573750853538513},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.34120339155197144},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3301117420196533},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3167542815208435},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2757505774497986},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.1813197135925293},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12665534019470215},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.11322584748268127},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mwscas.2017.8053012","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mwscas.2017.8053012","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8199999928474426,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2388588277","https://openalex.org/W2509476952","https://openalex.org/W2527978247","https://openalex.org/W6727589315"],"related_works":["https://openalex.org/W2378268140","https://openalex.org/W2059239878","https://openalex.org/W2935843774","https://openalex.org/W2051851664","https://openalex.org/W2658066576","https://openalex.org/W1069034051","https://openalex.org/W2364297307","https://openalex.org/W4285723892","https://openalex.org/W2328317394","https://openalex.org/W3036249939"],"abstract_inverted_index":{"Substrate":[0],"computing":[1],"refers":[2],"to":[3,135,156],"a":[4,20,26,33,64,124,136,158],"paradigm":[5],"where":[6],"sensing,":[7],"computing,":[8,40],"communications,":[9],"energy":[10,13,43,93],"scavenging":[11,44],"and":[12,38,42,91,100,109],"storage":[14],"functions":[15,45,154],"are":[16,105,133],"seamlessly":[17],"integrated":[18,128],"within":[19],"substrate.":[21,55],"The":[22,77,142],"substrate":[23,99,162],"could":[24,46,68],"be":[25,47,69],"part":[27],"of":[28,35,63,80,85,119,138],"an":[29,139],"aircraft":[30],"wing":[31],"or":[32],"chassis":[34],"the":[36,39,54,61,98,101,120,145,151],"car":[37],"communications":[41,73],"implemented":[48],"using":[49,74,117],"self-powered":[50],"devices":[51],"embedded":[52],"inside":[53],"In":[56],"this":[57],"paper":[58],"we":[59],"present":[60,114],"design":[62],"CMOS":[65,126],"transceiver":[66,78,121,160],"that":[67,132],"used":[70,88,106],"for":[71,89,107,161],"through-substrate":[72],"ultrasonic":[75,111],"pulses.":[76,112],"comprises":[79],"three":[81],"piezoelectric":[82,130],"interfaces,":[83],"one":[84],"which":[86],"is":[87],"harvesting":[90],"regulating":[92],"from":[94],"mechanical":[95],"vibrations":[96],"in":[97,123],"other":[102],"two":[103],"interfaces":[104],"transmitting":[108],"receiving":[110],"We":[113],"measurement":[115],"results":[116,143],"prototypes":[118],"fabricated":[122],"0.5-\u03bcm":[125],"process":[127],"with":[129,150],"transducers":[131],"attached":[134],"segment":[137],"aluminum":[140],"wing.":[141],"demonstrate":[144],"energy-harvesting,":[146],"regulation":[147],"functionalities":[148],"along":[149],"bi-directional":[152],"telemetry":[153],"needed":[155],"implement":[157],"complete":[159],"computing.":[163]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}