{"id":"https://openalex.org/W4315489265","doi":"https://doi.org/10.1109/mesa55290.2022.10004470","title":"Noncontact selective laser transfer printing and assembly of micro-sized semiconductor devices","display_name":"Noncontact selective laser transfer printing and assembly of micro-sized semiconductor devices","publication_year":2022,"publication_date":"2022-11-28","ids":{"openalex":"https://openalex.org/W4315489265","doi":"https://doi.org/10.1109/mesa55290.2022.10004470"},"language":"en","primary_location":{"id":"doi:10.1109/mesa55290.2022.10004470","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/mesa55290.2022.10004470","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 18th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5102810411","display_name":"Yuxuan Cao","orcid":"https://orcid.org/0009-0003-2350-6928"},"institutions":[{"id":"https://openalex.org/I4391768272","display_name":"State Key Laboratory of Tribology","ror":"https://ror.org/03h33sq24","country_code":null,"type":"facility","lineage":["https://openalex.org/I4391768272","https://openalex.org/I99065089"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yuxuan Cao","raw_affiliation_strings":["Tsinghua University,State Key Laboratory of Tribology in Advanced Equipment,Department of Mechanical Engineering,Beijing,China","Department of Mechanical Engineering, State Key Laboratory of Tribology in Advanced Equipment, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Tsinghua University,State Key Laboratory of Tribology in Advanced Equipment,Department of Mechanical Engineering,Beijing,China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4391768272"]},{"raw_affiliation_string":"Department of Mechanical Engineering, State Key Laboratory of Tribology in Advanced Equipment, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100631660","display_name":"Zhen Zhang","orcid":"https://orcid.org/0000-0002-9139-2497"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]},{"id":"https://openalex.org/I4391768272","display_name":"State Key Laboratory of Tribology","ror":"https://ror.org/03h33sq24","country_code":null,"type":"facility","lineage":["https://openalex.org/I4391768272","https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhen Zhang","raw_affiliation_strings":["Tsinghua University,State Key Laboratory of Tribology in Advanced Equipment,Department of Mechanical Engineering,Beijing,China","Department of Mechanical Engineering, State Key Laboratory of Tribology in Advanced Equipment, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Tsinghua University,State Key Laboratory of Tribology in Advanced Equipment,Department of Mechanical Engineering,Beijing,China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4391768272"]},{"raw_affiliation_string":"Department of Mechanical Engineering, State Key Laboratory of Tribology in Advanced Equipment, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5102810411"],"corresponding_institution_ids":["https://openalex.org/I4391768272","https://openalex.org/I99065089"],"apc_list":null,"apc_paid":null,"fwci":0.1625,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.44640967,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":100},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10732","display_name":"Laser Material Processing Techniques","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11788","display_name":"Nonlinear Optical Materials Studies","score":0.9948999881744385,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9940999746322632,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transfer-printing","display_name":"Transfer printing","score":0.8815987706184387},{"id":"https://openalex.org/keywords/thermal-transfer","display_name":"Thermal transfer","score":0.7213577032089233},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7060144543647766},{"id":"https://openalex.org/keywords/laser","display_name":"Laser","score":0.6667474508285522},{"id":"https://openalex.org/keywords/semiconductor","display_name":"Semiconductor","score":0.6478810906410217},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6455276608467102},{"id":"https://openalex.org/keywords/semiconductor-laser-theory","display_name":"Semiconductor laser theory","score":0.6015864610671997},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5471089482307434},{"id":"https://openalex.org/keywords/semiconductor-device","display_name":"Semiconductor device","score":0.47725650668144226},{"id":"https://openalex.org/keywords/inkwell","display_name":"Inkwell","score":0.4444100558757782},{"id":"https://openalex.org/keywords/lift","display_name":"Lift (data