{"id":"https://openalex.org/W2136233929","doi":"https://doi.org/10.1109/micro.2008.4771811","title":"Microarchitecture soft error vulnerability characterization and mitigation under 3D integration technology","display_name":"Microarchitecture soft error vulnerability characterization and mitigation under 3D integration technology","publication_year":2008,"publication_date":"2008-11-01","ids":{"openalex":"https://openalex.org/W2136233929","doi":"https://doi.org/10.1109/micro.2008.4771811","mag":"2136233929"},"language":"en","primary_location":{"id":"doi:10.1109/micro.2008.4771811","is_oa":false,"landing_page_url":"https://doi.org/10.1109/micro.2008.4771811","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 41st IEEE/ACM International Symposium on Microarchitecture","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5062423115","display_name":"Wangyuan Zhang","orcid":"https://orcid.org/0000-0002-0369-5958"},"institutions":[{"id":"https://openalex.org/I33213144","display_name":"University of Florida","ror":"https://ror.org/02y3ad647","country_code":"US","type":"education","lineage":["https://openalex.org/I33213144"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wangyuan Zhang","raw_affiliation_strings":["Intelligent Design of Efficient Architecture Lab (IDEAL), Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL, USA","Intelligent Design of Efficient Architecture Lab (IDEAL), Department of Electrical and Computer Engineering, University of Florida, Gainesville, USA, 32611"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intelligent Design of Efficient Architecture Lab (IDEAL), Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL, USA","institution_ids":["https://openalex.org/I33213144"]},{"raw_affiliation_string":"Intelligent Design of Efficient Architecture Lab (IDEAL), Department of Electrical and Computer Engineering, University of Florida, Gainesville, USA, 32611","institution_ids":["https://openalex.org/I33213144"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100455297","display_name":"Tao Li","orcid":"https://orcid.org/0000-0002-3337-6202"},"institutions":[{"id":"https://openalex.org/I33213144","display_name":"University of Florida","ror":"https://ror.org/02y3ad647","country_code":"US","type":"education","lineage":["https://openalex.org/I33213144"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tao Li","raw_affiliation_strings":["Intelligent Design of Efficient Architecture Lab (IDEAL), Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL, USA","Intelligent Design of Efficient Architecture Lab (IDEAL), Department of Electrical and Computer Engineering, University of Florida, Gainesville, USA, 32611"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intelligent Design of Efficient Architecture Lab (IDEAL), Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL, USA","institution_ids":["https://openalex.org/I33213144"]},{"raw_affiliation_string":"Intelligent Design of Efficient Architecture Lab (IDEAL), Department of Electrical and Computer Engineering, University of Florida, Gainesville, USA, 32611","institution_ids":["https://openalex.org/I33213144"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I33213144"],"apc_list":null,"apc_paid":null,"fwci":1.0176,"has_fulltext":false,"cited_by_count":31,"citation_normalized_percentile":{"value":0.79256457,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"435","last_page":"446"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11005","display_name":"Radiation Effects in Electronics","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9871000051498413,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9775000214576721,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6559644937515259},{"id":"https://openalex.org/keywords/vulnerability","display_name":"Vulnerability (computing)","score":0.6461484432220459},{"id":"https://openalex.org/keywords/microarchitecture","display_name":"Microarchitecture","score":0.6432156562805176},{"id":"https://openalex.org/keywords/soft-error","display_name":"Soft