{"id":"https://openalex.org/W2045115736","doi":"https://doi.org/10.1109/mm.2008.22","title":"Fault-Tolerant Design of the IBM Power6 Microprocessor","display_name":"Fault-Tolerant Design of the IBM Power6 Microprocessor","publication_year":2008,"publication_date":"2008-03-01","ids":{"openalex":"https://openalex.org/W2045115736","doi":"https://doi.org/10.1109/mm.2008.22","mag":"2045115736"},"language":"en","primary_location":{"id":"doi:10.1109/mm.2008.22","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2008.22","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5074782537","display_name":"Kevin Reick","orcid":null},"institutions":[{"id":"https://openalex.org/I70983195","display_name":"Syracuse University","ror":"https://ror.org/025r5qe02","country_code":"US","type":"education","lineage":["https://openalex.org/I70983195"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Kevin Reick","raw_affiliation_strings":["IBM Systems and Technology Group, USA","IBM Syst. & Technol. Group, Syracuse Univ., Syracuse, NY"],"affiliations":[{"raw_affiliation_string":"IBM Systems and Technology Group, USA","institution_ids":[]},{"raw_affiliation_string":"IBM Syst. & Technol. Group, Syracuse Univ., Syracuse, NY","institution_ids":["https://openalex.org/I70983195"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112186979","display_name":"P. N. Sanda","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Pia N. Sanda","raw_affiliation_strings":["IBM Systems and Technology Group, USA","[IBM Systems & Technology Group]"],"affiliations":[{"raw_affiliation_string":"IBM Systems and Technology Group, USA","institution_ids":[]},{"raw_affiliation_string":"[IBM Systems & Technology Group]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045122643","display_name":"Scott Swaney","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Scott Swaney","raw_affiliation_strings":["IBM Systems and Technology Group, USA","[IBM Systems & Technology Group]"],"affiliations":[{"raw_affiliation_string":"IBM Systems and Technology Group, USA","institution_ids":[]},{"raw_affiliation_string":"[IBM Systems & Technology Group]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033335408","display_name":"Jeffrey W. Kellington","orcid":null},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jeffrey W. Kellington","raw_affiliation_strings":["IBM Systems and Technology Group, USA","[IBM Systems & Technology Group]"],"affiliations":[{"raw_affiliation_string":"IBM Systems and Technology Group, USA","institution_ids":[]},{"raw_affiliation_string":"[IBM Systems & Technology Group]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5019062163","display_name":"Michael J. Mack","orcid":"https://orcid.org/0000-0002-3148-9158"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael Mack","raw_affiliation_strings":["IBM Systems and Technology Group, USA","[IBM Systems & Technology Group]"],"affiliations":[{"raw_affiliation_string":"IBM Systems and Technology Group, USA","institution_ids":[]},{"raw_affiliation_string":"[IBM Systems & Technology Group]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027002892","display_name":"Michael S. Floyd","orcid":"https://orcid.org/0000-0001-7229-3357"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael Floyd","raw_affiliation_strings":["IBM Systems and Technology Group, USA","[IBM Systems & Technology Group]"],"affiliations":[{"raw_affiliation_string":"IBM Systems and Technology Group, USA","institution_ids":[]},{"raw_affiliation_string":"[IBM Systems & Technology Group]","institution_ids":["https://openalex.org/I1341412227"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058839771","display_name":"Daniel A. Henderson","orcid":"https://orcid.org/0000-0002-4376-4276"},"institutions":[{"id":"https://openalex.org/I1341412227","display_name":"IBM (United States)","ror":"https://ror.org/05hh8d621","country_code":"US","type":"company","lineage":["https://openalex.org/I1341412227"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Daniel Henderson","raw_affiliation_strings":["IBM Systems and Technology Group, USA","[IBM Systems & Technology Group]"],"affiliations":[{"raw_affiliation_string":"IBM Systems and Technology Group, USA","institution_ids":[]},{"raw_affiliation_string":"[IBM Systems & Technology Group]","institution_ids":["https://openalex.org/I1341412227"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5074782537"],"corresponding_institution_ids":["https://openalex.org/I70983195"],"apc_list":null,"apc_paid":null,"fwci":7.6577,"has_fulltext":false,"cited_by_count":70,"citation_normalized_percentile":{"value":0.97466089,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":"28","issue":"2","first_page":"30","last_page":"38"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.844602108001709},{"id":"https://openalex.org/keywords/failover","display_name":"Failover","score":0.844556450843811},{"id":"https://openalex.org/keywords/downtime","display_name":"Downtime","score":0.8274587988853455},{"id":"https://openalex.org/keywords/microprocessor","display_name":"Microprocessor","score":0.7844514846801758},{"id":"https://openalex.org/keywords/ibm","display_name":"IBM","score":0.701887309551239},{"id":"https://openalex.org/keywords/fault-tolerance","display_name":"Fault