{"id":"https://openalex.org/W2065914858","doi":"https://doi.org/10.1109/mdat.2014.2322995","title":"Architecture and Design of Multichannel Millimeter-Wave Wireless NoC","display_name":"Architecture and Design of Multichannel Millimeter-Wave Wireless NoC","publication_year":2014,"publication_date":"2014-05-13","ids":{"openalex":"https://openalex.org/W2065914858","doi":"https://doi.org/10.1109/mdat.2014.2322995","mag":"2065914858"},"language":"en","primary_location":{"id":"doi:10.1109/mdat.2014.2322995","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mdat.2014.2322995","pdf_url":null,"source":{"id":"https://openalex.org/S4210176427","display_name":"IEEE Design and Test","issn_l":"2168-2356","issn":["2168-2356","2168-2364"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041328418","display_name":"Xinmin Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xinmin Yu","raw_affiliation_strings":["Washington State University, Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State University, Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069049013","display_name":"Joe Baylon","orcid":"https://orcid.org/0009-0003-1690-5998"},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Joe Baylon","raw_affiliation_strings":["Washington State University, Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State University, Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047093208","display_name":"Paul Wettin","orcid":null},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul Wettin","raw_affiliation_strings":["Washington State University, Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State University, Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111493404","display_name":"Deukhyoun Heo","orcid":null},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Deukhyoun Heo","raw_affiliation_strings":["Washington State University, Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State University, Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078441163","display_name":"Partha Pratim Pande","orcid":"https://orcid.org/0000-0002-5930-8531"},"institutions":[{"id":"https://openalex.org/I72951846","display_name":"Washington State University","ror":"https://ror.org/05dk0ce17","country_code":"US","type":"education","lineage":["https://openalex.org/I72951846"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Partha Pratim Pande","raw_affiliation_strings":["Washington State University, Pullman, WA, USA","Washington State University, Pullman,WA USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Washington State University, Pullman, WA, USA","institution_ids":["https://openalex.org/I72951846"]},{"raw_affiliation_string":"Washington State University, Pullman,WA USA","institution_ids":["https://openalex.org/I72951846"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049231448","display_name":"Shahriar Mirabbasi","orcid":"https://orcid.org/0000-0001-8852-1633"},"institutions":[{"id":"https://openalex.org/I141945490","display_name":"University of British Columbia","ror":"https://ror.org/03rmrcq20","country_code":"CA","type":"education","lineage":["https://openalex.org/I141945490"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Shahriar Mirabbasi","raw_affiliation_strings":["University of British Columbia, Vancouver, BC, Canada","Univ of British Columbia, Vancouver, BC, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of British Columbia, Vancouver, BC, Canada","institution_ids":["https://openalex.org/I141945490"]},{"raw_affiliation_string":"Univ of British Columbia, Vancouver, BC, Canada","institution_ids":["https://openalex.org/I141945490"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":8.9973,"has_fulltext":false,"cited_by_count":98,"citation_normalized_percentile":{"value":0.97983637,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":96,"max":100},"biblio":{"volume":"31","issue":"6","first_page":"19","last_page":"28"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9728999733924866,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.9571999907493591,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7723338603973389},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6232510209083557},{"id":"https://openalex.org/keywords/latency","display_name":"Latency (audio)","score":0.6164326667785645},{"id":"https://openalex.org/keywords/network-on-a-chip","display_name":"Network on a chip","score":0.5940228700637817},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.5606689453125},{"id":"https://openalex.org/keywords/power-consumption","display_name":"Power consumption","score":0.5279796719551086},{"id":"https://openalex.org/keywords/architecture","display_name":"Architecture","score":0.5153459906578064},{"id":"https://openalex.org/keywords/physical-layer","display_name":"Physical layer","score":0.48851311206817627},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.4751341640949249},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4676456153392792},{"id":"https://openalex.org/keywords/low-latency","display_name":"Low latency (capital