mining)","score":0.43340128660202026},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.42978528141975403},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.30438828468322754},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.273149311542511},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.23991844058036804}],"concepts":[{"id":"https://openalex.org/C2776226143","wikidata":"https://www.wikidata.org/wiki/Q954883","display_name":"Transfer printing","level":2,"score":0.8815987706184387},{"id":"https://openalex.org/C2779478220","wikidata":"https://www.wikidata.org/wiki/Q3312622","display_name":"Thermal transfer","level":3,"score":0.7213577032089233},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7060144543647766},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.6667474508285522},{"id":"https://openalex.org/C108225325","wikidata":"https://www.wikidata.org/wiki/Q11456","display_name":"Semiconductor","level":2,"score":0.6478810906410217},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6455276608467102},{"id":"https://openalex.org/C121477167","wikidata":"https://www.wikidata.org/wiki/Q17154002","display_name":"Semiconductor laser theory","level":3,"score":0.6015864610671997},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5471089482307434},{"id":"https://openalex.org/C79635011","wikidata":"https://www.wikidata.org/wiki/Q175805","display_name":"Semiconductor device","level":3,"score":0.47725650668144226},{"id":"https://openalex.org/C109693293","wikidata":"https://www.wikidata.org/wiki/Q1496072","display_name":"Inkwell","level":2,"score":0.4444100558757782},{"id":"https://openalex.org/C139002025","wikidata":"https://www.wikidata.org/wiki/Q3001212","display_name":"Lift (data mining)","level":2,"score":0.43340128660202026},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.42978528141975403},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.30438828468322754},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.273149311542511},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.23991844058036804},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mesa55290.2022.10004470","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/mesa55290.2022.10004470","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 18th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[{"id":"https://openalex.org/G8786371516","display_name":null,"funder_award_id":"51875313","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W2039348193","https://openalex.org/W2107180104","https://openalex.org/W2114011086","https://openalex.org/W2150533566","https://openalex.org/W2159454779","https://openalex.org/W2242588122","https://openalex.org/W2379917816","https://openalex.org/W2775760767","https://openalex.org/W3020408682","https://openalex.org/W3023490249","https://openalex.org/W3036203882","https://openalex.org/W3044459136","https://openalex.org/W3206658218"],"related_works":["https://openalex.org/W2591627522","https://openalex.org/W2899148359","https://openalex.org/W2333499860","https://openalex.org/W2015184202","https://openalex.org/W4315489265","https://openalex.org/W2041300085","https://openalex.org/W2464638516","https://openalex.org/W4377942846","https://openalex.org/W2482298628","https://openalex.org/W1904575053"],"abstract_inverted_index":{"Laser":[0],"induced":[1],"forward":[2],"transfer":[3,14,37,61,84,99],"(LIFT)":[4],"technique":[5],"is":[6],"widely":[7],"considered":[8],"as":[9],"an":[10],"efficient":[11],"way":[12],"to":[13,56,92],"print":[15],"and":[16,39,47,52,80],"assemble":[17],"micro-sized":[18],"semiconductor":[19],"devices":[20],"between":[21],"wafers":[22],"at":[23],"a":[24,32,94],"high":[25,76],"speed.":[26],"In":[27],"this":[28],"paper":[29],"we":[30],"propose":[31],"novel":[33],"noncontact":[34],"selective":[35],"laser":[36],"printing":[38,69,100],"assembly":[40],"method":[41,74,88,97],"based":[42],"on":[43],"thermal":[44],"releasing":[45],"tape":[46],"infrared":[48],"lasers.":[49],"Thermal":[50],"analysis":[51],"simulation":[53],"are":[54],"conducted":[55],"illustrate":[57],"the":[58,72],"mechanism":[59],"of":[60,66,82,101],"printing.":[62,85],"The":[63,86],"experiment":[64],"results":[65],"microchip":[67],"arrays":[68],"demonstrate":[70],"that":[71],"proposed":[73,87],"has":[75],"precision,":[77],"full":[78],"selectivity,":[79],"compatibility":[81],"flexible":[83],"shows":[89],"great":[90],"potential":[91],"become":[93],"very":[95],"competitive":[96],"for":[98],"micro-devices.":[102]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2023,"cited_by_count":1}],"updated_date":"2025-12-23T23:11:35.936235","created_date":"2025-10-10T00:00:00"}