{"id":"https://openalex.org/W2463655288","doi":"https://doi.org/10.1109/mdat.2016.2590979","title":"Versatile Transition-Time Monitoring for Interconnects via Distributed TDC","display_name":"Versatile Transition-Time Monitoring for Interconnects via Distributed TDC","publication_year":2016,"publication_date":"2016-07-13","ids":{"openalex":"https://openalex.org/W2463655288","doi":"https://doi.org/10.1109/mdat.2016.2590979","mag":"2463655288"},"language":"en","primary_location":{"id":"doi:10.1109/mdat.2016.2590979","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mdat.2016.2590979","pdf_url":null,"source":{"id":"https://openalex.org/S4210176427","display_name":"IEEE Design and Test","issn_l":"2168-2356","issn":["2168-2356","2168-2364"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5085636078","display_name":"Shi\u2010Yu Huang","orcid":"https://orcid.org/0000-0002-3721-987X"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Shi-Yu Huang","raw_affiliation_strings":["Electrical Engineering Department, National Tsing Hua University, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101066213","display_name":"Chih\u2010Chieh Cheng","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chih-Chieh Cheng","raw_affiliation_strings":["Electrical Engineering Department, National Tsing Hua University, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112408108","display_name":"Meng\u2010Ting Tsai","orcid":"https://orcid.org/0000-0003-3504-5439"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Meng-Ting Tsai","raw_affiliation_strings":["Electrical Engineering Department, National Tsing Hua University, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001438433","display_name":"Kuanchen Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kuan-Chen Huang","raw_affiliation_strings":["Electrical Engineering Department, National Tsing Hua University, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, National Tsing Hua University, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064587514","display_name":"Kun-Han Tsai","orcid":"https://orcid.org/0000-0001-8919-8663"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Kun-Han Tsai","raw_affiliation_strings":["Silicon Test Solutions, Mentor Graphics, Willsonville, OR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Silicon Test Solutions, Mentor Graphics, Willsonville, OR, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5020407423","display_name":"Wu-Tung Cheng","orcid":"https://orcid.org/0000-0001-6327-2394"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Wu-Tung Cheng","raw_affiliation_strings":["Silicon Test Solutions, Mentor Graphics, Willsonville, OR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Silicon Test Solutions, Mentor Graphics, Willsonville, OR, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.3564,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.63904207,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":96},"biblio":{"volume":"33","issue":"6","first_page":"23","last_page":"30"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6900511980056763},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6802412271499634},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.6746381521224976},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5593774914741516},{"id":"https://openalex.org/keywords/transition-time","display_name":"Transition time","score":0.5030733942985535},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.49970030784606934},{"id":"https://openalex.org/keywords/scheme","display_name":"Scheme (mathematics)","score":0.49862003326416016},{"id":"https://openalex.org/keywords/real-time-computing","display_name":"Real-time computing","score":0.40961673855781555},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.39879143238067627},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25847822427749634},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.15317916870117188},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08892443776130676},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.06194022297859192},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.05696091055870056}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6900511980056763},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6802412271499634},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.6746381521224976},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5593774914741516},{"id":"https://openalex.org/C2986581786","wikidata":"https://www.wikidata.org/wiki/Q377672","display_name":"Transition time","level":2,"score":0.5030733942985535},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.49970030784606934},{"id":"https://openalex.org/C77618280","wikidata":"https://www.wikidata.org/wiki/Q1155772","display_name":"Scheme (mathematics)","level":2,"score":0.49862003326416016},{"id":"https://openalex.org/C79403827","wikidata":"https://www.wikidata.org/wiki/Q3988","display_name":"Real-time computing","level":1,"score":0.40961673855781555},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.39879143238067627},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25847822427749634},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.15317916870117188},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08892443776130676},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.06194022297859192},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.05696091055870056},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mdat.2016.2590979","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mdat.2016.2590979","pdf_url":null,"source":{"id":"https://openalex.org/S4210176427","display_name":"IEEE Design and Test","issn_l":"2168-2356","issn":["2168-2356","2168-2364"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Climate action","id":"https://metadata.un.org/sdg/13","score":0.5899999737739563}],"awards":[{"id":"https://openalex.org/G2185293988","display_name":null,"funder_award_id":"MOST-104-2622-E-007-010","funder_id":"https://openalex.org/F4320322795","funder_display_name":"Ministry of Science and Technology, Taiwan"}],"funders":[{"id":"https://openalex.org/F4320311526","display_name":"McMaster University","ror":"https://ror.org/02fa3aq29"},{"id":"https://openalex.org/F4320322795","display_name":"Ministry of Science and Technology, Taiwan","ror":"https://ror.org/02kv4zf79"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1985664729","https://openalex.org/W1987638749","https://openalex.org/W2005613478","https://openalex.org/W2068262032","https://openalex.org/W2092575805","https://openalex.org/W2098417235","https://openalex.org/W2112414127","https://openalex.org/W2131875329","https://openalex.org/W2159971659","https://openalex.org/W2167037850","https://openalex.org/W2171355521","https://openalex.org/W2188389673","https://openalex.org/W6679594790","https://openalex.org/W6685072077"],"related_works":["https://openalex.org/W2014709025","https://openalex.org/W2155019192","https://openalex.org/W3125341812","https://openalex.org/W1991674760","https://openalex.org/W1668171714","https://openalex.org/W2155297398","https://openalex.org/W4380607112","https://openalex.org/W2218294330","https://openalex.org/W1997278405","https://openalex.org/W4386582991"],"abstract_inverted_index":{"Online":[0],"monitoring":[1,25],"of":[2,10,34],"interconnect":[3],"delay":[4],"is":[5],"important":[6],"for":[7],"early":[8],"detection":[9],"reliability":[11],"hazards,":[12],"especially":[13],"in":[14],"multidie":[15],"ICs.":[16],"This":[17],"article":[18],"presents":[19],"a":[20],"versatile,":[21],"low-overhead,":[22],"and":[23],"nonintrusive":[24],"scheme":[26],"to":[27],"detect":[28],"the":[29],"worst":[30],"case":[31],"transition":[32],"time":[33],"interconnects.":[35]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2019,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}