tolerance","score":0.6294263005256653},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5771570205688477},{"id":"https://openalex.org/keywords/serviceability","display_name":"Serviceability (structure)","score":0.5421096086502075},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.5130147337913513},{"id":"https://openalex.org/keywords/powerpc","display_name":"PowerPC","score":0.43369781970977783},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.43237045407295227},{"id":"https://openalex.org/keywords/soft-error","display_name":"Soft error","score":0.413700133562088},{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.41004878282546997},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.2731720507144928},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.20278400182724}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.844602108001709},{"id":"https://openalex.org/C109751979","wikidata":"https://www.wikidata.org/wiki/Q998767","display_name":"Failover","level":2,"score":0.844556450843811},{"id":"https://openalex.org/C180591934","wikidata":"https://www.wikidata.org/wiki/Q1253369","display_name":"Downtime","level":2,"score":0.8274587988853455},{"id":"https://openalex.org/C2780728072","wikidata":"https://www.wikidata.org/wiki/Q5297","display_name":"Microprocessor","level":2,"score":0.7844514846801758},{"id":"https://openalex.org/C70388272","wikidata":"https://www.wikidata.org/wiki/Q5968558","display_name":"IBM","level":2,"score":0.701887309551239},{"id":"https://openalex.org/C63540848","wikidata":"https://www.wikidata.org/wiki/Q3140932","display_name":"Fault tolerance","level":2,"score":0.6294263005256653},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5771570205688477},{"id":"https://openalex.org/C110245778","wikidata":"https://www.wikidata.org/wiki/Q2169658","display_name":"Serviceability (structure)","level":2,"score":0.5421096086502075},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.5130147337913513},{"id":"https://openalex.org/C56005371","wikidata":"https://www.wikidata.org/wiki/Q209860","display_name":"PowerPC","level":3,"score":0.43369781970977783},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.43237045407295227},{"id":"https://openalex.org/C154474529","wikidata":"https://www.wikidata.org/wiki/Q1658917","display_name":"Soft error","level":2,"score":0.413700133562088},{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.41004878282546997},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.2731720507144928},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.20278400182724},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mm.2008.22","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2008.22","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6899999976158142,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1626545375","https://openalex.org/W2004749420","https://openalex.org/W2007325303","https://openalex.org/W2053117197","https://openalex.org/W2076264849","https://openalex.org/W2099569658","https://openalex.org/W2125169487","https://openalex.org/W2135335377","https://openalex.org/W2916411819"],"related_works":["https://openalex.org/W3131061772","https://openalex.org/W36170654","https://openalex.org/W2187284951","https://openalex.org/W4230285403","https://openalex.org/W2373824847","https://openalex.org/W3013538871","https://openalex.org/W2102514954","https://openalex.org/W2027828053","https://openalex.org/W2017486119","https://openalex.org/W2045115736"],"abstract_inverted_index":{"The":[0,25],"IBM":[1],"Power6":[2,26,49],"microprocessor":[3],"extends":[4],"the":[5,8,48],"capabilities":[6],"of":[7],"Power5,":[9],"dramatically":[10],"increasing":[11,22],"its":[12],"ability":[13],"to":[14],"recover":[15],"from":[16],"hard":[17],"and":[18,35,40,46],"soft":[19],"errors":[20],"without":[21,54],"system":[23],"downtime.":[24],"adds":[27],"new":[28],"mainframe-like":[29],"features":[30],"for":[31,44],"enhanced":[32],"reliability,":[33],"availability,":[34],"serviceability,":[36],"including":[37],"instruction":[38],"retry":[39],"processor":[41],"failover.":[42],"Optimized":[43],"performance":[45],"power,":[47],"implements":[50],"these":[51],"RAS":[52],"enhancements":[53],"compromising":[55],"ultrahigh-frequency":[56],"operation.":[57]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":6},{"year":2015,"cited_by_count":7},{"year":2014,"cited_by_count":6},{"year":2013,"cited_by_count":7},{"year":2012,"cited_by_count":6}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}