{"id":"https://openalex.org/W1996486529","doi":"https://doi.org/10.1109/mm.2004.1289289","title":"Anatomy of a portable digital mediaprocessor","display_name":"Anatomy of a portable digital mediaprocessor","publication_year":2004,"publication_date":"2004-03-01","ids":{"openalex":"https://openalex.org/W1996486529","doi":"https://doi.org/10.1109/mm.2004.1289289","mag":"1996486529"},"language":"en","primary_location":{"id":"doi:10.1109/mm.2004.1289289","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2004.1289289","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5003358706","display_name":"D. Talla","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Talla","raw_affiliation_strings":["Texas Instruments, Inc., USA","Imaging & Audio Group, Texas Instruments, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., USA","institution_ids":["https://openalex.org/I74760111"]},{"raw_affiliation_string":"Imaging & Audio Group, Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068201559","display_name":"Ching-Yu Hung","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ching-Yu Hung","raw_affiliation_strings":["Texas Instruments, Inc., USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111099535","display_name":"R. Talluri","orcid":null},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R. Talluri","raw_affiliation_strings":["Texas Instruments, Inc., USA","Imaging & Audio Group, Texas Instruments, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., USA","institution_ids":["https://openalex.org/I74760111"]},{"raw_affiliation_string":"Imaging & Audio Group, Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028242105","display_name":"Frances Brill","orcid":"https://orcid.org/0000-0002-5438-7605"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"F. Brill","raw_affiliation_strings":["Texas Instruments, Inc., USA","Imaging & Audio Group, Texas Instruments, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., USA","institution_ids":["https://openalex.org/I74760111"]},{"raw_affiliation_string":"Imaging & Audio Group, Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043922009","display_name":"David G. Smith","orcid":"https://orcid.org/0000-0002-1363-9562"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Smith","raw_affiliation_strings":["Texas Instruments, Inc., USA","Imaging & Audio Group, Texas Instruments, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., USA","institution_ids":["https://openalex.org/I74760111"]},{"raw_affiliation_string":"Imaging & Audio Group, Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024920074","display_name":"David Brier","orcid":"https://orcid.org/0000-0001-9070-2716"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Brier","raw_affiliation_strings":["Texas Instruments, Inc., USA","Imaging & Audio Group, Texas Instruments, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., USA","institution_ids":["https://openalex.org/I74760111"]},{"raw_affiliation_string":"Imaging & Audio Group, Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046624334","display_name":"Bing Xiong","orcid":"https://orcid.org/0000-0002-7558-1845"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B. Xiong","raw_affiliation_strings":["Texas Instruments, Inc., USA","Imaging & Audio Group, Texas Instruments, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., USA","institution_ids":["https://openalex.org/I74760111"]},{"raw_affiliation_string":"Imaging & Audio Group, Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5033341747","display_name":"Duy C. Huynh","orcid":"https://orcid.org/0000-0003-3369-0127"},"institutions":[{"id":"https://openalex.org/I74760111","display_name":"Texas Instruments (United States)","ror":"https://ror.org/03vsmv677","country_code":"US","type":"company","lineage":["https://openalex.org/I74760111"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Huynh","raw_affiliation_strings":["Texas Instruments, Inc., USA","Imaging & Audio Group, Texas Instruments, Dallas, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Texas Instruments, Inc., USA","institution_ids":["https://openalex.org/I74760111"]},{"raw_affiliation_string":"Imaging & Audio Group, Texas Instruments, Dallas, TX, USA","institution_ids":["https://openalex.org/I74760111"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.1201,"has_fulltext":false,"cited_by_count":41,"citation_normalized_percentile":{"value":0.8629702,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":100},"biblio":{"volume":"24","issue":"2","first_page":"32","last_page":"39"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9955000281333923,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.986299991607666,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.822425365447998},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.528644859790802},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.5146156549453735},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5007028579711914},{"id":"https://openalex.org/keywords/set","display_name":"Set (abstract data type)","score":0.42218148708343506},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.1892799437046051}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.822425365447998},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.528644859790802},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.5146156549453735},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5007028579711914},{"id":"https://openalex.org/C177264268","wikidata":"https://www.wikidata.org/wiki/Q1514741","display_name":"Set (abstract data type)","level":2,"score":0.42218148708343506},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.1892799437046051},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mm.2004.1289289","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mm.2004.1289289","pdf_url":null,"source":{"id":"https://openalex.org/S59697426","display_name":"IEEE Micro","issn_l":"0272-1732","issn":["0272-1732","1937-4143"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Micro","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6499999761581421,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":1,"referenced_works":["https://openalex.org/W2069415493"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W2382290278","https://openalex.org/W2350741829","https://openalex.org/W2530322880","https://openalex.org/W1596801655","https://openalex.org/W2015462925"],"abstract_inverted_index":{"Portable":[0],"devices":[1],"equipped":[2],"with":[3,57,102],"imaging,":[4],"video,":[5],"and":[6,12,74,91,111],"audio":[7],"functionality":[8],"are":[9,14],"proliferating":[10],"rapidly,":[11],"manufacturers":[13],"shipping":[15],"hundreds":[16,46],"of":[17,19,29,47,62,71,81,106,132],"millions":[18],"such":[20],"devices.":[21],"A":[22],"general-purpose":[23],"processor":[24,43],"(GPP)":[25],"typically":[26],"consumes":[27,44],"tens":[28],"watts":[30],"to":[31,49,60],"nearly":[32,50],"a":[33,37,52,55,63,66,75,86,135,143],"hundred":[34],"watts,":[35],"while":[36],"high-performance":[38],"digital":[39,139],"still":[40],"cameras":[41],"main":[42],"only":[45],"milliwatts":[48],"half":[51],"watt.":[53],"Designing":[54],"mediaprocessor":[56,96],"performance":[58],"comparable":[59],"that":[61],"GPP":[64],"at":[65],"power":[67,112],"budget":[68],"two":[69],"orders":[70],"magnitude":[72,82],"lower":[73,83],"cost":[76],"more":[77],"than":[78],"an":[79,103],"order":[80],"poses":[84],"quite":[85],"challenge.":[87],"To":[88],"meet":[89],"requirements":[90],"reduce":[92],"overall":[93],"system":[94],"cost,":[95,110],"designers":[97],"must":[98],"integrate":[99],"the":[100,120,130,133],"device":[101],"extensive":[104],"set":[105],"peripherals.":[107],"For":[108],"performance,":[109],"reasons,":[113],"application-specific":[114],"integrated":[115,137],"circuits":[116],"have":[117],"traditionally":[118],"been":[119],"most":[121],"popular":[122],"choice":[123],"for":[124],"portable":[125,138],"media":[126],"systems.":[127],"We":[128],"discuss":[129],"architecture":[131],"DM310,":[134],"highly":[136],"mediaprocessor,":[140],"manufactured":[141],"in":[142],"0.13-micron":[144],"process.":[145]},"counts_by_year":[{"year":2018,"cited_by_count":2},{"year":2016,"cited_by_count":1},{"year":2012,"cited_by_count":16}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}