{"id":"https://openalex.org/W1547198101","doi":"https://doi.org/10.1109/mixdes.2015.7208556","title":"Investigation of localized thermal vias for temperature reduction in 3D multicore processors","display_name":"Investigation of localized thermal vias for temperature reduction in 3D multicore processors","publication_year":2015,"publication_date":"2015-06-01","ids":{"openalex":"https://openalex.org/W1547198101","doi":"https://doi.org/10.1109/mixdes.2015.7208556","mag":"1547198101"},"language":"en","primary_location":{"id":"doi:10.1109/mixdes.2015.7208556","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mixdes.2015.7208556","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5070985793","display_name":"Piotr Zaj\u0105c","orcid":"https://orcid.org/0000-0002-3968-8848"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":true,"raw_author_name":"Piotr Zajac","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]","institution_ids":["https://openalex.org/I188884621"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074884698","display_name":"Melvin Galicia","orcid":null},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Melvin Galicia","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]","institution_ids":["https://openalex.org/I188884621"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079440203","display_name":"Cezary Maj","orcid":"https://orcid.org/0000-0001-6897-0378"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Cezary Maj","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]","institution_ids":["https://openalex.org/I188884621"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085564117","display_name":"Andrzej Napieralski","orcid":"https://orcid.org/0000-0002-3844-3435"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Andrzej Napieralski","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"[Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, POLAND]","institution_ids":["https://openalex.org/I188884621"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5070985793"],"corresponding_institution_ids":["https://openalex.org/I188884621"],"apc_list":null,"apc_paid":null,"fwci":0.323,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.56312517,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"426","last_page":"430"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.8041725158691406},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.7980986833572388},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.779639720916748},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.7353292107582092},{"id":"https://openalex.org/keywords/multi-core-processor","display_name":"Multi-core processor","score":0.7216893434524536},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.5998979210853577},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5182190537452698},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.501598596572876},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4822200536727905},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.45580577850341797},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4545648396015167},{"id":"https://openalex.org/keywords/microarchitecture","display_name":"Microarchitecture","score":0.4176710844039917},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.41318899393081665},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.39740410447120667},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.3467022180557251},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2873513102531433},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18069440126419067},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09273633360862732},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08046922087669373}],"concepts":[{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.8041725158691406},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.7980986833572388},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.779639720916748},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.7353292107582092},{"id":"https://openalex.org/C78766204","wikidata":"https://www.wikidata.org/wiki/Q555032","display_name":"Multi-core processor","level":2,"score":0.7216893434524536},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.5998979210853577},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5182190537452698},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.501598596572876},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4822200536727905},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.45580577850341797},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4545648396015167},{"id":"https://openalex.org/C107598950","wikidata":"https://www.wikidata.org/wiki/Q259864","display_name":"Microarchitecture","level":2,"score":0.4176710844039917},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.41318899393081665},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.39740410447120667},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.3467022180557251},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2873513102531433},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18069440126419067},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09273633360862732},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08046922087669373},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mixdes.2015.7208556","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mixdes.2015.7208556","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 22nd International Conference Mixed Design of Integrated Circuits & Systems (MIXDES)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.8399999737739563,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W1993700253","https://openalex.org/W2042911395","https://openalex.org/W2046574526","https://openalex.org/W2061941741","https://openalex.org/W2067354926","https://openalex.org/W2102694790","https://openalex.org/W2106778083","https://openalex.org/W2115946118","https://openalex.org/W2126339718","https://openalex.org/W2131413854","https://openalex.org/W2133044942","https://openalex.org/W2147657366","https://openalex.org/W2154857344","https://openalex.org/W2162803032","https://openalex.org/W2170382128","https://openalex.org/W3139689176","https://openalex.org/W4212907107","https://openalex.org/W4252509993"],"related_works":["https://openalex.org/W1547865754","https://openalex.org/W2276000909","https://openalex.org/W2016970881","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W3093450488","https://openalex.org/W3163301441","https://openalex.org/W2027159884","https://openalex.org/W2940837694","https://openalex.org/W2016589506"],"abstract_inverted_index":{"3D":[0,54,75],"stacking":[1],"of":[2,42,64,73,96],"integrated":[3],"circuits":[4],"is":[5,18],"a":[6,48,53],"promising":[7],"idea":[8],"for":[9,68],"increasing":[10],"the":[11,15,39,62,70,74,80,94],"processor":[12,33,45],"performance.":[13],"However,":[14],"major":[16],"challenge":[17],"overcoming":[19],"thermal":[20,40,66,71,97],"issues":[21],"due":[22,92],"to":[23,93],"excessive":[24],"power":[25],"density.":[26],"In":[27],"this":[28],"paper,":[29],"using":[30],"Intel's":[31],"Haswell":[32],"as":[34,47,52],"an":[35,43],"example,":[36],"we":[37],"analyze":[38],"behavior":[41],"eight-core":[44],"implemented":[46],"2D":[49],"chip":[50],"and":[51],"architecture":[55],"with":[56],"two":[57],"layers.":[58],"We":[59,77],"also":[60],"investigate":[61],"use":[63],"localized":[65],"vias":[67],"improving":[69],"behaviour":[72],"stack.":[76],"show":[78],"that":[79],"peak":[81],"temperature":[82],"can":[83],"be":[84],"significantly":[85],"reduced":[86],"(by":[87],"5.8\u00b0C":[88],"in":[89],"our":[90],"case)":[91],"implementation":[95],"vias.":[98]},"counts_by_year":[{"year":2016,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}