{"id":"https://openalex.org/W1579520208","doi":"https://doi.org/10.1109/memea.2015.7145237","title":"Sensors in LTCC-technology with embedded microfluidic features, for medical applications","display_name":"Sensors in LTCC-technology with embedded microfluidic features, for medical applications","publication_year":2015,"publication_date":"2015-05-01","ids":{"openalex":"https://openalex.org/W1579520208","doi":"https://doi.org/10.1109/memea.2015.7145237","mag":"1579520208"},"language":"en","primary_location":{"id":"doi:10.1109/memea.2015.7145237","is_oa":false,"landing_page_url":"https://doi.org/10.1109/memea.2015.7145237","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Symposium on Medical Measurements and Applications (MeMeA) Proceedings","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109250297","display_name":"Romeo Cristian Ciobanu","orcid":null},"institutions":[{"id":"https://openalex.org/I4210108695","display_name":"Gheorghe Asachi Technical University of Ia\u0219i","ror":"https://ror.org/014zxnz40","country_code":"RO","type":"education","lineage":["https://openalex.org/I4210108695"]}],"countries":["RO"],"is_corresponding":true,"raw_author_name":"Romeo Ciobanu","raw_affiliation_strings":["Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Ia\u0178i, Iasi, Romania","Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Iasi, Romania"],"affiliations":[{"raw_affiliation_string":"Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Ia\u0178i, Iasi, Romania","institution_ids":["https://openalex.org/I4210108695"]},{"raw_affiliation_string":"Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Iasi, Romania","institution_ids":["https://openalex.org/I4210108695"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110947261","display_name":"Cristina Schreiner","orcid":null},"institutions":[{"id":"https://openalex.org/I4210108695","display_name":"Gheorghe Asachi Technical University of Ia\u0219i","ror":"https://ror.org/014zxnz40","country_code":"RO","type":"education","lineage":["https://openalex.org/I4210108695"]}],"countries":["RO"],"is_corresponding":false,"raw_author_name":"Cristina Schreiner","raw_affiliation_strings":["Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Ia\u0178i, Iasi, Romania","Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Iasi, Romania"],"affiliations":[{"raw_affiliation_string":"Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Ia\u0178i, Iasi, Romania","institution_ids":["https://openalex.org/I4210108695"]},{"raw_affiliation_string":"Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Iasi, Romania","institution_ids":["https://openalex.org/I4210108695"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060394436","display_name":"Drug Vasile","orcid":null},"institutions":[{"id":"https://openalex.org/I304011483","display_name":"Grigore T. Popa University of Medicine and Pharmacy","ror":"https://ror.org/03hd30t45","country_code":"RO","type":"education","lineage":["https://openalex.org/I304011483"]},{"id":"https://openalex.org/I4210108695","display_name":"Gheorghe Asachi Technical University of Ia\u0219i","ror":"https://ror.org/014zxnz40","country_code":"RO","type":"education","lineage":["https://openalex.org/I4210108695"]}],"countries":["RO"],"is_corresponding":false,"raw_author_name":"Vasile Drug","raw_affiliation_strings":["Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Ia\u0178i, Iasi, Romania","Faculty of General Medicine, \u201cGr.T. Popa\u201d University of Medicine and Pharmacy of Iasi, Romania"],"affiliations":[{"raw_affiliation_string":"Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Ia\u0178i, Iasi, Romania","institution_ids":["https://openalex.org/I4210108695"]},{"raw_affiliation_string":"Faculty of General Medicine, \u201cGr.T. Popa\u201d University of Medicine and Pharmacy of Iasi, Romania","institution_ids":["https://openalex.org/I304011483"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067969017","display_name":"Thomas Gabriel Schreiner","orcid":"https://orcid.org/0000-0002-4495-4004"},"institutions":[{"id":"https://openalex.org/I4210108695","display_name":"Gheorghe Asachi Technical University of Ia\u0219i","ror":"https://ror.org/014zxnz40","country_code":"RO","type":"education","lineage":["https://openalex.org/I4210108695"]},{"id":"https://openalex.org/I304011483","display_name":"Grigore T. Popa University of Medicine and Pharmacy","ror":"https://ror.org/03hd30t45","country_code":"RO","type":"education","lineage":["https://openalex.org/I304011483"]}],"countries":["RO"],"is_corresponding":false,"raw_author_name":"Thomas Schreiner","raw_affiliation_strings":["Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Ia\u0178i, Iasi, Romania","Faculty of General Medicine, \u201cGr.T. Popa\u201d University of Medicine and Pharmacy of Iasi, Romania"],"affiliations":[{"raw_affiliation_string":"Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Ia\u0178i, Iasi, Romania","institution_ids":["https://openalex.org/I4210108695"]},{"raw_affiliation_string":"Faculty of General Medicine, \u201cGr.T. Popa\u201d University of Medicine and Pharmacy of Iasi, Romania","institution_ids":["https://openalex.org/I304011483"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5055277179","display_name":"Dorin Cristian Antal","orcid":"https://orcid.org/0000-0001-8486-1614"},"institutions":[{"id":"https://openalex.org/I304011483","display_name":"Grigore T. Popa University of Medicine and Pharmacy","ror":"https://ror.org/03hd30t45","country_code":"RO","type":"education","lineage":["https://openalex.org/I304011483"]},{"id":"https://openalex.org/I4210108695","display_name":"Gheorghe Asachi Technical University of