{"id":"https://openalex.org/W3094447430","doi":"https://doi.org/10.1109/mm.2020.3028179","title":"Chip Design 2020","display_name":"Chip Design 2020","publication_year":2020,"publication_date":"2020-10-21","ids":{"openalex":"https://openalex.org/W3094447430","doi":"https://doi.org/10.1109/mm.2020.3028179","mag":"3094447430"},"language":"en","primary_location":{"id":"doi:10.1109/mm.2020.3028179","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2020.3028179","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5003048953","display_name":"Jaydeep P. Kulkarni","orcid":"https://orcid.org/0000-0002-0258-6776"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Jaydeep P. Kulkarni","raw_affiliation_strings":["University of Texas at Austin"],"affiliations":[{"raw_affiliation_string":"University of Texas at Austin","institution_ids":["https://openalex.org/I86519309"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5003048953"],"corresponding_institution_ids":["https://openalex.org/I86519309"],"apc_list":null,"apc_paid":null,"fwci":0.1027,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.43764627,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":93},"biblio":{"volume":"40","issue":"6","first_page":"6","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.718500018119812,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.718500018119812,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7718718647956848},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.5252863168716431},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.4895347058773041},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.45960286259651184},{"id":"https://openalex.org/keywords/design-methods","display_name":"Design methods","score":0.4119395315647125},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.37171265482902527},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.35106444358825684},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.25555986166000366},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.10595223307609558}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7718718647956848},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.5252863168716431},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.4895347058773041},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.45960286259651184},{"id":"https://openalex.org/C138852830","wikidata":"https://www.wikidata.org/wiki/Q2292993","display_name":"Design methods","level":2,"score":0.4119395315647125},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.37171265482902527},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.35106444358825684},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.25555986166000366},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.10595223307609558},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mm.2020.3028179","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2020.3028179","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.550000011920929,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2115579119","https://openalex.org/W3142548232","https://openalex.org/W2162273398","https://openalex.org/W1975900776","https://openalex.org/W1757458251","https://openalex.org/W4385080093","https://openalex.org/W1990535547","https://openalex.org/W2132453911","https://openalex.org/W2059398121","https://openalex.org/W2366617252"],"abstract_inverted_index":{"This":[0],"special":[1],"issue":[2],"of":[3,10],"IEEE":[4],"Micro":[5],"aimed":[6],"at":[7],"publishing":[8],"some":[9],"the":[11,18,29],"most":[12],"significant":[13],"research":[14],"that":[15],"can":[16],"highlight":[17],"trends":[19],"in":[20,23],"IC":[21,31],"design":[22,32],"2020":[24],"and":[25],"provide":[26],"directions":[27],"for":[28],"future":[30],"era.":[33]},"counts_by_year":[{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2020-10-29T00:00:00"}