{"id":"https://openalex.org/W2131400842","doi":"https://doi.org/10.1109/mse.2009.5270824","title":"Vertical integration of system-on-chip concepts in the digital design curriculum","display_name":"Vertical integration of system-on-chip concepts in the digital design curriculum","publication_year":2009,"publication_date":"2009-07-01","ids":{"openalex":"https://openalex.org/W2131400842","doi":"https://doi.org/10.1109/mse.2009.5270824","mag":"2131400842"},"language":"en","primary_location":{"id":"doi:10.1109/mse.2009.5270824","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mse.2009.5270824","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on Microelectronic Systems Education","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101713990","display_name":"Ying Tang","orcid":"https://orcid.org/0000-0002-7225-9455"},"institutions":[{"id":"https://openalex.org/I44265643","display_name":"Rowan University","ror":"https://ror.org/049v69k10","country_code":"US","type":"education","lineage":["https://openalex.org/I44265643"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Ying Tang","raw_affiliation_strings":["Rowan University, USA","ROWAN UNIVERSITY"],"affiliations":[{"raw_affiliation_string":"Rowan University, USA","institution_ids":["https://openalex.org/I44265643"]},{"raw_affiliation_string":"ROWAN UNIVERSITY","institution_ids":["https://openalex.org/I44265643"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103761587","display_name":"Linda Head","orcid":null},"institutions":[{"id":"https://openalex.org/I44265643","display_name":"Rowan University","ror":"https://ror.org/049v69k10","country_code":"US","type":"education","lineage":["https://openalex.org/I44265643"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Linda M. Head","raw_affiliation_strings":["Rowan University, USA","ROWAN UNIVERSITY"],"affiliations":[{"raw_affiliation_string":"Rowan University, USA","institution_ids":["https://openalex.org/I44265643"]},{"raw_affiliation_string":"ROWAN UNIVERSITY","institution_ids":["https://openalex.org/I44265643"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036207748","display_name":"Ravi P. Ramachandran","orcid":"https://orcid.org/0000-0003-0011-4561"},"institutions":[{"id":"https://openalex.org/I44265643","display_name":"Rowan University","ror":"https://ror.org/049v69k10","country_code":"US","type":"education","lineage":["https://openalex.org/I44265643"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ravi P. Ramachandran","raw_affiliation_strings":["Rowan University, USA","ROWAN UNIVERSITY"],"affiliations":[{"raw_affiliation_string":"Rowan University, USA","institution_ids":["https://openalex.org/I44265643"]},{"raw_affiliation_string":"ROWAN UNIVERSITY","institution_ids":["https://openalex.org/I44265643"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5048918100","display_name":"Lawrence M. Chatman","orcid":null},"institutions":[{"id":"https://openalex.org/I112584244","display_name":"Camden County College","ror":"https://ror.org/00pmfef67","country_code":"US","type":"education","lineage":["https://openalex.org/I112584244"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Lawrence M. Chatman","raw_affiliation_strings":["Camden County College, USA","Camden County College"],"affiliations":[{"raw_affiliation_string":"Camden County College, USA","institution_ids":["https://openalex.org/I112584244"]},{"raw_affiliation_string":"Camden County College","institution_ids":["https://openalex.org/I112584244"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5101713990"],"corresponding_institution_ids":["https://openalex.org/I44265643"],"apc_list":null,"apc_paid":null,"fwci":0.5276,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.68623582,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"85","last_page":"88"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11283","display_name":"Experimental Learning in Engineering","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2214","display_name":"Media Technology"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9955000281333923,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/curriculum","display_name":"Curriculum","score":0.7550315856933594},{"id":"https://openalex.org/keywords/pace","display_name":"Pace","score":0.6314167976379395},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.5900746583938599},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5686789751052856},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5411069393157959},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.48210883140563965},{"id":"https://openalex.org/keywords/systems-design","display_name":"Systems design","score":0.4458483159542084},{"id":"https://openalex.org/keywords/emphasis","display_name":"Emphasis (telecommunications)","score":0.4337109327316284},{"id":"https://openalex.org/keywords/vendor","display_name":"Vendor","score":0.4210216999053955},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.3809199631214142},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.3725825548171997},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3190355896949768},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10035237669944763}],"concepts":[{"id":"https://openalex.org/C47177190","wikidata":"https://www.wikidata.org/wiki/Q207137","display_name":"Curriculum","level":2,"score":0.7550315856933594},{"id":"https://openalex.org/C2777526511","wikidata":"https://www.wikidata.org/wiki/Q691543","display_name":"Pace","level":2,"score":0.6314167976379395},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.5900746583938599},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5686789751052856},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5411069393157959},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.48210883140563965},{"id":"https://openalex.org/C31352089","wikidata":"https://www.wikidata.org/wiki/Q3750474","display_name":"Systems design","level":2,"score":0.4458483159542084},{"id":"https://openalex.org/C177454536","wikidata":"https://www.wikidata.org/wiki/Q578290","display_name":"Emphasis (telecommunications)","level":2,"score":0.4337109327316284},{"id":"https://openalex.org/C2777338717","wikidata":"https://www.wikidata.org/wiki/Q1762621","display_name":"Vendor","level":2,"score":0.4210216999053955},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.3809199631214142},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.3725825548171997},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3190355896949768},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10035237669944763},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.0},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0},{"id":"https://openalex.org/C19417346","wikidata":"https://www.wikidata.org/wiki/Q7922","display_name":"Pedagogy","level":1,"score":0.0},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mse.2009.5270824","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mse.2009.5270824","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on Microelectronic Systems Education","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.41999998688697815,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1556475821","https://openalex.org/W1609755472","https://openalex.org/W1900457335","https://openalex.org/W1938418943","https://openalex.org/W2098108171","https://openalex.org/W2110666846","https://openalex.org/W2119500490","https://openalex.org/W2120456454","https://openalex.org/W2131209738","https://openalex.org/W2141629950","https://openalex.org/W2622260685"],"related_works":["https://openalex.org/W2055105357","https://openalex.org/W2153819599","https://openalex.org/W2255426644","https://openalex.org/W2072124641","https://openalex.org/W2167093538","https://openalex.org/W2018956713","https://openalex.org/W2081479354","https://openalex.org/W2113107605","https://openalex.org/W3204693335","https://openalex.org/W1917644319"],"abstract_inverted_index":{"The":[0,80],"rapid":[1],"evolution":[2],"of":[3,35,38,45,71,87],"System-on-Chip":[4],"(SoC)":[5],"challenges":[6],"academic":[7],"curricula":[8],"to":[9],"keep":[10],"pace":[11],"in":[12,94],"instilling":[13],"multidisciplinary/interdisciplinary":[14],"system":[15],"thinking.":[16],"This":[17],"paper":[18],"presents":[19],"such":[20],"a":[21,32,43,49,56],"curricular":[22],"prototype":[23],"that":[24],"cuts":[25],"across":[26],"artificial":[27],"course":[28],"boundaries":[29],"and":[30,66,75,83],"provides":[31],"meaningful":[33],"exploration":[34],"diverse":[36],"facets":[37],"SoC":[39,52],"design.":[40],"More":[41],"specifically,":[42],"series":[44],"experimental":[46],"contents":[47],"towards":[48],"digital":[50],"flow":[51],"product":[53],"design":[54],"-":[55],"simplified":[57],"transmission":[58],"control":[59],"protocol":[60],"(TCP)":[61],"stack":[62],"are":[63,90],"systematically":[64],"developed":[65],"implemented":[67],"at":[68],"all":[69],"levels":[70],"the":[72,95],"Rowan":[73],"Electrical":[74],"Computer":[76],"Engineering":[77],"(ECE)":[78],"curriculum.":[79],"detailed":[81],"project":[82],"its":[84],"laboratory":[85],"modules":[86],"progressive":[88],"complexity":[89],"discussed.":[91],"Its":[92],"implementation":[93],"existing":[96],"ECE":[97],"curriculum":[98],"is":[99],"also":[100],"presented.":[101]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2020,"cited_by_count":3},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}