{"id":"https://openalex.org/W1596917597","doi":"https://doi.org/10.1109/mixdes.2015.7208563","title":"A study on microbolometer electro-thermal circuit modelling","display_name":"A study on microbolometer electro-thermal circuit modelling","publication_year":2015,"publication_date":"2015-06-01","ids":{"openalex":"https://openalex.org/W1596917597","doi":"https://doi.org/10.1109/mixdes.2015.7208563","mag":"1596917597"},"language":"en","primary_location":{"id":"doi:10.1109/mixdes.2015.7208563","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mixdes.2015.7208563","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5045292478","display_name":"Jacek Nazdrowicz","orcid":"https://orcid.org/0000-0001-8523-8170"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":true,"raw_author_name":"Jacek Nazdrowicz","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]","institution_ids":["https://openalex.org/I188884621"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078406102","display_name":"Micha\u0142 Szermer","orcid":"https://orcid.org/0000-0002-9294-701X"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Michal Szermer","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]","institution_ids":["https://openalex.org/I188884621"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079440203","display_name":"Cezary Maj","orcid":"https://orcid.org/0000-0001-6897-0378"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Cezary Maj","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]","institution_ids":["https://openalex.org/I188884621"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039695432","display_name":"Wojciech Zabierowski","orcid":"https://orcid.org/0000-0002-6289-6637"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Wojciech Zabierowski","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]","institution_ids":["https://openalex.org/I188884621"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085564117","display_name":"Andrzej Napieralski","orcid":"https://orcid.org/0000-0002-3844-3435"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Andrzej Napieralski","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]","institution_ids":["https://openalex.org/I188884621"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5045292478"],"corresponding_institution_ids":["https://openalex.org/I188884621"],"apc_list":null,"apc_paid":null,"fwci":1.0154,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.78271435,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"458","last_page":"463"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12442","display_name":"Thermal Radiation and Cooling Technologies","score":0.9829000234603882,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12442","display_name":"Thermal Radiation and Cooling Technologies","score":0.9829000234603882,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10440","display_name":"Advanced Thermoelectric Materials and Devices","score":0.9383000135421753,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12804","display_name":"Thermal Analysis in Power Transmission","score":0.9190000295639038,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microbolometer","display_name":"Microbolometer","score":0.9570428133010864},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5932912826538086},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.49366864562034607},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3986503481864929},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.37752005457878113},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.35918521881103516},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.35055750608444214},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3502371311187744},{"id":"https://openalex.org/keywords/bolometer","display_name":"Bolometer","score":0.23087641596794128},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1886119246482849},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.17088234424591064},{"id":"https://openalex.org/keywords/detector","display_name":"Detector","score":0.12683123350143433},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.06608954071998596}],"concepts":[{"id":"https://openalex.org/C2776111576","wikidata":"https://www.wikidata.org/wiki/Q495462","display_name":"Microbolometer","level":4,"score":0.9570428133010864},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5932912826538086},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.49366864562034607},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3986503481864929},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.37752005457878113},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.35918521881103516},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.35055750608444214},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3502371311187744},{"id":"https://openalex.org/C21028948","wikidata":"https://www.wikidata.org/wiki/Q852212","display_name":"Bolometer","level":3,"score":0.23087641596794128},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1886119246482849},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.17088234424591064},{"id":"https://openalex.org/C94915269","wikidata":"https://www.wikidata.org/wiki/Q1834857","display_name":"Detector","level":2,"score":0.12683123350143433},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.06608954071998596}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mixdes.2015.7208563","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mixdes.2015.7208563","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":27,"referenced_works":["https://openalex.org/W592899876","https://openalex.org/W1572692768","https://openalex.org/W1636503557","https://openalex.org/W1971665337","https://openalex.org/W1975216443","https://openalex.org/W1989467112","https://openalex.org/W1995196885","https://openalex.org/W1998265285","https://openalex.org/W2001484081","https://openalex.org/W2001684101","https://openalex.org/W2002005416","https://openalex.org/W2020366242","https://openalex.org/W2046852558","https://openalex.org/W2048151172","https://openalex.org/W2080565703","https://openalex.org/W2126165571","https://openalex.org/W2135499294","https://openalex.org/W2136289510","https://openalex.org/W2137604445","https://openalex.org/W2151376520","https://openalex.org/W2151871307","https://openalex.org/W2153251831","https://openalex.org/W2154194260","https://openalex.org/W6617762249","https://openalex.org/W6634339976","https://openalex.org/W6662399132","https://openalex.org/W6682181221"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2301012221","https://openalex.org/W2383551073","https://openalex.org/W1980356005","https://openalex.org/W2982578350","https://openalex.org/W1602227548","https://openalex.org/W2402423994","https://openalex.org/W2070240989","https://openalex.org/W2026170673","https://openalex.org/W2387498496"],"abstract_inverted_index":{"Electro-thermal":[0],"models":[1,17],"are":[2,45],"commonly":[3],"used":[4],"in":[5,12,70],"simulations":[6,44],"and":[7,34,37,75],"designing":[8],"MEMS":[9],"devices,":[10],"also":[11],"case":[13],"of":[14,32,65],"microbolometers.":[15],"These":[16],"allow":[18],"to":[19,47,61,76],"estimate":[20],"sensors":[21],"performance":[22],"before":[23],"fabrication":[24,29],"that":[25],"consequently":[26],"impacts":[27],"on":[28],"cost.":[30],"Coupling":[31],"electric":[33],"thermal":[35],"domains":[36],"building":[38],"appropriate":[39],"model":[40],"for":[41,53],"carrying":[42],"out":[43],"crucial":[46],"detect":[48],"all":[49],"phenomena":[50],"having":[51],"impact":[52],"Readout":[54],"Integrated":[55],"Circuit.":[56],"This":[57],"article":[58],"brings":[59],"closer":[60],"the":[62],"subject":[63],"matter":[64],"circuit":[66],"modelling":[67],"(willingly":[68],"implemented":[69],"MATLAB/SIMULINK":[71],"or":[72],"PSPICE":[73],"tools)":[74],"its":[77],"theoretical":[78],"background.":[79]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":2},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2016,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}