{"id":"https://openalex.org/W1986739655","doi":"https://doi.org/10.1109/mixdes.2014.6872162","title":"The influence of residual stress induced by anodic wafer bonding on MEMS membrane properties","display_name":"The influence of residual stress induced by anodic wafer bonding on MEMS membrane properties","publication_year":2014,"publication_date":"2014-06-01","ids":{"openalex":"https://openalex.org/W1986739655","doi":"https://doi.org/10.1109/mixdes.2014.6872162","mag":"1986739655"},"language":"en","primary_location":{"id":"doi:10.1109/mixdes.2014.6872162","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mixdes.2014.6872162","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems (MIXDES)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5079440203","display_name":"Cezary Maj","orcid":"https://orcid.org/0000-0001-6897-0378"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":true,"raw_author_name":"Cezary Maj","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070985793","display_name":"Piotr Zaj\u0105c","orcid":"https://orcid.org/0000-0002-3968-8848"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Piotr Zajac","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078406102","display_name":"Micha\u0142 Szermer","orcid":"https://orcid.org/0000-0002-9294-701X"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Michal Szermer","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085564117","display_name":"Andrzej Napieralski","orcid":"https://orcid.org/0000-0002-3844-3435"},"institutions":[{"id":"https://openalex.org/I188884621","display_name":"Lodz University of Technology","ror":"https://ror.org/00s8fpf52","country_code":"PL","type":"education","lineage":["https://openalex.org/I188884621"]}],"countries":["PL"],"is_corresponding":false,"raw_author_name":"Andrzej Napieralski","raw_affiliation_strings":["Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland"],"affiliations":[{"raw_affiliation_string":"Department of Microelectronics and Computer Science, Lodz University of Technology, Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]},{"raw_affiliation_string":"Dept. of Microelectron. & Comput. Sci., Lodz Univ. of Technol., Lodz, Poland","institution_ids":["https://openalex.org/I188884621"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5079440203"],"corresponding_institution_ids":["https://openalex.org/I188884621"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.05346041,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"57","issue":null,"first_page":"93","last_page":"96"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/residual-stress","display_name":"Residual stress","score":0.8944634199142456},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8146219253540039},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7600520849227905},{"id":"https://openalex.org/keywords/anodic-bonding","display_name":"Anodic bonding","score":0.759581446647644},{"id":"https://openalex.org/keywords/annealing","display_name":"Annealing (glass)","score":0.7051142454147339},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6461874842643738},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6076022386550903},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5377457737922668},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.5261033177375793},{"id":"https://openalex.org/keywords/thermal-expansion","display_name":"Thermal expansion","score":0.5090629458427429},{"id":"https://openalex.org/keywords/membrane","display_name":"Membrane","score":0.4814004898071289},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.4733804762363434},{"id":"https://openalex.org/keywords/residual","display_name":"Residual","score":0.4616604447364807},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4351705014705658},{"id":"https://openalex.org/keywords/deflection","display_name":"Deflection (physics)","score":0.43278080224990845},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2384987473487854},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.10332038998603821},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.08143237233161926},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.06633263826370239},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.0619167685508728}],"concepts":[{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.8944634199142456},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8146219253540039},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7600520849227905},{"id":"https://openalex.org/C201414436","wikidata":"https://www.wikidata.org/wiki/Q567503","display_name":"Anodic bonding","level":3,"score":0.759581446647644},{"id":"https://openalex.org/C2777855556","wikidata":"https://www.wikidata.org/wiki/Q4339544","display_name":"Annealing (glass)","level":2,"score":0.7051142454147339},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6461874842643738},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6076022386550903},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5377457737922668},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.5261033177375793},{"id":"https://openalex.org/C47463417","wikidata":"https://www.wikidata.org/wiki/Q6583695","display_name":"Thermal expansion","level":2,"score":0.5090629458427429},{"id":"https://openalex.org/C41625074","wikidata":"https://www.wikidata.org/wiki/Q176088","display_name":"Membrane","level":2,"score":0.4814004898071289},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4733804762363434},{"id":"https://openalex.org/C155512373","wikidata":"https://www.wikidata.org/wiki/Q287450","display_name":"Residual","level":2,"score":0.4616604447364807},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4351705014705658},{"id":"https://openalex.org/C2781355719","wikidata":"https://www.wikidata.org/wiki/Q2080698","display_name":"Deflection (physics)","level":2,"score":0.43278080224990845},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2384987473487854},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.10332038998603821},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.08143237233161926},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.06633263826370239},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0619167685508728},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mixdes.2014.6872162","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mixdes.2014.6872162","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems (MIXDES)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1492766232","https://openalex.org/W2040851996","https://openalex.org/W2151837802","https://openalex.org/W2154342440","https://openalex.org/W2596541016"],"related_works":["https://openalex.org/W4302285966","https://openalex.org/W2785922250","https://openalex.org/W2532494584","https://openalex.org/W2070720201","https://openalex.org/W2066177426","https://openalex.org/W2024267198","https://openalex.org/W4249684911","https://openalex.org/W2064912790","https://openalex.org/W1995865471","https://openalex.org/W2625018053"],"abstract_inverted_index":{"The":[0,76],"bonding":[1,40,62],"is":[2,34,46],"one":[3],"of":[4,41,56,81,91],"the":[5,28,31,39,61,79],"common":[6],"processes":[7],"performed":[8,64],"during":[9],"MEMS":[10],"fabrication.":[11],"It":[12],"allows":[13],"creating":[14],"advanced":[15],"microstructures":[16],"and":[17,43],"specific":[18],"encapsulation.":[19],"However,":[20],"this":[21,37],"process":[22,33,63],"induces":[23,69],"a":[24],"residual":[25,70,82],"stress":[26,71,83],"into":[27,48],"structure":[29],"as":[30,50,72,74],"annealing":[32],"required.":[35],"In":[36],"paper":[38],"silicon":[42],"pyrex":[44],"glass":[45],"taken":[47],"account":[49],"these":[51],"materials":[52],"have":[53],"different":[54],"coefficients":[55],"thermal":[57],"expansion.":[58],"We":[59],"analyze":[60],"in":[65,87],"optimal":[66],"temperature":[67,89],"that":[68],"small":[73],"possible.":[75],"simulations":[77],"show":[78],"influence":[80],"on":[84],"membrane":[85],"deflection":[86],"typical":[88],"range":[90],"operation.":[92]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}