Ia\u0219i","ror":"https://ror.org/014zxnz40","country_code":"RO","type":"education","lineage":["https://openalex.org/I4210108695"]}],"countries":["RO"],"is_corresponding":false,"raw_author_name":"Dorin Antal","raw_affiliation_strings":["Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Ia\u0178i, Iasi, Romania","Faculty of General Medicine, \u201cGr.T. Popa\u201d University of Medicine and Pharmacy of Iasi, Romania"],"affiliations":[{"raw_affiliation_string":"Faculty of Electrical Engineering, \u201cGheorghe Asachi\u201d Technical University of Ia\u0178i, Iasi, Romania","institution_ids":["https://openalex.org/I4210108695"]},{"raw_affiliation_string":"Faculty of General Medicine, \u201cGr.T. Popa\u201d University of Medicine and Pharmacy of Iasi, Romania","institution_ids":["https://openalex.org/I304011483"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5109250297"],"corresponding_institution_ids":["https://openalex.org/I4210108695"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.03053362,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"407","last_page":"410"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13251","display_name":"Electrical and Thermal Properties of Materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10107","display_name":"Ferroelectric and Piezoelectric Materials","score":0.9962999820709229,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10461","display_name":"Gas Sensing Nanomaterials and Sensors","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microfluidics","display_name":"Microfluidics","score":0.8872120380401611},{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness (evolution)","score":0.743929386138916},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.5907812714576721},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5264078974723816},{"id":"https://openalex.org/keywords/lab-on-a-chip","display_name":"Lab-on-a-chip","score":0.49386197328567505},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.48070889711380005},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.46148648858070374},{"id":"https://openalex.org/keywords/ceramic","display_name":"Ceramic","score":0.453710675239563},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4514172077178955},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4238795042037964},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.38357049226760864},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.37867000699043274},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2884189486503601},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.15077677369117737}],"concepts":[{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.8872120380401611},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.743929386138916},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.5907812714576721},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5264078974723816},{"id":"https://openalex.org/C138942068","wikidata":"https://www.wikidata.org/wiki/Q633261","display_name":"Lab-on-a-chip","level":3,"score":0.49386197328567505},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48070889711380005},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.46148648858070374},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.453710675239563},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4514172077178955},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4238795042037964},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.38357049226760864},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.37867000699043274},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2884189486503601},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15077677369117737},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/memea.2015.7145237","is_oa":false,"landing_page_url":"https://doi.org/10.1109/memea.2015.7145237","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Symposium on Medical Measurements and Applications (MeMeA) Proceedings","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.44999998807907104,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W106176676","https://openalex.org/W187785877","https://openalex.org/W2069097230","https://openalex.org/W2079385509","https://openalex.org/W2165979771","https://openalex.org/W2335515852","https://openalex.org/W6604341573","https://openalex.org/W6607581645"],"related_works":["https://openalex.org/W3103016203","https://openalex.org/W2106238498","https://openalex.org/W2463681241","https://openalex.org/W161520385","https://openalex.org/W2021085378","https://openalex.org/W2136854845","https://openalex.org/W2733260917","https://openalex.org/W2375007538","https://openalex.org/W2387172946","https://openalex.org/W2569660137"],"abstract_inverted_index":{"The":[0,44],"lab-on-chip":[1],"testing":[2],"units":[3],"based":[4],"on":[5],"microfluidics":[6],"technology":[7,46],"are":[8,33],"booming":[9],"nowadays,":[10],"due":[11],"to":[12],"robustness,":[13],"simplicity":[14],"of":[15,34,41,52],"use":[16],"and":[17,26,37,58,64],"reliability.":[18],"Multilayer":[19],"ceramics,":[20],"functionalized":[21],"with":[22,55,60],"nano-scaled":[23],"sensing":[24],"materials,":[25],"further":[27,59],"integrated":[28],"within":[29],"microfluidic":[30,56],"test":[31],"elements,":[32],"great":[35],"challenge":[36],"represent":[38],"the":[39,42,49],"purpose":[40],"paper.":[43],"LTCC":[45],"versatility":[47],"allows":[48],"3D":[50],"integration":[51],"electrochemical":[53],"sensors":[54],"features,":[57],"advanced":[61],"signal":[62],"processing":[63],"wireless":[65],"communication.":[66]},"counts_by_year":[{"year":2022,"cited_by_count":2},{"year":2019,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}