{"id":"https://openalex.org/W3108101844","doi":"https://doi.org/10.1109/mm.2020.3040410","title":"An Open Inter-Chiplet Communication Link: Bunch of Wires (BoW)","display_name":"An Open Inter-Chiplet Communication Link: Bunch of Wires (BoW)","publication_year":2020,"publication_date":"2020-11-25","ids":{"openalex":"https://openalex.org/W3108101844","doi":"https://doi.org/10.1109/mm.2020.3040410","mag":"3108101844"},"language":"en","primary_location":{"id":"doi:10.1109/mm.2020.3040410","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2020.3040410","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5070028280","display_name":"Shahab Ardalan","orcid":null},"institutions":[{"id":"https://openalex.org/I4210138881","display_name":"Ayar Labs (United States)","ror":"https://ror.org/03rgkeg55","country_code":"US","type":"company","lineage":["https://openalex.org/I4210138881"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Shahab Ardalan","raw_affiliation_strings":["Ayar Labs, Santa Clara, CA, USA"],"affiliations":[{"raw_affiliation_string":"Ayar Labs, Santa Clara, CA, USA","institution_ids":["https://openalex.org/I4210138881"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077462467","display_name":"R. Farjad-Rad","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154351","display_name":"Marvell (United States)","ror":"https://ror.org/04wmff902","country_code":"US","type":"company","lineage":["https://openalex.org/I4210092679","https://openalex.org/I4210154351"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ramin Farjadrad","raw_affiliation_strings":["Marvell Semiconductor, Inc., Santa Clara, CA, USA"],"affiliations":[{"raw_affiliation_string":"Marvell Semiconductor, Inc., Santa Clara, CA, USA","institution_ids":["https://openalex.org/I4210154351"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040014775","display_name":"Mark Kuemerle","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154351","display_name":"Marvell (United States)","ror":"https://ror.org/04wmff902","country_code":"US","type":"company","lineage":["https://openalex.org/I4210092679","https://openalex.org/I4210154351"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mark Kuemerle","raw_affiliation_strings":["Marvell Semiconductor, Inc., Essex Junction, VT, USA"],"affiliations":[{"raw_affiliation_string":"Marvell Semiconductor, Inc., Essex Junction, VT, USA","institution_ids":["https://openalex.org/I4210154351"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5055542996","display_name":"K. Poulton","orcid":null},"institutions":[{"id":"https://openalex.org/I4210115805","display_name":"Keysight Technologies (United States)","ror":"https://ror.org/02903cd17","country_code":"US","type":"company","lineage":["https://openalex.org/I4210115805"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ken Poulton","raw_affiliation_strings":["Keysight Technologies, Santa Clara, CA, USA"],"affiliations":[{"raw_affiliation_string":"Keysight Technologies, Santa Clara, CA, USA","institution_ids":["https://openalex.org/I4210115805"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042830832","display_name":"Suresh Subramaniam","orcid":"https://orcid.org/0000-0003-1501-5953"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Suresh Subramaniam","raw_affiliation_strings":["Apex Semiconductors, San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"Apex Semiconductors, San Jose, CA, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113630631","display_name":"Bapiraju Vinnakota","orcid":null},"institutions":[{"id":"https://openalex.org/I4210127325","display_name":"Broadcom (United States)","ror":"https://ror.org/035gt5s03","country_code":"US","type":"company","lineage":["https://openalex.org/I4210127325"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Bapiraju Vinnakota","raw_affiliation_strings":["Broadcom, Inc., San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"Broadcom, Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I4210127325"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5070028280"],"corresponding_institution_ids":["https://openalex.org/I4210138881"],"apc_list":null,"apc_paid":null,"fwci":1.0275,"has_fulltext":false,"cited_by_count":25,"citation_normalized_percentile":{"value":0.76847152,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":95,"max":99},"biblio":{"volume":"41","issue":"1","first_page":"54","last_page":"60"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7302111387252808},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.6388150453567505},{"id":"https://openalex.org/keywords/bow-tie","display_name":"Bow tie","score":0.6225953698158264},{"id":"https://openalex.org/keywords/key","display_name":"Key (lock)","score":0.47607749700546265},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.44203615188598633},{"id":"https://openalex.org/keywords/competitive-advantage","display_name":"Competitive advantage","score":0.44089120626449585},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.32316917181015015},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.15348583459854126}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7302111387252808},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.6388150453567505},{"id":"https://openalex.org/C2777652565","wikidata":"https://www.wikidata.org/wiki/Q4950686","display_name":"Bow tie","level":3,"score":0.6225953698158264},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.47607749700546265},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.44203615188598633},{"id":"https://openalex.org/C58546491","wikidata":"https://www.wikidata.org/wiki/Q1150207","display_name":"Competitive advantage","level":2,"score":0.44089120626449585},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.32316917181015015},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.15348583459854126},{"id":"https://openalex.org/C162853370","wikidata":"https://www.wikidata.org/wiki/Q39809","display_name":"Marketing","level":1,"score":0.0},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mm.2020.3040410","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2020.3040410","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6100000143051147,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2126529028","https://openalex.org/W2515277349","https://openalex.org/W3018363946","https://openalex.org/W3019560670","https://openalex.org/W3033201886","https://openalex.org/W3084147765"],"related_works":["https://openalex.org/W2329452785","https://openalex.org/W2356380379","https://openalex.org/W2364562957","https://openalex.org/W2364808845","https://openalex.org/W2363925233","https://openalex.org/W2366230866","https://openalex.org/W2357906747","https://openalex.org/W2773072120","https://openalex.org/W2366284060","https://openalex.org/W2372895414"],"abstract_inverted_index":{"Bunch":[0],"of":[1,26,58,106],"wires":[2],"(BoW)":[3],"is":[4],"a":[5,23,37,55,87,95],"new":[6],"open":[7,90,115],"die-to-die":[8],"(D2D)":[9],"interface":[10,98],"that":[11],"aims":[12],"to":[13,42,80,84],"gracefully":[14],"tradeoff":[15],"performance":[16,30,70],"for":[17,108],"design":[18,39,47,68],"and":[19,40,69,110],"packaging":[20,41],"complexity":[21],"across":[22],"wide":[24],"range":[25,32],"process":[27],"nodes.":[28],"BoW":[29,50,64,82],"can":[31],"from":[33,74],"320":[34],"Gb/s/mm":[35],"with":[36,45,99,103,113],"simple":[38],"1+":[43],"Tb/s/mm":[44],"complex":[46],"and/or":[48],"packaging.":[49],"directly":[51],"enables":[52],"heterogeneous":[53],"integration,":[54],"primary":[56],"advantage":[57],"chiplets.":[59],"We":[60],"discuss":[61],"progress":[62],"on":[63,66],"based":[65],"extensive":[67],"studies":[71,78],"by":[72],"engineers":[73],"multiple":[75],"companies.":[76],"These":[77],"aim":[79],"make":[81],"easy":[83],"use":[85],"in":[86],"system.":[88],"This":[89],"innovation":[91],"project":[92],"will":[93],"deliver":[94],"low-complexity":[96],"D2D":[97],"competitive":[100],"power-performance":[101],"metrics":[102],"the":[104],"economies":[105],"scale":[107],"services":[109],"technologies":[111],"associated":[112],"an":[114],"ecosystem.":[116]},"counts_by_year":[{"year":2025,"cited_by_count":6},{"year":2024,"cited_by_count":9},{"year":2023,"cited_by_count":4},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}