{"id":"https://openalex.org/W2046157563","doi":"https://doi.org/10.1109/mwscas.2014.6908433","title":"A novel readout circuit for on-sensor multispectral classification","display_name":"A novel readout circuit for on-sensor multispectral classification","publication_year":2014,"publication_date":"2014-08-01","ids":{"openalex":"https://openalex.org/W2046157563","doi":"https://doi.org/10.1109/mwscas.2014.6908433","mag":"2046157563"},"language":"en","primary_location":{"id":"doi:10.1109/mwscas.2014.6908433","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mwscas.2014.6908433","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 57th International Midwest Symposium on Circuits and Systems (MWSCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5050208286","display_name":"Javad Ghasemi","orcid":"https://orcid.org/0000-0001-5895-8308"},"institutions":[{"id":"https://openalex.org/I169521973","display_name":"University of New Mexico","ror":"https://ror.org/05fs6jp91","country_code":"US","type":"education","lineage":["https://openalex.org/I169521973"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Javad Ghasemi","raw_affiliation_strings":["ECE Department, University of New Mexico, Albuquerque, NM","Center for High Technology Materials, ECE Department, University of New Mexico, Albuquerque, 87185, USA"],"affiliations":[{"raw_affiliation_string":"ECE Department, University of New Mexico, Albuquerque, NM","institution_ids":["https://openalex.org/I169521973"]},{"raw_affiliation_string":"Center for High Technology Materials, ECE Department, University of New Mexico, Albuquerque, 87185, USA","institution_ids":["https://openalex.org/I169521973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018095974","display_name":"Payman Zarkesh-Ha","orcid":"https://orcid.org/0000-0002-0571-9212"},"institutions":[{"id":"https://openalex.org/I169521973","display_name":"University of New Mexico","ror":"https://ror.org/05fs6jp91","country_code":"US","type":"education","lineage":["https://openalex.org/I169521973"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Payman Zarkesh-Ha","raw_affiliation_strings":["ECE Department, University of New Mexico, Albuquerque, NM","Center for High Technology Materials, ECE Department, University of New Mexico, Albuquerque, 87185, USA"],"affiliations":[{"raw_affiliation_string":"ECE Department, University of New Mexico, Albuquerque, NM","institution_ids":["https://openalex.org/I169521973"]},{"raw_affiliation_string":"Center for High Technology Materials, ECE Department, University of New Mexico, Albuquerque, 87185, USA","institution_ids":["https://openalex.org/I169521973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015117032","display_name":"Sanjay Krishna","orcid":"https://orcid.org/0000-0002-3889-4893"},"institutions":[{"id":"https://openalex.org/I169521973","display_name":"University of New Mexico","ror":"https://ror.org/05fs6jp91","country_code":"US","type":"education","lineage":["https://openalex.org/I169521973"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sanjay Krishna","raw_affiliation_strings":["ECE Department, University of New Mexico, Albuquerque, NM","Center for High Technology Materials, ECE Department, University of New Mexico, Albuquerque, 87185, USA"],"affiliations":[{"raw_affiliation_string":"ECE Department, University of New Mexico, Albuquerque, NM","institution_ids":["https://openalex.org/I169521973"]},{"raw_affiliation_string":"Center for High Technology Materials, ECE Department, University of New Mexico, Albuquerque, 87185, USA","institution_ids":["https://openalex.org/I169521973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018549624","display_name":"Sebasti\u00e1n E. Godoy","orcid":"https://orcid.org/0000-0001-8692-5749"},"institutions":[{"id":"https://openalex.org/I169521973","display_name":"University of New Mexico","ror":"https://ror.org/05fs6jp91","country_code":"US","type":"education","lineage":["https://openalex.org/I169521973"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sebastian E. Godoy","raw_affiliation_strings":["ECE Department, University of New Mexico, Albuquerque, NM","Center for High Technology Materials, ECE Department, University of New Mexico, Albuquerque, 87185, USA"],"affiliations":[{"raw_affiliation_string":"ECE Department, University of New Mexico, Albuquerque, NM","institution_ids":["https://openalex.org/I169521973"]},{"raw_affiliation_string":"Center for High Technology Materials, ECE Department, University of New Mexico, Albuquerque, 87185, USA","institution_ids":["https://openalex.org/I169521973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5086774219","display_name":"Majeed M. Hayat","orcid":"https://orcid.org/0000-0002-3606-0406"},"institutions":[{"id":"https://openalex.org/I169521973","display_name":"University of New Mexico","ror":"https://ror.org/05fs6jp91","country_code":"US","type":"education","lineage":["https://openalex.org/I169521973"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Majeed M. Hayat","raw_affiliation_strings":["ECE Department, University of New Mexico, Albuquerque, NM","Center for High Technology Materials, ECE Department, University of New Mexico, Albuquerque, 87185, USA"],"affiliations":[{"raw_affiliation_string":"ECE Department, University of New Mexico, Albuquerque, NM","institution_ids":["https://openalex.org/I169521973"]},{"raw_affiliation_string":"Center for High Technology Materials, ECE Department, University of New Mexico, Albuquerque, 