{"id":"https://openalex.org/W2578140671","doi":"https://doi.org/10.1109/mhs.2016.7824167","title":"Elasticity evaluation of single cell with uniaxial deformation in microfluidic chip","display_name":"Elasticity evaluation of single cell with uniaxial deformation in microfluidic chip","publication_year":2016,"publication_date":"2016-11-01","ids":{"openalex":"https://openalex.org/W2578140671","doi":"https://doi.org/10.1109/mhs.2016.7824167","mag":"2578140671"},"language":"en","primary_location":{"id":"doi:10.1109/mhs.2016.7824167","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mhs.2016.7824167","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 International Symposium on Micro-NanoMechatronics and Human Science (MHS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019755265","display_name":"Hirotaka Sugiura","orcid":"https://orcid.org/0000-0003-1900-0900"},"institutions":[{"id":"https://openalex.org/I60134161","display_name":"Nagoya University","ror":"https://ror.org/04chrp450","country_code":"JP","type":"education","lineage":["https://openalex.org/I60134161"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Hirotaka Sugiura","raw_affiliation_strings":["Dept. of Micro-Nano Systems Engineering, Nagoya University, Chilisa-ku, Nagoya, JAPAN"],"affiliations":[{"raw_affiliation_string":"Dept. of Micro-Nano Systems Engineering, Nagoya University, Chilisa-ku, Nagoya, JAPAN","institution_ids":["https://openalex.org/I60134161"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065631742","display_name":"Shinya Sakuma","orcid":"https://orcid.org/0000-0002-4145-7264"},"institutions":[{"id":"https://openalex.org/I60134161","display_name":"Nagoya University","ror":"https://ror.org/04chrp450","country_code":"JP","type":"education","lineage":["https://openalex.org/I60134161"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Shinya Sakuma","raw_affiliation_strings":["Dept. of Micro-Nano Systems Engineering, Nagoya University, Chilisa-ku, Nagoya, JAPAN"],"affiliations":[{"raw_affiliation_string":"Dept. of Micro-Nano Systems Engineering, Nagoya University, Chilisa-ku, Nagoya, JAPAN","institution_ids":["https://openalex.org/I60134161"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101465802","display_name":"Makoto Kaneko","orcid":"https://orcid.org/0000-0002-3100-2477"},"institutions":[{"id":"https://openalex.org/I98285908","display_name":"Osaka University","ror":"https://ror.org/035t8zc32","country_code":"JP","type":"education","lineage":["https://openalex.org/I98285908"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Makoto Kaneko","raw_affiliation_strings":["Dept. of Mechanical Engineering, Osaka University, Suita, Osaka, JAPAN"],"affiliations":[{"raw_affiliation_string":"Dept. of Mechanical Engineering, Osaka University, Suita, Osaka, JAPAN","institution_ids":["https://openalex.org/I98285908"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5091532948","display_name":"Fumihito Arai","orcid":"https://orcid.org/0000-0002-2508-1615"},"institutions":[{"id":"https://openalex.org/I60134161","display_name":"Nagoya University","ror":"https://ror.org/04chrp450","country_code":"JP","type":"education","lineage":["https://openalex.org/I60134161"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Fumihito Arai","raw_affiliation_strings":["Dept. of Micro-Nano Systems Engineering, Nagoya University, Chilisa-ku, Nagoya, JAPAN"],"affiliations":[{"raw_affiliation_string":"Dept. of Micro-Nano Systems Engineering, Nagoya University, Chilisa-ku, Nagoya, JAPAN","institution_ids":["https://openalex.org/I60134161"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5019755265"],"corresponding_institution_ids":["https://openalex.org/I60134161"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.13348263,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"5","issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10379","display_name":"Cellular Mechanics and Interactions","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1307","display_name":"Cell Biology"},"field":{"id":"https://openalex.org/fields/13","display_name":"Biochemistry, Genetics and Molecular Biology"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},"topics":[{"id":"https://openalex.org/T10379","display_name":"Cellular Mechanics and Interactions","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1307","display_name":"Cell Biology"},"field":{"id":"https://openalex.org/fields/13","display_name":"Biochemistry, Genetics and Molecular Biology"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11255","display_name":"Microfluidic and Bio-sensing Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/elasticity","display_name":"Elasticity (physics)","score":0.7913177013397217},{"id":"https://openalex.org/keywords/indentation","display_name":"Indentation","score":0.5910429358482361},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5601903796195984},{"id":"https://openalex.org/keywords/microfluidic-chip","display_name":"Microfluidic