{"id":"https://openalex.org/W4402593055","doi":"https://doi.org/10.1109/mm.2024.3462351","title":"Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct MI300X Accelerator","display_name":"Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct MI300X Accelerator","publication_year":2024,"publication_date":"2024-09-18","ids":{"openalex":"https://openalex.org/W4402593055","doi":"https://doi.org/10.1109/mm.2024.3462351"},"language":"en","primary_location":{"id":"doi:10.1109/mm.2024.3462351","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2024.3462351","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5077083491","display_name":"Alan Smith","orcid":"https://orcid.org/0000-0002-5247-6567"},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Alan Smith","raw_affiliation_strings":["Advanced Micro Devices, Inc., Austin, TX, USA"],"raw_orcid":"https://orcid.org/0000-0002-5247-6567","affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Austin, TX, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102835155","display_name":"Gabriel H. Loh","orcid":"https://orcid.org/0000-0002-4616-0144"},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gabriel H. Loh","raw_affiliation_strings":["Advanced Micro Devices, Inc., Bellevue, WA, USA"],"raw_orcid":"https://orcid.org/0000-0002-4616-0144","affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Bellevue, WA, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075023469","display_name":"Samuel Naffziger","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Samuel Naffziger","raw_affiliation_strings":["Advanced Micro Devices, Inc., Fort Collins, CO, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Fort Collins, CO, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053942589","display_name":"John Wuu","orcid":"https://orcid.org/0009-0009-1998-5536"},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John Wuu","raw_affiliation_strings":["Advanced Micro Devices, Inc., Fort Collins, CO, USA"],"raw_orcid":"https://orcid.org/0009-0009-1998-5536","affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Fort Collins, CO, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077848878","display_name":"Nathan Kalyanasundharam","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nathan Kalyanasundharam","raw_affiliation_strings":["Advanced Micro Devices, Inc., Sunnyvale, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007498296","display_name":"Eric Chapman","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Eric Chapman","raw_affiliation_strings":["Advanced Micro Devices, Inc., Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Austin, TX, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025987999","display_name":"Raja Swaminathan","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Raja Swaminathan","raw_affiliation_strings":["Advanced Micro Devices, Inc., Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Austin, TX, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101316581","display_name":"Tyrone Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I1311921367","display_name":"Advanced Micro Devices (Canada)","ror":"https://ror.org/02yh0k313","country_code":"CA","type":"company","lineage":["https://openalex.org/I1311921367","https://openalex.org/I4210137977"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Tyrone Huang","raw_affiliation_strings":["Advanced Micro Devices, Inc., Markham, ON, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Markham, ON, Canada","institution_ids":["https://openalex.org/I1311921367"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062991441","display_name":"Wonjun Jung","orcid":"https://orcid.org/0000-0002-4477-9357"},"institutions":[{"id":"https://openalex.org/I1311921367","display_name":"Advanced Micro Devices (Canada)","ror":"https://ror.org/02yh0k313","country_code":"CA","type":"company","lineage":["https://openalex.org/I1311921367","https://openalex.org/I4210137977"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Wonjun Jung","raw_affiliation_strings":["Advanced Micro Devices, Inc., Markham, ON, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Markham, ON, Canada","institution_ids":["https://openalex.org/I1311921367"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023212091","display_name":"Alexander Kaganov","orcid":null},"institutions":[{"id":"https://openalex.org/I1311921367","display_name":"Advanced Micro Devices (Canada)","ror":"https://ror.org/02yh0k313","country_code":"CA","type":"company","lineage":["https://openalex.org/I1311921367","https://openalex.org/I4210137977"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Alexander Kaganov","raw_affiliation_strings":["Advanced Micro Devices, Inc., Markham, ON, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Markham, ON, Canada","institution_ids":["https://openalex.org/I1311921367"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044836561","display_name":"H. McIntyre","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Hugh McIntyre","raw_affiliation_strings":["Advanced Micro Devices, Inc., Santa