87185, USA","institution_ids":["https://openalex.org/I169521973"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5050208286"],"corresponding_institution_ids":["https://openalex.org/I169521973"],"apc_list":null,"apc_paid":null,"fwci":0.628,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.73317112,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"386","last_page":"389"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11992","display_name":"CCD and CMOS Imaging Sensors","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12389","display_name":"Infrared Target Detection Methodologies","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.9810000061988831,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/multispectral-image","display_name":"Multispectral image","score":0.9084898233413696},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6765662431716919},{"id":"https://openalex.org/keywords/photodetector","display_name":"Photodetector","score":0.6360644102096558},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.589262843132019},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4887973964214325},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.48861128091812134},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.45005181431770325},{"id":"https://openalex.org/keywords/image-sensor","display_name":"Image sensor","score":0.4341161847114563},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3749954104423523},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3446851074695587},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.32688450813293457},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2641523480415344},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.24630773067474365},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1950622797012329},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.182859867811203},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.13809305429458618}],"concepts":[{"id":"https://openalex.org/C173163844","wikidata":"https://www.wikidata.org/wiki/Q1761440","display_name":"Multispectral image","level":2,"score":0.9084898233413696},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6765662431716919},{"id":"https://openalex.org/C23125352","wikidata":"https://www.wikidata.org/wiki/Q210765","display_name":"Photodetector","level":2,"score":0.6360644102096558},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.589262843132019},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4887973964214325},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.48861128091812134},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.45005181431770325},{"id":"https://openalex.org/C76935873","wikidata":"https://www.wikidata.org/wiki/Q209121","display_name":"Image sensor","level":2,"score":0.4341161847114563},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3749954104423523},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3446851074695587},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.32688450813293457},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2641523480415344},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.24630773067474365},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1950622797012329},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.182859867811203},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.13809305429458618},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mwscas.2014.6908433","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mwscas.2014.6908433","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 57th International Midwest Symposium on Circuits and Systems (MWSCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6100000143051147,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1999009269","https://openalex.org/W2005038782","https://openalex.org/W2024966817","https://openalex.org/W2029476868","https://openalex.org/W2089946977","https://openalex.org/W2132779142","https://openalex.org/W2145777221"],"related_works":["https://openalex.org/W4318664220","https://openalex.org/W2771047279","https://openalex.org/W4388409104","https://openalex.org/W2124951708","https://openalex.org/W1544811710","https://openalex.org/W172072032","https://openalex.org/W2006066416","https://openalex.org/W2371692126","https://openalex.org/W4290642689","https://openalex.org/W2389691473"],"abstract_inverted_index":{"A":[0,67],"new":[1],"readout":[2],"integrated":[3],"circuit":[4],"(ROIC)":[5],"for":[6,35,51,93],"multispectral":[7,33],"classification":[8,36],"is":[9,13,91],"presented.":[10],"The":[11,40,80],"ROIC":[12],"designed":[14,44,71],"to":[15,26,45,95],"utilize":[16],"the":[17,28],"spectral":[18,52],"response":[19],"tunability":[20],"of":[21,30],"dot-in-a-well":[22],"(DWELL)":[23],"infrared":[24],"photodetector":[25],"exploit":[27],"possibility":[29],"real-time":[31],"on-chip":[32],"imaging":[34],"in":[37],"analog":[38],"domain.":[39],"unit":[41],"cells":[42],"are":[43],"include":[46],"all":[47],"necessary":[48],"elements":[49],"needed":[50],"classification,":[53],"including":[54],"high-voltage":[55,78],"time-varying":[56],"positive":[57],"and":[58,63,72,90],"negative":[59],"biases,":[60],"bipolar":[61],"integration,":[62],"selective":[64],"sample-and-hold":[65],"circuits.":[66],"test":[68,81],"chip":[69,82],"was":[70],"fabricated":[73],"using":[74],"TSMC's":[75],"0.35":[76],"\u03bcm":[77],"technology.":[79],"has":[83],"successfully":[84],"completed":[85],"its":[86],"initial":[87],"functional":[88],"tests":[89],"ready":[92],"hybridization":[94],"a":[96],"DWELL":[97],"focal-plane":[98],"array.":[99]},"counts_by_year":[{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}