{"id":"https://openalex.org/W1594309205","doi":"https://doi.org/10.1109/mixdes.2015.7208559","title":"Stability criteria of the thermal characterization of discrete components","display_name":"Stability criteria of the thermal characterization of discrete components","publication_year":2015,"publication_date":"2015-06-01","ids":{"openalex":"https://openalex.org/W1594309205","doi":"https://doi.org/10.1109/mixdes.2015.7208559","mag":"1594309205"},"language":"en","primary_location":{"id":"doi:10.1109/mixdes.2015.7208559","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mixdes.2015.7208559","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5046455985","display_name":"Gergely Simon","orcid":"https://orcid.org/0000-0003-3483-8947"},"institutions":[{"id":"https://openalex.org/I4210161853","display_name":"Budapest Institute","ror":"https://ror.org/050hvq478","country_code":"HU","type":"facility","lineage":["https://openalex.org/I4210161853"]}],"countries":["HU"],"is_corresponding":false,"raw_author_name":"Gergely Simon","raw_affiliation_strings":["Department of Electron Devices, Budapest Technical University, Budapest, Hungary"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electron Devices, Budapest Technical University, Budapest, Hungary","institution_ids":["https://openalex.org/I4210161853"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5008440163","display_name":"G\u00e1bor Farkas","orcid":"https://orcid.org/0000-0002-9537-9695"},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]}],"countries":["HU"],"is_corresponding":false,"raw_author_name":"Gabor Farkas","raw_affiliation_strings":["Mentor Graphics, Mechanical Analysis Division, Budapest, Hungary","Mentor Graphics Mechanical Analysis Division, Budapest, Hungary"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics, Mechanical Analysis Division, Budapest, Hungary","institution_ids":["https://openalex.org/I105695857"]},{"raw_affiliation_string":"Mentor Graphics Mechanical Analysis Division, Budapest, Hungary","institution_ids":["https://openalex.org/I105695857"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.2353,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.74462461,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"440","last_page":"445"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.6391856670379639},{"id":"https://openalex.org/keywords/semiconductor-device","display_name":"Semiconductor device","score":0.6197124719619751},{"id":"https://openalex.org/keywords/stability","display_name":"Stability (learning theory)","score":0.5999189615249634},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4758058488368988},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4699842035770416},{"id":"https://openalex.org/keywords/semiconductor","display_name":"Semiconductor","score":0.4670376479625702},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4475986957550049},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.44395682215690613},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.4414839446544647},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.33949267864227295},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.23486033082008362},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.12198060750961304},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.08821457624435425}],"concepts":[{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.6391856670379639},{"id":"https://openalex.org/C79635011","wikidata":"https://www.wikidata.org/wiki/Q175805","display_name":"Semiconductor device","level":3,"score":0.6197124719619751},{"id":"https://openalex.org/C112972136","wikidata":"https://www.wikidata.org/wiki/Q7595718","display_name":"Stability (learning theory)","level":2,"score":0.5999189615249634},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4758058488368988},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4699842035770416},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.4670376479625702},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4475986957550049},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.44395682215690613},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.4414839446544647},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.33949267864227295},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.23486033082008362},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12198060750961304},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.08821457624435425},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C119857082","wikidata":"https://www.wikidata.org/wiki/Q2539","display_name":"Machine learning","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mixdes.2015.7208559","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mixdes.2015.7208559","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8600000143051147,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W780878605","https://openalex.org/W1605961372","https://openalex.org/W1917329812","https://openalex.org/W1986979568","https://openalex.org/W2033160895","https://openalex.org/W2095879423","https://openalex.org/W2101609668","https://openalex.org/W2138623588","https://openalex.org/W2168389836","https://openalex.org/W2225777515","https://openalex.org/W2533779461","https://openalex.org/W2614088086","https://openalex.org/W4249545406","https://openalex.org/W6640300119","https://openalex.org/W6737730973"],"related_works":["https://openalex.org/W2092751749","https://openalex.org/W2804684724","https://openalex.org/W2178710952","https://openalex.org/W3140594124","https://openalex.org/W2245119942","https://openalex.org/W4240234223","https://openalex.org/W2038050895","https://openalex.org/W4252398193","https://openalex.org/W2890224009","https://openalex.org/W2135550729"],"abstract_inverted_index":{"Thermal":[0],"characterization":[1],"techniques":[2],"require":[3,30],"precise":[4],"powering":[5,13,36,59,80,87],"and":[6,19,23,51,61,78],"accurate":[7],"data":[8],"acquisition":[9],"equipment.":[10],"The":[11],"proper":[12,35,79],"is":[14],"complex":[15],"due":[16],"to":[17,32],"electrical":[18],"thermal":[20],"stability":[21,46,70,77],"issues":[22,47],"some":[24],"device":[25],"properties.":[26],"A":[27],"few":[28],"methods":[29],"trials":[31],"ensure":[33,76],"the":[34,38,69,82],"of":[37],"devices.":[39],"New":[40],"compound":[41],"semiconductor":[42,63],"devices":[43,64],"have":[44],"further":[45],"at":[48],"low":[49],"currents":[50],"high":[52],"voltages.":[53],"This":[54],"paper":[55],"analyzes":[56],"setups":[57],"for":[58],"two-pole":[60],"three-pole":[62],"with":[65],"great":[66],"emphasis":[67],"on":[68,81],"issues.":[71],"Methods":[72],"are":[73],"presented":[74],"which":[75,89],"devices,":[83],"such":[84],"as":[85,92],"programmed":[86],"technique,":[88],"eliminates":[90],"oscillations":[91],"well.":[93]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":2}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}