Clara, CA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Santa Clara, CA, USA","institution_ids":["https://openalex.org/I4210137977"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5013605183","display_name":"R. Mangaser","orcid":null},"institutions":[{"id":"https://openalex.org/I4210137977","display_name":"Advanced Micro Devices (United States)","ror":"https://ror.org/04kd6c783","country_code":"US","type":"company","lineage":["https://openalex.org/I4210137977"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ramon Mangaser","raw_affiliation_strings":["Advanced Micro Devices, Inc., Boxborough, MA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Micro Devices, Inc., Boxborough, MA, USA","institution_ids":["https://openalex.org/I4210137977"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":12,"corresponding_author_ids":["https://openalex.org/A5077083491"],"corresponding_institution_ids":["https://openalex.org/I4210137977"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.14710641,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"45","issue":"1","first_page":"57","last_page":"66"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9934999942779541,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9934999942779541,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9904999732971191,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9889000058174133,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/instinct","display_name":"Instinct","score":0.8147294521331787},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7970209121704102},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6824830174446106},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.46814897656440735},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3696225881576538},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.3304416537284851},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.2737378180027008}],"concepts":[{"id":"https://openalex.org/C3232509","wikidata":"https://www.wikidata.org/wiki/Q18237","display_name":"Instinct","level":2,"score":0.8147294521331787},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7970209121704102},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6824830174446106},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.46814897656440735},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3696225881576538},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.3304416537284851},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.2737378180027008},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C78458016","wikidata":"https://www.wikidata.org/wiki/Q840400","display_name":"Evolutionary biology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mm.2024.3462351","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2024.3462351","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.5400000214576721,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W3188178661","https://openalex.org/W4220943275","https://openalex.org/W4385192453","https://openalex.org/W4387064009","https://openalex.org/W4392745766","https://openalex.org/W6850625674"],"related_works":["https://openalex.org/W2357264280","https://openalex.org/W2349142772","https://openalex.org/W2400156683","https://openalex.org/W2906970874","https://openalex.org/W2079365928","https://openalex.org/W2351780972","https://openalex.org/W3112807754","https://openalex.org/W2783471524","https://openalex.org/W1584575884","https://openalex.org/W2064211727"],"abstract_inverted_index":{"The":[0],"semiconductor":[1],"industry":[2],"has":[3,91],"deployed":[4],"chiplet-based":[5,15],"system-on-chip":[6],"architectures":[7],"for":[8,85],"several":[9],"years.":[10],"Central":[11],"to":[12,64,106,116],"a":[13,34,75,108,117],"successful":[14],"product":[16,27],"is":[17],"the":[18,23,82,93,101],"die-to-die":[19],"interconnect":[20,36,103],"technology":[21,37],"between":[22],"chiplets.":[24],"Based":[25],"on":[26,54,78],"requirements,":[28],"some":[29],"chiplet":[30,102],"designs":[31],"can":[32],"utilize":[33],"single":[35,76],"such":[38],"as":[39],"2-D":[40],"signals":[41],"over":[42],"an":[43],"organic":[44],"substrate":[45],"or":[46],"higher-density":[47],"2.5-D":[48],"integration":[49,115],"technologies.":[50],"With":[51],"increasing":[52],"demands":[53,84],"compute":[55],"and":[56],"memory":[57],"capabilities,":[58],"high-performance":[59,86],"products":[60],"are":[61],"now":[62],"moving":[63],"heterogeneous":[65,114],"integration,":[66],"which":[67],"combines":[68],"multiple":[69],"advanced":[70],"packaging":[71],"technologies":[72],"all":[73],"within":[74],"system":[77],"chip.":[79],"To":[80],"address":[81],"market":[83],"artificial":[87],"intelligence":[88],"solutions,":[89],"AMD":[90,94],"introduced":[92],"Instinct":[95],"MI300X":[96],"accelerator.":[97],"This":[98],"article":[99],"details":[100],"design":[104],"required":[105],"support":[107],"sophisticated":[109],"package":[110],"that":[111],"takes":[112],"high-volume":[113],"new":[118],"level.":[119]},"counts_by_year":[],"updated_date":"2025-12-23T23:11:35.936235","created_date":"2025-10-10T00:00:00"}