{"id":"https://openalex.org/W4405934941","doi":"https://doi.org/10.1109/mm.2024.3524130","title":"Disaggregated Designs: Technology Challenges and Enablers","display_name":"Disaggregated Designs: Technology Challenges and Enablers","publication_year":2024,"publication_date":"2024-12-31","ids":{"openalex":"https://openalex.org/W4405934941","doi":"https://doi.org/10.1109/mm.2024.3524130"},"language":"en","primary_location":{"id":"doi:10.1109/mm.2024.3524130","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2024.3524130","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Boyd Phelps","orcid":"https://orcid.org/0009-0009-7691-8241"},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Boyd Phelps","raw_affiliation_strings":["Silicon Solutions Group, Cadence, San Jose, CA, USA"],"raw_orcid":"https://orcid.org/0009-0009-7691-8241","affiliations":[{"raw_affiliation_string":"Silicon Solutions Group, Cadence, San Jose, CA, USA","institution_ids":["https://openalex.org/I66217453"]}]},{"author_position":"last","author":{"id":null,"display_name":"Arif Khan","orcid":"https://orcid.org/0009-0001-1724-5958"},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Arif Khan","raw_affiliation_strings":["Silicon Solutions Group, Cadence, San Jose, CA, USA"],"raw_orcid":"https://orcid.org/0009-0001-1724-5958","affiliations":[{"raw_affiliation_string":"Silicon Solutions Group, Cadence, San Jose, CA, USA","institution_ids":["https://openalex.org/I66217453"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I66217453"],"apc_list":null,"apc_paid":null,"fwci":0.3874,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.6163807,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":96},"biblio":{"volume":"45","issue":"1","first_page":"9","last_page":"15"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.4113999903202057,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.4113999903202057,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.8011179566383362},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.4331654906272888},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.3445644974708557}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.8011179566383362},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.4331654906272888},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.3445644974708557}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mm.2024.3524130","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2024.3524130","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2981848488"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W4391913857","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"The":[0,13,122],"unsustainable":[1],"pace":[2],"of":[3,34,55,63,111],"die-size":[4],"growth":[5],"has":[6],"come":[7],"up":[8],"against":[9],"the":[10,42,76,95,99,129],"reticle":[11],"limit.":[12],"rise":[14],"in":[15,26,50,98,128],"cost":[16],"per":[17],"transistor":[18],"(CPT)":[19],"is":[20],"outweighing":[21],"scaling":[22],"benefits":[23],"from":[24],"advances":[25],"generational":[27],"process":[28],"technology.":[29],"These":[30],"diminishing":[31],"silicon":[32],"economies":[33],"scale":[35],"have":[36,73],"pushed":[37],"foundries,":[38],"EDA":[39],"companies,":[40],"and":[41,53,66,70,88,94,109,126,140],"manufacturing":[43],"ecosystem":[44],"to":[45,75,80,101,133],"enable":[46,102,115],"chiplet":[47,87,107,118],"designs.":[48],"Developments":[49],"packaging":[51],"technology":[52,59,142],"standardization":[54],"die-to-die":[56,89],"interfaces":[57],"provide":[58],"gains":[60],"offsetting":[61],"challenges":[62],"die":[64],"sizes":[65],"CPT.":[67],"Standards":[68],"bodies":[69],"IP":[71],"implementers":[72],"risen":[74],"challenge,":[77],"providing":[78],"solutions":[79],"interface":[81],"bottlenecks.":[82],"We":[83,136],"examine":[84,137],"standards":[85],"for":[86,106,124,148],"interfaces,":[90],"such":[91],"as":[92],"UCIe":[93],"work":[96],"done":[97],"industry":[100],"these.":[103],"Architectural":[104],"partitions":[105],"implementations":[108],"development":[110],"reusable":[112],"components":[113],"that":[114],"a":[116],"future":[117,146],"marketplace":[119],"are":[120],"considered.":[121],"juggernaut":[123],"differentiation":[125],"disaggregation":[127],"more-than-Moore":[130],"era":[131],"continues":[132],"build":[134],"momentum.":[135],"these":[138],"trends":[139],"recent":[141],"advances,":[143],"looking":[144],"at":[145],"directions":[147],"implementations.":[149]},"counts_by_year":[{"year":2025,"cited_by_count":2}],"updated_date":"2025-12-19T19:40:27.379048","created_date":"2025-10-10T00:00:00"}