error","score":0.5952308773994446},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.4763079881668091},{"id":"https://openalex.org/keywords/vulnerability-assessment","display_name":"Vulnerability assessment","score":0.4149831235408783},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.18097776174545288},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15900713205337524},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.1358729600906372},{"id":"https://openalex.org/keywords/computer-security","display_name":"Computer security","score":0.12548014521598816},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.10321244597434998},{"id":"https://openalex.org/keywords/psychology","display_name":"Psychology","score":0.06179574131965637}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6559644937515259},{"id":"https://openalex.org/C95713431","wikidata":"https://www.wikidata.org/wiki/Q631425","display_name":"Vulnerability (computing)","level":2,"score":0.6461484432220459},{"id":"https://openalex.org/C107598950","wikidata":"https://www.wikidata.org/wiki/Q259864","display_name":"Microarchitecture","level":2,"score":0.6432156562805176},{"id":"https://openalex.org/C154474529","wikidata":"https://www.wikidata.org/wiki/Q1658917","display_name":"Soft error","level":2,"score":0.5952308773994446},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.4763079881668091},{"id":"https://openalex.org/C167063184","wikidata":"https://www.wikidata.org/wiki/Q1400839","display_name":"Vulnerability assessment","level":3,"score":0.4149831235408783},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.18097776174545288},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15900713205337524},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.1358729600906372},{"id":"https://openalex.org/C38652104","wikidata":"https://www.wikidata.org/wiki/Q3510521","display_name":"Computer security","level":1,"score":0.12548014521598816},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.10321244597434998},{"id":"https://openalex.org/C15744967","wikidata":"https://www.wikidata.org/wiki/Q9418","display_name":"Psychology","level":0,"score":0.06179574131965637},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.0},{"id":"https://openalex.org/C542102704","wikidata":"https://www.wikidata.org/wiki/Q183257","display_name":"Psychotherapist","level":1,"score":0.0},{"id":"https://openalex.org/C137176749","wikidata":"https://www.wikidata.org/wiki/Q4105337","display_name":"Psychological resilience","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/micro.2008.4771811","is_oa":false,"landing_page_url":"https://doi.org/10.1109/micro.2008.4771811","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2008 41st IEEE/ACM International Symposium on Microarchitecture","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6499999761581421,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":44,"referenced_works":["https://openalex.org/W1504515107","https://openalex.org/W1527974875","https://openalex.org/W1564617507","https://openalex.org/W1600162194","https://openalex.org/W1977873933","https://openalex.org/W1999538200","https://openalex.org/W2019828391","https://openalex.org/W2023856022","https://openalex.org/W2075430742","https://openalex.org/W2089854225","https://openalex.org/W2095683891","https://openalex.org/W2097161612","https://openalex.org/W2112360707","https://openalex.org/W2115157620","https://openalex.org/W2115194678","https://openalex.org/W2117747343","https://openalex.org/W2118629573","https://openalex.org/W2119306965","https://openalex.org/W2122224409","https://openalex.org/W2122636510","https://openalex.org/W2122969285","https://openalex.org/W2128817587","https://openalex.org/W2129960401","https://openalex.org/W2131413854","https://openalex.org/W2133044942","https://openalex.org/W2139730616","https://openalex.org/W2143807959","https://openalex.org/W2144482650","https://openalex.org/W2144512449","https://openalex.org/W2145096866","https://openalex.org/W2151746018","https://openalex.org/W2154614859","https://openalex.org/W2154941994","https://openalex.org/W2161549238","https://openalex.org/W2164474450","https://openalex.org/W2169213530","https://openalex.org/W2170408097","