{"id":"https://openalex.org/W4401880292","doi":"https://doi.org/10.1109/mm.2024.3447711","title":"Co-Design of Interchiplet, Package, and System Interconnect Protocols","display_name":"Co-Design of Interchiplet, Package, and System Interconnect Protocols","publication_year":2024,"publication_date":"2024-08-26","ids":{"openalex":"https://openalex.org/W4401880292","doi":"https://doi.org/10.1109/mm.2024.3447711"},"language":"en","primary_location":{"id":"doi:10.1109/mm.2024.3447711","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2024.3447711","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":null,"display_name":"Tony Chan Carusone","orcid":null},"institutions":[{"id":"https://openalex.org/I4210160662","display_name":"Alpha One","ror":"https://ror.org/04f3amf18","country_code":"US","type":"other","lineage":["https://openalex.org/I4210160662"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Tony Chan Carusone","raw_affiliation_strings":["Alphawave Semi, Toronto, ON, Canada","Alphawave Semi, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Alphawave Semi, Toronto, ON, Canada","institution_ids":["https://openalex.org/I4210160662"]},{"raw_affiliation_string":"Alphawave Semi, Canada","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5106828881","display_name":"Dustin Dunwell","orcid":null},"institutions":[{"id":"https://openalex.org/I4210160662","display_name":"Alpha One","ror":"https://ror.org/04f3amf18","country_code":"US","type":"other","lineage":["https://openalex.org/I4210160662"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Dustin Dunwell","raw_affiliation_strings":["Alphawave Semi, Toronto, ON, Canada","Alphawave Semi, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Alphawave Semi, Toronto, ON, Canada","institution_ids":["https://openalex.org/I4210160662"]},{"raw_affiliation_string":"Alphawave Semi, Canada","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108974437","display_name":"Sundeep Gupta","orcid":null},"institutions":[{"id":"https://openalex.org/I4210086755","display_name":"Alpha Technologies (Canada)","ror":"https://ror.org/0006jev58","country_code":"CA","type":"company","lineage":["https://openalex.org/I4210086755"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Sundeep Gupta","raw_affiliation_strings":["Alphawave Semi, Pune, India","Alphawave Semi, India"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Alphawave Semi, Pune, India","institution_ids":["https://openalex.org/I4210086755"]},{"raw_affiliation_string":"Alphawave Semi, India","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109769322","display_name":"L. Giuliano","orcid":null},"institutions":[{"id":"https://openalex.org/I4210086755","display_name":"Alpha Technologies (Canada)","ror":"https://ror.org/0006jev58","country_code":"CA","type":"company","lineage":["https://openalex.org/I4210086755"]},{"id":"https://openalex.org/I4210094156","display_name":"Alpha and Omega Semiconductor (United States)","ror":"https://ror.org/00pgwrm68","country_code":"US","type":"company","lineage":["https://openalex.org/I4210094156","https://openalex.org/I4210130822"]}],"countries":["CA","US"],"is_corresponding":false,"raw_author_name":"Letizia Giuliano","raw_affiliation_strings":["Alphawave Semi, OR, USA","Alphawave Semi, United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Alphawave Semi, OR, USA","institution_ids":["https://openalex.org/I4210086755"]},{"raw_affiliation_string":"Alphawave Semi, United States","institution_ids":["https://openalex.org/I4210094156"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111301680","display_name":"A Aug\u00e9","orcid":null},"institutions":[{"id":"https://openalex.org/I4210086755","display_name":"Alpha Technologies (Canada)","ror":"https://ror.org/0006jev58","country_code":"CA","type":"company","lineage":["https://openalex.org/I4210086755"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Adrien Auge","raw_affiliation_strings":["Alphawave Semi, Vancouver, BC, Canada","Alphawave Semi, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Alphawave Semi, Vancouver, BC, Canada","institution_ids":["https://openalex.org/I4210086755"]},{"raw_affiliation_string":"Alphawave Semi, Canada","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5106769661","display_name":"Michael Klempa","orcid":null},"institutions":[{"id":"https://openalex.org/I4210086755","display_name":"Alpha Technologies (Canada)","ror":"https://ror.org/0006jev58","country_code":"CA","type":"company","lineage":["https://openalex.org/I4210086755"]},{"id":"https://openalex.org/I4210094156","display_name":"Alpha and Omega Semiconductor (United States)","ror":"https://ror.org/00pgwrm68","country_code":"US","type":"company","lineage":["https://openalex.org/I4210094156","https://openalex.org/I4210130822"]}],"countries":["CA","US"],"is_corresponding":false,"raw_author_name":"Michael