{"id":"https://openalex.org/W4412030451","doi":"https://doi.org/10.1109/mm.2025.3572594","title":"Special Issue on Hot Chips 2024","display_name":"Special Issue on Hot Chips 2024","publication_year":2025,"publication_date":"2025-05-01","ids":{"openalex":"https://openalex.org/W4412030451","doi":"https://doi.org/10.1109/mm.2025.3572594"},"language":"en","primary_location":{"id":"doi:10.1109/mm.2025.3572594","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2025.3572594","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5110824648","display_name":"Rob Aitken","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Rob Aitken","raw_affiliation_strings":["National Advanced Packaging Manufacturing Program, Stockton, CA, USA"],"raw_orcid":"https://orcid.org/0000-0001-9287-1732","affiliations":[{"raw_affiliation_string":"National Advanced Packaging Manufacturing Program, Stockton, CA, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5112368946","display_name":"Larry Yang","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Larry Yang","raw_affiliation_strings":["Phononic Inc., Palo Alto, CA, USA"],"raw_orcid":"https://orcid.org/0009-0009-5203-8741","affiliations":[{"raw_affiliation_string":"Phononic Inc., Palo Alto, CA, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5110824648"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.13437048,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"45","issue":"3","first_page":"6","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12238","display_name":"Green IT and Sustainability","score":0.19130000472068787,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12238","display_name":"Green IT and Sustainability","score":0.19130000472068787,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.8161544799804688},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3792259395122528},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3244209885597229}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.8161544799804688},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3792259395122528},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3244209885597229}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mm.2025.3572594","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2025.3572594","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":null,"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}