{"id":"https://openalex.org/W2026845859","doi":"https://doi.org/10.1109/mixdes.2014.6872217","title":"Usefulness of VeSTIC devices for low-noise and radiation hard 3D integrated circuits","display_name":"Usefulness of VeSTIC devices for low-noise and radiation hard 3D integrated circuits","publication_year":2014,"publication_date":"2014-06-01","ids":{"openalex":"https://openalex.org/W2026845859","doi":"https://doi.org/10.1109/mixdes.2014.6872217","mag":"2026845859"},"language":"en","primary_location":{"id":"doi:10.1109/mixdes.2014.6872217","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mixdes.2014.6872217","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems (MIXDES)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064837031","display_name":"Michal Staniewski","orcid":null},"institutions":[{"id":"https://openalex.org/I108403487","display_name":"Warsaw University of Technology","ror":"https://ror.org/00y0xnp53","country_code":"PL","type":"education","lineage":["https://openalex.org/I108403487"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Michal Staniewski","raw_affiliation_strings":["Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, Warsaw, Poland","Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol., Warsaw, Poland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, Warsaw, Poland","institution_ids":["https://openalex.org/I108403487"]},{"raw_affiliation_string":"Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol., Warsaw, Poland","institution_ids":["https://openalex.org/I108403487"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5109012607","display_name":"Andrzej Pfitzner","orcid":null},"institutions":[{"id":"https://openalex.org/I108403487","display_name":"Warsaw University of Technology","ror":"https://ror.org/00y0xnp53","country_code":"PL","type":"education","lineage":["https://openalex.org/I108403487"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Andrzej Pfitzner","raw_affiliation_strings":["Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, Warsaw, Poland","Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol., Warsaw, Poland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, Warsaw, Poland","institution_ids":["https://openalex.org/I108403487"]},{"raw_affiliation_string":"Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol., Warsaw, Poland","institution_ids":["https://openalex.org/I108403487"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I108403487"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"356","last_page":"360"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/radiation-hardening","display_name":"Radiation hardening","score":0.6456884741783142},{"id":"https://openalex.org/keywords/noise","display_name":"Noise (video)","score":0.6159477233886719},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.6046973466873169},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5627249479293823},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5241734981536865},{"id":"https://openalex.org/keywords/noise-reduction","display_name":"Noise reduction","score":0.49264436960220337},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.48530763387680054},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.47508254647254944},{"id":"https://openalex.org/keywords/radiation","display_name":"Radiation","score":0.43592146039009094},{"id":"https://openalex.org/keywords/mixed-signal-integrated-circuit","display_name":"Mixed-signal integrated circuit","score":0.42115840315818787},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.42067885398864746},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.4165685772895813},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3059396743774414},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.24259796738624573},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24098193645477295},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.16741624474525452},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.11730173230171204},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11037316918373108},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.0942297875881195},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07679685950279236},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.07450973987579346}],"concepts":[{"id":"https://openalex.org/C119349744","wikidata":"https://www.wikidata.org/wiki/Q3026015","display_name":"Radiation hardening","level":3,"score":0.6456884741783142},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.6159477233886719},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.6046973466873169},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5627249479293823},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5241734981536865},{"id":"https://openalex.org/C163294075","wikidata":"https://www.wikidata.org/wiki/Q581861","display_name":"Noise reduction","level":2,"score":0.49264436960220337},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.48530763387680054},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.47508254647254944},{"id":"https://openalex.org/C153385146","wikidata":"https://www.wikidata.org/wiki/Q18335","display_name":"Radiation","level":2,"score":0.43592146039009094},{"id":"https://openalex.org/C62907940","wikidata":"https://www.wikidata.org/wiki/Q1541329","display_name":"Mixed-signal integrated circuit","level":3,"score":0.42115840315818787},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.42067885398864746},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.4165685772895813},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3059396743774414},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.24259796738624573},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24098193645477295},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.16741624474525452},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.11730173230171204},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11037316918373108},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0942297875881195},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07679685950279236},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.07450973987579346},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C94915269","wikidata":"https://www.wikidata.org/wiki/Q1834857","display_name":"Detector","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mixdes.2014.6872217","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mixdes.2014.6872217","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems (MIXDES)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4099999964237213}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1526604329","https://openalex.org/W1590134320","https://openalex.org/W1722816743","https://openalex.org/W1981431384","https://openalex.org/W2026543046","https://openalex.org/W2040183894","https://openalex.org/W2043616167","https://openalex.org/W2112813001","https://openalex.org/W2114416536","https://openalex.org/W2148429980","https://openalex.org/W2160831319","https://openalex.org/W2161903232","https://openalex.org/W2163495578","https://openalex.org/W2535280359","https://openalex.org/W2580268939","https://openalex.org/W3140848842","https://openalex.org/W4388322781","https://openalex.org/W6676777394","https://openalex.org/W6683820115"],"related_works":["https://openalex.org/W2031235560","https://openalex.org/W1939000505","https://openalex.org/W2161335888","https://openalex.org/W4242383160","https://openalex.org/W2548106609","https://openalex.org/W2154989823","https://openalex.org/W2266281062","https://openalex.org/W2112366950","https://openalex.org/W67308010","https://openalex.org/W1852277090"],"abstract_inverted_index":{"VeSTIC":[0,75],"technology":[1],"[1,":[2],"2]":[3],"is":[4],"a":[5,63],"very":[6,18,45],"promising":[7],"concept":[8],"of":[9,21,31,36,51,72],"digital,":[10],"analog":[11],"and":[12,35,69,80],"mixed":[13],"mode":[14],"ICs":[15],"design,":[16],"providing":[17],"large":[19],"scale":[20],"integration,":[22],"extreme":[23],"layout":[24],"regularity,":[25],"as":[26,28],"well":[27],"the":[29,49,73],"possibility":[30],"manufacturing":[32],"cost":[33],"reduction":[34],"fully":[37],"three-dimensional":[38],"integration.":[39],"These":[40],"features":[41],"seem":[42],"to":[43,60,66],"be":[44],"attractive":[46],"also":[47],"in":[48,54],"case":[50],"MEMS":[52],"systems,":[53],"particular":[55],"MAP":[56],"sensors.":[57],"With":[58],"regard":[59],"prospective":[61],"applications,":[62],"first":[64],"insight":[65],"noise":[67],"spectra":[68],"radiation":[70],"hardness":[71],"field-effect":[74],"devices":[76],"has":[77],"been":[78],"performed":[79],"confirms":[81],"their":[82],"usefulness.":[83]},"counts_by_year":[{"year":2018,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}