Klempa","raw_affiliation_strings":["Alphawave Semi, NH, USA","Alphawave Semi, United States"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Alphawave Semi, NH, USA","institution_ids":["https://openalex.org/I4210086755"]},{"raw_affiliation_string":"Alphawave Semi, United States","institution_ids":["https://openalex.org/I4210094156"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5047176142","display_name":"Sue Hung Fung","orcid":null},"institutions":[{"id":"https://openalex.org/I4210086755","display_name":"Alpha Technologies (Canada)","ror":"https://ror.org/0006jev58","country_code":"CA","type":"company","lineage":["https://openalex.org/I4210086755"]},{"id":"https://openalex.org/I4210094156","display_name":"Alpha and Omega Semiconductor (United States)","ror":"https://ror.org/00pgwrm68","country_code":"US","type":"company","lineage":["https://openalex.org/I4210094156","https://openalex.org/I4210130822"]}],"countries":["CA","US"],"is_corresponding":false,"raw_author_name":"Sue Hung Fung","raw_affiliation_strings":["Alphawave Semi, San Jose, CA, USA","Alphawave Semi, United States"],"raw_orcid":"https://orcid.org/0009-0004-8640-3974","affiliations":[{"raw_affiliation_string":"Alphawave Semi, San Jose, CA, USA","institution_ids":["https://openalex.org/I4210086755"]},{"raw_affiliation_string":"Alphawave Semi, United States","institution_ids":["https://openalex.org/I4210094156"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I4210160662"],"apc_list":null,"apc_paid":null,"fwci":0.3364,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.59500446,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":"45","issue":"1","first_page":"35","last_page":"40"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9872999787330627,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9872999787330627,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9815999865531921,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9628000259399414,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.8485150337219238},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6448908448219299},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.5883423089981079},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4901941418647766},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.31828153133392334}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.8485150337219238},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6448908448219299},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.5883423089981079},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4901941418647766},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.31828153133392334}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mm.2024.3447711","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2024.3447711","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W3191415913","https://openalex.org/W3192636176","https://openalex.org/W4285103180","https://openalex.org/W4296209134","https://openalex.org/W4317793565","https://openalex.org/W4385541699","https://openalex.org/W4392905095"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2748952813","https://openalex.org/W2155019192","https://openalex.org/W2390279801","https://openalex.org/W2014709025","https://openalex.org/W2358668433","https://openalex.org/W4396701345","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W4396696052"],"abstract_inverted_index":{"Artificial":[0],"intelligence":[1],"(AI)":[2],"applications":[3],"are":[4,90],"adopting":[5],"modular":[6],"tile":[7],"design":[8,63,73],"paradigms":[9],"for":[10,23,49],"compute":[11],"and":[12,26,55,74,87],"networking":[13,54],"chiplets.":[14],"The":[15,58],"integration":[16,79],"of":[17,32,61,71,80],"UCIe":[18,62],"as":[19],"a":[20,30,46],"die-to-die":[21],"interconnect":[22],"low":[24],"latency":[25],"power":[27],"savings":[28],"allows":[29],"disaggregation":[31],"large":[33],"monolithic":[34],"dies.":[35],"This":[36],"paper":[37],"covers":[38],"interchiplet":[39],"architectures":[40],"that":[41],"can":[42],"be":[43],"built":[44],"toward":[45],"chiplet":[47],"portfolio":[48],"escalating":[50],"bandwidth":[51],"needs":[52],"in":[53,84],"AI/machine":[56],"learning.":[57],"electrical":[59],"layer":[60],"verification":[64],"is":[65],"illustrated.":[66],"In":[67],"addition,":[68],"the":[69,78,81],"topic":[70],"package":[72],"challenges":[75],"associated":[76],"with":[77],"physical":[82],"layer,":[83],"both":[85],"standard":[86],"advanced":[88],"packaging,":[89],"discussed.":[91]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-12-19T19:40:27.379048","created_date":"2025-10-10T00:00:00"}