{"id":"https://openalex.org/W4394966781","doi":"https://doi.org/10.1109/mm.2024.3387828","title":"The First Direct Mesh-to-Mesh Photonic Fabric","display_name":"The First Direct Mesh-to-Mesh Photonic Fabric","publication_year":2024,"publication_date":"2024-04-19","ids":{"openalex":"https://openalex.org/W4394966781","doi":"https://doi.org/10.1109/mm.2024.3387828"},"language":"en","primary_location":{"id":"doi:10.1109/mm.2024.3387828","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2024.3387828","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102833447","display_name":"Jason Howard","orcid":"https://orcid.org/0009-0005-6250-6108"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jason Howard","raw_affiliation_strings":["Intel Corporation, Hillsboro, OR, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005976669","display_name":"Joshua B. Fryman","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Joshua B. Fryman","raw_affiliation_strings":["Intel Corporation, Hillsboro, OR, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5088912045","display_name":"Shamsul Abedin","orcid":"https://orcid.org/0000-0003-1158-0138"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shamsul Abedin","raw_affiliation_strings":["Intel Corporation, Hillsboro, OR, USA"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5102833447"],"corresponding_institution_ids":["https://openalex.org/I1343180700"],"apc_list":null,"apc_paid":null,"fwci":3.5234,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.92026529,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":"44","issue":"3","first_page":"25","last_page":"32"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13518","display_name":"Architecture and Computational Design","score":0.28360000252723694,"subfield":{"id":"https://openalex.org/subfields/2216","display_name":"Architecture"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13518","display_name":"Architecture and Computational Design","score":0.28360000252723694,"subfield":{"id":"https://openalex.org/subfields/2216","display_name":"Architecture"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.26350000500679016,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wire-mesh","display_name":"Wire mesh","score":0.43866872787475586},{"id":"https://openalex.org/keywords/optical-mesh-network","display_name":"Optical mesh network","score":0.4206398129463196},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.38337188959121704},{"id":"https://openalex.org/keywords/wireless-mesh-network","display_name":"Wireless mesh network","score":0.3588714003562927},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3278130888938904},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.32310953736305237},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.2472151219844818},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1301979124546051}],"concepts":[{"id":"https://openalex.org/C2992630608","wikidata":"https://www.wikidata.org/wiki/Q24503377","display_name":"Wire mesh","level":2,"score":0.43866872787475586},{"id":"https://openalex.org/C61032513","wikidata":"https://www.wikidata.org/wiki/Q3456890","display_name":"Optical mesh network","level":5,"score":0.4206398129463196},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.38337188959121704},{"id":"https://openalex.org/C31548570","wikidata":"https://www.wikidata.org/wiki/Q6453712","display_name":"Wireless mesh network","level":4,"score":0.3588714003562927},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3278130888938904},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.32310953736305237},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2472151219844818},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1301979124546051},{"id":"https://openalex.org/C108037233","wikidata":"https://www.wikidata.org/wiki/Q11375","display_name":"Wireless network","level":3,"score":0.0},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mm.2024.3387828","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2024.3387828","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2154001575","https://openalex.org/W3163331881","https://openalex.org/W4246342895","https://openalex.org/W6960286152"],"related_works":["https://openalex.org/W2059636867","https://openalex.org/W2088748318","https://openalex.org/W2003342631","https://openalex.org/W3116030847","https://openalex.org/W2155585457","https://openalex.org/W2084674847","https://openalex.org/W2079044140","https://openalex.org/W1997402819","https://openalex.org/W2757691190","https://openalex.org/W2169126406"],"abstract_inverted_index":{"Intel":[0],"developed":[1],"the":[2,42,56,62,68,92,100,125,129,158],"Programmable":[3],"Integrated":[4],"Unified":[5],"Memory":[6],"Architecture":[7],"(PIUMA)":[8],"to":[9,28,45,67,73,96,122,156],"address":[10,94],"inefficiencies":[11],"seen":[12],"in":[13,51,80,99,128,149],"conventional":[14],"processor":[15],"architectures":[16],"for":[17],"at-scale":[18],"sparse":[19],"graph":[20],"analytics.":[21],"PIUMA":[22,35,60,78],"adopted":[23],"co-packaged":[24],"optical":[25,69,126],"(CPO)":[26],"modules":[27],"provide":[29],"1":[30],"TB/s/direction":[31],"of":[32,117,144],"network":[33,38],"bandwidth.":[34],"fused":[36],"traditional":[37],"switch":[39,49],"logic":[40,44],"into":[41,83,141],"compute":[43],"make":[46],"a":[47,52,81,84,114],"disaggregated":[48],"fabric":[50,70,127,161],"HyperX":[53],"topology.":[54],"Utilizing":[55],"latest":[57],"CPO":[58,160],"technology,":[59],"converts":[61],"on-die":[63],"mesh":[64],"protocol":[65],"directly":[66],"and":[71,152],"back":[72],"seamlessly":[74],"glue":[75],"together":[76],"all":[77,139],"chips":[79],"system":[82],"large":[85],"virtual":[86],"die.":[87],"Routing":[88],"is":[89,133],"done":[90],"by":[91],"global":[93],"associated":[95],"each":[97],"resource":[98],"system,":[101],"eliminating":[102],"higher":[103],"level":[104],"protocols":[105],"such":[106],"as":[107],"Ethernet":[108],"or":[109],"CXL.":[110],"Measured":[111],"silicon":[112],"demonstrates":[113],"best-case":[115],"latency":[116],"<46ns":[118],"per":[119],"connection":[120],"mesh-stop":[121,123],"through":[124],"first":[130],"prototype":[131],"which":[132],"not":[134],"fully":[135],"optimized.":[136],"This":[137],"was":[138],"combined":[140],"custom":[142],"ASIC":[143],"316mm":[145],"<sup":[146],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[147],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[148],"7nm":[150],"manufacturing":[151],"advanced":[153],"packaging":[154],"technology":[155],"enable":[157],"direct":[159],"requirements.":[162]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}