{"id":"https://openalex.org/W2289762361","doi":"https://doi.org/10.1109/mdat.2015.2455336","title":"High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs","display_name":"High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs","publication_year":2015,"publication_date":"2015-07-10","ids":{"openalex":"https://openalex.org/W2289762361","doi":"https://doi.org/10.1109/mdat.2015.2455336","mag":"2289762361"},"language":"en","primary_location":{"id":"doi:10.1109/mdat.2015.2455336","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mdat.2015.2455336","pdf_url":null,"source":{"id":"https://openalex.org/S4210176427","display_name":"IEEE Design and Test","issn_l":"2168-2356","issn":["2168-2356","2168-2364"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5081139534","display_name":"Man\u2010Ho Lee","orcid":"https://orcid.org/0000-0003-2277-8027"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Manho Lee","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology (KAIST), Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology (KAIST), Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036985968","display_name":"D. Jung","orcid":"https://orcid.org/0000-0001-6920-0332"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Daniel H. Jung","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology (KAIST), Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology (KAIST), Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002881987","display_name":"Heegon Kim","orcid":"https://orcid.org/0000-0003-0728-1346"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Heegon Kim","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology (KAIST), Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology (KAIST), Korea","institution_ids":["https://openalex.org/I157485424"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074429007","display_name":"Jonghyun Cho","orcid":"https://orcid.org/0000-0003-3277-1072"},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jonghyun Cho","raw_affiliation_strings":["Electromagnetic Compatibility Laboratory, Missouri S&T, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electromagnetic Compatibility Laboratory, Missouri S&T, USA","institution_ids":["https://openalex.org/I20382870"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5046623632","display_name":"Joungho Kim","orcid":"https://orcid.org/0000-0003-1376-0781"},"institutions":[{"id":"https://openalex.org/I157485424","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63","country_code":"KR","type":"education","lineage":["https://openalex.org/I157485424"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Joungho Kim","raw_affiliation_strings":["Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology (KAIST), Korea"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Terahertz Interconnection and Package Laboratory, Korea Advanced Institute of Science and Technology (KAIST), Korea","institution_ids":["https://openalex.org/I157485424"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.5831,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.73287601,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"33","issue":"2","first_page":"17","last_page":"29"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.7637321949005127},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7210675477981567},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.7171459197998047},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.7065925598144531},{"id":"https://openalex.org/keywords/dependency","display_name":"Dependency (UML)","score":0.6254450082778931},{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.621424674987793},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5649439096450806},{"id":"https://openalex.org/keywords/noise","display_name":"Noise (video)","score":0.5541980862617493},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.5199014544487},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5002059936523438},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.48077934980392456},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.47907954454421997},{"id":"https://openalex.org/keywords/channel","display_name":"Channel (broadcasting)","score":0.4384613633155823},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2984252870082855},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.24090957641601562},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.1825675368309021},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.15149855613708496},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.11584395170211792},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.09854263067245483},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.08818888664245605},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.07018581032752991},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.06656846404075623}],"concepts":[{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.7637321949005127},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7210675477981567},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.7171459197998047},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.7065925598144531},{"id":"https://openalex.org/C19768560","wikidata":"https://www.wikidata.org/wiki/Q320727","display_name":"Dependency (UML)","level":2,"score":0.6254450082778931},{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.621424674987793},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5649439096450806},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.5541980862617493},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.5199014544487},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5002059936523438},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.48077934980392456},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.47907954454421997},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.4384613633155823},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2984252870082855},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.24090957641601562},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.1825675368309021},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.15149855613708496},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.11584395170211792},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.09854263067245483},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.08818888664245605},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.07018581032752991},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.06656846404075623},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mdat.2015.2455336","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mdat.2015.2455336","pdf_url":null,"source":{"id":"https://openalex.org/S4210176427","display_name":"IEEE Design and Test","issn_l":"2168-2356","issn":["2168-2356","2168-2364"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.44999998807907104,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320317879","display_name":"SK Hynix","ror":null},{"id":"https://openalex.org/F4320321292","display_name":"Seoul National University","ror":"https://ror.org/04h9pn542"},{"id":"https://openalex.org/F4320322091","display_name":"Korea Institute of Science and Technology","ror":"https://ror.org/05kzfa883"},{"id":"https://openalex.org/F4320324161","display_name":"Korea Advanced Institute of Science and Technology","ror":"https://ror.org/05apxxy63"},{"id":"https://openalex.org/F4320332195","display_name":"Samsung","ror":"https://ror.org/04w3jy968"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1480606358","https://openalex.org/W1530384264","https://openalex.org/W2010859335","https://openalex.org/W2075979955","https://openalex.org/W2084413026","https://openalex.org/W2087092955","https://openalex.org/W2114066690","https://openalex.org/W2121007654","https://openalex.org/W2125309181","https://openalex.org/W2126084661","https://openalex.org/W2154634977","https://openalex.org/W2160837841","https://openalex.org/W2161803106","https://openalex.org/W2168589128"],"related_works":["https://openalex.org/W2026710642","https://openalex.org/W4386763889","https://openalex.org/W1606557396","https://openalex.org/W2896557720","https://openalex.org/W2011182927","https://openalex.org/W1992573569","https://openalex.org/W1990828594","https://openalex.org/W2142764951","https://openalex.org/W2743461185","https://openalex.org/W2805905939"],"abstract_inverted_index":{"Noise":[0],"coupling":[1,82],"through":[2],"the":[3,16,20,38,42,63,73,76],"substrate":[4],"or":[5],"silicon":[6],"interposer":[7],"among":[8],"adjacent":[9],"TSVs":[10,35,54,84],"has":[11],"a":[12,69],"significant":[13],"impact":[14,77],"on":[15,28,80],"signal":[17],"integrity":[18],"of":[19,41,78],"TSVs.":[21],"Since":[22],"resistance":[23],"and":[24,55,85],"capacitance":[25],"are":[26],"dependent":[27],"temperature,":[29],"more":[30],"accurate":[31],"electrical":[32],"models":[33,50,64],"for":[34,51,56],"should":[36],"incorporate":[37],"temperature":[39,79],"dependency":[40],"material.":[43],"This":[44],"paper":[45,74],"presents":[46],"high-frequency":[47],"temperature-dependent":[48],"RLGC":[49],"two":[52,57],"neighboring":[53,58],"TSV":[59,86],"channels.":[60,87],"After":[61],"validating":[62],"against":[65],"data":[66],"measured":[67],"from":[68],"fabricated":[70],"test":[71],"vehicle,":[72],"investigates":[75],"noise":[81],"between":[83]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}