markets)","score":0.42113491892814636},{"id":"https://openalex.org/keywords/design-methods","display_name":"Design methods","score":0.410675972700119},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.40696048736572266},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.30444201827049255},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25345516204833984},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.24086353182792664}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7723338603973389},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6232510209083557},{"id":"https://openalex.org/C82876162","wikidata":"https://www.wikidata.org/wiki/Q17096504","display_name":"Latency (audio)","level":2,"score":0.6164326667785645},{"id":"https://openalex.org/C128519102","wikidata":"https://www.wikidata.org/wiki/Q339554","display_name":"Network on a chip","level":2,"score":0.5940228700637817},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.5606689453125},{"id":"https://openalex.org/C2984118289","wikidata":"https://www.wikidata.org/wiki/Q29954","display_name":"Power consumption","level":3,"score":0.5279796719551086},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.5153459906578064},{"id":"https://openalex.org/C19247436","wikidata":"https://www.wikidata.org/wiki/Q192727","display_name":"Physical layer","level":3,"score":0.48851311206817627},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.4751341640949249},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4676456153392792},{"id":"https://openalex.org/C46637626","wikidata":"https://www.wikidata.org/wiki/Q6693015","display_name":"Low latency (capital markets)","level":2,"score":0.42113491892814636},{"id":"https://openalex.org/C138852830","wikidata":"https://www.wikidata.org/wiki/Q2292993","display_name":"Design methods","level":2,"score":0.410675972700119},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.40696048736572266},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.30444201827049255},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25345516204833984},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.24086353182792664},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C153349607","wikidata":"https://www.wikidata.org/wiki/Q36649","display_name":"Visual arts","level":1,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mdat.2014.2322995","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mdat.2014.2322995","pdf_url":null,"source":{"id":"https://openalex.org/S4210176427","display_name":"IEEE Design and Test","issn_l":"2168-2356","issn":["2168-2356","2168-2364"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.8899999856948853,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320310709","display_name":"CMC Microsystems","ror":"https://ror.org/03k70ea39"},{"id":"https://openalex.org/F4320314073","display_name":"Joint Center for Aerospace Technology Innovation","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W35708471","https://openalex.org/W1963638851","https://openalex.org/W1991493852","https://openalex.org/W2002123074","https://openalex.org/W2023264348","https://openalex.org/W2025879446","https://openalex.org/W2108649352","https://openalex.org/W2126475076","https://openalex.org/W2127795402","https://openalex.org/W2145021036","https://openalex.org/W2147657366","https://openalex.org/W3150685302","https://openalex.org/W4238549726","https://openalex.org/W6793601454"],"related_works":["https://openalex.org/W4286787716","https://openalex.org/W3035129152","https://openalex.org/W4287854872","https://openalex.org/W3089263585","https://openalex.org/W2460691506","https://openalex.org/W2145133125","https://openalex.org/W3034055398","https://openalex.org/W2097655658","https://openalex.org/W2170685163","https://openalex.org/W2004591297"],"abstract_inverted_index":{"The":[0,16,63],"network-on-chip":[1],"(NoC)":[2],"is":[3,27],"an":[4],"enabling":[5],"methodology":[6,54],"to":[7,30],"integrate":[8],"many":[9],"embedded":[10],"cores":[11],"on":[12],"a":[13,21,56],"single":[14],"die.":[15],"existing":[17],"method":[18],"of":[19,39],"implementing":[20],"NoC":[22,58],"with":[23,59],"planar":[24],"metal":[25],"interconnects":[26],"deficient":[28],"due":[29],"high":[31],"latency":[32],"and":[33,71],"significant":[34],"power":[35],"consumption":[36],"arising":[37],"out":[38],"multi-hop":[40],"links":[41],"used":[42],"in":[43],"data":[44],"exchanges.":[45],"To":[46],"address":[47],"these":[48],"problems,":[49],"this":[50],"paper":[51],"introduces":[52],"design":[53,70],"for":[55],"wireless":[57],"multiple":[60],"nonoverlapping":[61],"channels.":[62],"authors":[64],"present":[65],"both":[66],"the":[67,72],"physical":[68],"layer":[69],"overall":[73],"interconnection":[74],"architecture.":[75]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":6},{"year":2023,"cited_by_count":5},{"year":2022,"cited_by_count":10},{"year":2021,"cited_by_count":11},{"year":2020,"cited_by_count":9},{"year":2019,"cited_by_count":10},{"year":2018,"cited_by_count":19},{"year":2017,"cited_by_count":7},{"year":2016,"cited_by_count":12},{"year":2015,"cited_by_count":6}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}