chip","score":0.5392054915428162},{"id":"https://openalex.org/keywords/microfluidics","display_name":"Microfluidics","score":0.5238420963287354},{"id":"https://openalex.org/keywords/deformation","display_name":"Deformation (meteorology)","score":0.4825272262096405},{"id":"https://openalex.org/keywords/measure","display_name":"Measure (data warehouse)","score":0.48164835572242737},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4685676395893097},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.3508020341396332},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3365367352962494},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.32103872299194336},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.23804661631584167},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.22906213998794556},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1721537709236145},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16292321681976318},{"id":"https://openalex.org/keywords/data-mining","display_name":"Data mining","score":0.07496389746665955},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.07041838765144348}],"concepts":[{"id":"https://openalex.org/C121854251","wikidata":"https://www.wikidata.org/wiki/Q62932","display_name":"Elasticity (physics)","level":2,"score":0.7913177013397217},{"id":"https://openalex.org/C2780902562","wikidata":"https://www.wikidata.org/wiki/Q1154141","display_name":"Indentation","level":2,"score":0.5910429358482361},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5601903796195984},{"id":"https://openalex.org/C2988198817","wikidata":"https://www.wikidata.org/wiki/Q633261","display_name":"Microfluidic chip","level":3,"score":0.5392054915428162},{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.5238420963287354},{"id":"https://openalex.org/C204366326","wikidata":"https://www.wikidata.org/wiki/Q3027650","display_name":"Deformation (meteorology)","level":2,"score":0.4825272262096405},{"id":"https://openalex.org/C2780009758","wikidata":"https://www.wikidata.org/wiki/Q6804172","display_name":"Measure (data warehouse)","level":2,"score":0.48164835572242737},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4685676395893097},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.3508020341396332},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3365367352962494},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.32103872299194336},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.23804661631584167},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.22906213998794556},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1721537709236145},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16292321681976318},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.07496389746665955},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.07041838765144348}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/mhs.2016.7824167","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mhs.2016.7824167","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 International Symposium on Micro-NanoMechatronics and Human Science (MHS)","raw_type":"proceedings-article"},{"id":"mag:2743314329","is_oa":false,"landing_page_url":"http://jglobal.jst.go.jp/en/public/20090422/201702266820841308","pdf_url":null,"source":{"id":"https://openalex.org/S4306512817","display_name":"IEEE Conference Proceedings","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":null,"raw_source_name":"IEEE Conference Proceedings","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320334764","display_name":"Japan Society for the Promotion of Science","ror":"https://ror.org/00hhkn466"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1501740162","https://openalex.org/W1965933207","https://openalex.org/W2018853532","https://openalex.org/W2117844933","https://openalex.org/W2120486607","https://openalex.org/W2573750149"],"related_works":["https://openalex.org/W4244444919","https://openalex.org/W2058246061","https://openalex.org/W2356576053","https://openalex.org/W2060742235","https://openalex.org/W4367182701","https://openalex.org/W2056291978","https://openalex.org/W2078604053","https://openalex.org/W4205661130","https://openalex.org/W196135637","https://openalex.org/W3086568001"],"abstract_inverted_index":{"We":[0],"propose":[1],"a":[2],"method":[3],"to":[4,21,37],"measure":[5,38],"cellular":[6],"elasticity":[7,39],"using":[8,42],"large":[9,27],"compression":[10],"model.":[11],"Unlike":[12],"Hertzian":[13],"contact":[14],"theory,":[15],"this":[16],"model":[17,31],"can":[18],"be":[19],"fit":[20],"the":[22],"experimental":[23],"data":[24],"even":[25],"in":[26],"deformation":[28],"area.":[29],"This":[30],"is":[32],"suitable":[33],"for":[34],"on-chip":[35],"system":[36],"of":[40,44],"cell":[41],"indentation":[43],"flat":[45],"probes.":[46]},"counts_by_year":[],"updated_date":"2026-04-04T16:13:02.066488","created_date":"2025-10-10T00:00:00"}