https://openalex.org/W3139689176","https://openalex.org/W3147196396","https://openalex.org/W3172772885","https://openalex.org/W4232837724","https://openalex.org/W4243863555","https://openalex.org/W4250303214","https://openalex.org/W6797258325"],"related_works":["https://openalex.org/W1883246888","https://openalex.org/W2370114625","https://openalex.org/W1756374135","https://openalex.org/W2947584067","https://openalex.org/W3118510577","https://openalex.org/W2280562859","https://openalex.org/W230721595","https://openalex.org/W3157230915","https://openalex.org/W1496728123","https://openalex.org/W2062873522"],"abstract_inverted_index":{"As":[0],"semiconductor":[1],"processing":[2],"techniques":[3,33,172,194,240,269],"continue":[4],"to":[5,21,38,92,143,155,178,216,243,253,256],"scale":[6],"down,":[7],"transient":[8,78],"faults,":[9],"also":[10],"known":[11],"as":[12,52,54],"soft":[13,95,113,248],"errors,":[14],"are":[15,241],"increasingly":[16],"becoming":[17],"a":[18,180,190,257],"reliability":[19,181,200],"threat":[20],"high-performance":[22],"microprocessors":[23],"fabricated":[24],"using":[25],"state-of-the-art":[26],"CMOS":[27],"technologies.":[28,106,205],"Emerging":[29],"3D":[30,62,104,128,204,232,246],"chip":[31,101,276],"integration":[32,105,129,233],"leverage":[34],"vertically":[35],"stacked":[36,100],"structures":[37],"reduce":[39,245],"on-chip":[40],"wire":[41],"delay":[42],"and":[43,68,109,117,136,161,219,231,270],"have":[44,70],"shown":[45],"the":[46,59,89,99,124,131,137,150,162,166,199,210,263,267],"capability":[47],"of":[48,61,126,133,139,168,192,212,266],"overcoming":[49],"interconnect":[50],"bottlenecks":[51],"well":[53],"reducing":[55],"power":[56,69],"consumption.":[57],"While":[58],"benefits":[60,201],"die":[63],"stacking":[64,135],"on":[65,77,175,275],"microprocessor":[66],"performance":[67],"been":[71],"extensively":[72],"investigated":[73],"recently,":[74],"its":[75],"implication":[76,265],"fault":[79],"susceptibility":[80],"is":[81,278],"largely":[82],"unknown.":[83],"In":[84],"this":[85],"work,":[86],"we":[87,208],"make":[88],"first":[90,151],"attempt":[91],"characterize":[93],"microarchitecture":[94,193],"error":[96,114,169,249],"vulnerabilities":[97],"across":[98],"layers":[102,177,218],"under":[103],"Using":[107],"models":[108],"simulations":[110],"that":[111,149,238,272],"capture":[112],"physical":[115],"mechanism":[116],"circuit/architecture":[118],"level":[119],"impact,":[120],"our":[121],"study":[122],"reveals":[123],"opportunities":[125],"leveraging":[127],"(e.g.":[130,173],"structure":[132],"vertical":[134],"incorporation":[138],"heterogeneous":[140],"process":[141],"technologies)":[142],"achieve":[144,179],"enhanced":[145],"reliability.":[146],"We":[147,187,260],"showcase":[148],"characteristic":[152],"allows":[153],"outer-layers":[154],"shield":[156],"inter-layers":[157],"from":[158],"particle":[159],"strikes":[160],"second":[163],"feature":[164],"enables":[165],"deployment":[167],"resilience":[170],"device":[171],"Silicon-On-Insulator)":[174],"vulnerable":[176,213],"target":[182],"while":[183],"minimizing":[184],"manufacturing":[185],"cost.":[186],"further":[188,261],"propose":[189,209],"set":[191],"which":[195],"can":[196],"effectively":[197],"exploit":[198],"offered":[202],"by":[203,224,251],"For":[206],"example,":[207],"scheduling":[211],"in-flight":[214],"instructions":[215],"reliable":[217],"design":[220],"robust":[221],"register":[222],"files":[223],"combing":[225],"reliability-hardened":[226],"circuits,":[227],"program":[228],"value":[229],"vulnerability":[230],"techniques.":[234],"Experimental":[235],"results":[236],"show":[237],"these":[239],"able":[242],"substantially":[244],"microarchitectures\u2019":[247],"rate":[250],"up":[252],"88%":[254],"compared":[255],"planar":[258],"design.":[259],"evaluate":[262],"thermal":[264],"proposed":[268],"conclude":[271],"their":[273],"impact":[274],"temperature":[277],"negligible.":[279]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":5},{"year":2015,"cited_by_count":7},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":2}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}