{"id":"https://openalex.org/W2001530879","doi":"https://doi.org/10.1109/mdat.2014.2316030","title":"DAC2013 Visionary Talk","display_name":"DAC2013 Visionary Talk","publication_year":2014,"publication_date":"2014-04-01","ids":{"openalex":"https://openalex.org/W2001530879","doi":"https://doi.org/10.1109/mdat.2014.2316030","mag":"2001530879"},"language":"en","primary_location":{"id":"doi:10.1109/mdat.2014.2316030","is_oa":true,"landing_page_url":"https://doi.org/10.1109/mdat.2014.2316030","pdf_url":"https://ieeexplore.ieee.org/ielx7/6221038/6822658/06822689.pdf","source":{"id":"https://openalex.org/S4210176427","display_name":"IEEE Design and Test","issn_l":"2168-2356","issn":["2168-2356","2168-2364"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test","raw_type":"journal-article"},"type":"conference-abstract","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://ieeexplore.ieee.org/ielx7/6221038/6822658/06822689.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5032672342","display_name":"Lip-Bu Tan","orcid":null},"institutions":[{"id":"https://openalex.org/I66217453","display_name":"Cadence Design Systems (United States)","ror":"https://ror.org/04w8xa018","country_code":"US","type":"company","lineage":["https://openalex.org/I66217453"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Lip-Bu Tan","raw_affiliation_strings":["Cadence Design Systems"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Cadence Design Systems","institution_ids":["https://openalex.org/I66217453"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5032672342"],"corresponding_institution_ids":["https://openalex.org/I66217453"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":true,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"31","issue":"2","first_page":"16","last_page":"18"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10763","display_name":"Digital Transformation in Industry","score":0.04390000179409981,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10763","display_name":"Digital Transformation in Industry","score":0.04390000179409981,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cloud-computing","display_name":"Cloud computing","score":0.7066394090652466},{"id":"https://openalex.org/keywords/wearable-computer","display_name":"Wearable computer","score":0.5843985676765442},{"id":"https://openalex.org/keywords/semiconductor-industry","display_name":"Semiconductor industry","score":0.5466778874397278},{"id":"https://openalex.org/keywords/wearable-technology","display_name":"Wearable technology","score":0.5328189730644226},{"id":"https://openalex.org/keywords/the-internet","display_name":"The Internet","score":0.5234410166740417},{"id":"https://openalex.org/keywords/internet-of-things","display_name":"Internet of Things","score":0.5230063796043396},{"id":"https://openalex.org/keywords/big-data","display_name":"Big data","score":0.4528842270374298},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4221614599227905},{"id":"https://openalex.org/keywords/world-wide-web","display_name":"World Wide Web","score":0.36727404594421387},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.36548301577568054},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.36073291301727295},{"id":"https://openalex.org/keywords/business","display_name":"Business","score":0.3212320804595947},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.15535056591033936},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.11172845959663391}],"concepts":[{"id":"https://openalex.org/C79974875","wikidata":"https://www.wikidata.org/wiki/Q483639","display_name":"Cloud computing","level":2,"score":0.7066394090652466},{"id":"https://openalex.org/C150594956","wikidata":"https://www.wikidata.org/wiki/Q1334829","display_name":"Wearable computer","level":2,"score":0.5843985676765442},{"id":"https://openalex.org/C2987888538","wikidata":"https://www.wikidata.org/wiki/Q2986369","display_name":"Semiconductor industry","level":2,"score":0.5466778874397278},{"id":"https://openalex.org/C54290928","wikidata":"https://www.wikidata.org/wiki/Q4845080","display_name":"Wearable technology","level":3,"score":0.5328189730644226},{"id":"https://openalex.org/C110875604","wikidata":"https://www.wikidata.org/wiki/Q75","display_name":"The Internet","level":2,"score":0.5234410166740417},{"id":"https://openalex.org/C81860439","wikidata":"https://www.wikidata.org/wiki/Q251212","display_name":"Internet of Things","level":2,"score":0.5230063796043396},{"id":"https://openalex.org/C75684735","wikidata":"https://www.wikidata.org/wiki/Q858810","display_name":"Big data","level":2,"score":0.4528842270374298},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4221614599227905},{"id":"https://openalex.org/C136764020","wikidata":"https://www.wikidata.org/wiki/Q466","display_name":"World Wide Web","level":1,"score":0.36727404594421387},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.36548301577568054},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.36073291301727295},{"id":"https://openalex.org/C144133560","wikidata":"https://www.wikidata.org/wiki/Q4830453","display_name":"Business","level":0,"score":0.3212320804595947},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.15535056591033936},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.11172845959663391},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mdat.2014.2316030","is_oa":true,"landing_page_url":"https://doi.org/10.1109/mdat.2014.2316030","pdf_url":"https://ieeexplore.ieee.org/ielx7/6221038/6822658/06822689.pdf","source":{"id":"https://openalex.org/S4210176427","display_name":"IEEE Design and Test","issn_l":"2168-2356","issn":["2168-2356","2168-2364"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1109/mdat.2014.2316030","is_oa":true,"landing_page_url":"https://doi.org/10.1109/mdat.2014.2316030","pdf_url":"https://ieeexplore.ieee.org/ielx7/6221038/6822658/06822689.pdf","source":{"id":"https://openalex.org/S4210176427","display_name":"IEEE Design and Test","issn_l":"2168-2356","issn":["2168-2356","2168-2364"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Design & Test","raw_type":"journal-article"},"sustainable_development_goals":[{"score":0.6600000262260437,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W2001530879.pdf","grobid_xml":"https://content.openalex.org/works/W2001530879.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4291951468","https://openalex.org/W3090300519","https://openalex.org/W4250401876","https://openalex.org/W2514492205","https://openalex.org/W2943851981","https://openalex.org/W2095299560","https://openalex.org/W2907667791","https://openalex.org/W3047461507","https://openalex.org/W3126390843","https://openalex.org/W4245880644"],"abstract_inverted_index":{"This":[0],"article":[1],"is":[2],"based":[3],"on":[4],"a":[5],"visionary":[6],"talk":[7],"presented":[8],"at":[9],"the":[10,14,21,26],"50th":[11],"DAC.":[12],"emphasizes":[13],"need":[15],"for":[16],"innovation":[17],"and":[18,35],"collaboration":[19],"in":[20,29],"semiconductor":[22],"industry":[23],"to":[24],"meet":[25],"new":[27],"opportunities":[28],"mobile":[30],"internet,":[31],"cloud,":[32],"big":[33],"data":[34],"wearable":[36],"devices.":[37]},"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}