{"id":"https://openalex.org/W2101282404","doi":"https://doi.org/10.1109/mcom.2008.4623721","title":"Deep submicron CMOS technology enables system-on-chip for wireless communications ICs","display_name":"Deep submicron CMOS technology enables system-on-chip for wireless communications ICs","publication_year":2008,"publication_date":"2008-09-01","ids":{"openalex":"https://openalex.org/W2101282404","doi":"https://doi.org/10.1109/mcom.2008.4623721","mag":"2101282404"},"language":"en","primary_location":{"id":"doi:10.1109/mcom.2008.4623721","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mcom.2008.4623721","pdf_url":null,"source":{"id":"https://openalex.org/S158797327","display_name":"IEEE Communications Magazine","issn_l":"0163-6804","issn":["0163-6804","1558-1896"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Communications Magazine","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5029252449","display_name":"M. Hammes","orcid":null},"institutions":[{"id":"https://openalex.org/I4210105601","display_name":"Infineon Technologies (United Kingdom)","ror":"https://ror.org/017ptvx95","country_code":"GB","type":"company","lineage":["https://openalex.org/I137594350","https://openalex.org/I4210105601"]}],"countries":["GB"],"is_corresponding":true,"raw_author_name":"M. Hammes","raw_affiliation_strings":["Infineon Technologies"],"affiliations":[{"raw_affiliation_string":"Infineon Technologies","institution_ids":["https://openalex.org/I4210105601"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033876563","display_name":"C. Kranz","orcid":null},"institutions":[{"id":"https://openalex.org/I4210105601","display_name":"Infineon Technologies (United Kingdom)","ror":"https://ror.org/017ptvx95","country_code":"GB","type":"company","lineage":["https://openalex.org/I137594350","https://openalex.org/I4210105601"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"C. Kranz","raw_affiliation_strings":["Infineon Technologies"],"affiliations":[{"raw_affiliation_string":"Infineon Technologies","institution_ids":["https://openalex.org/I4210105601"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058401156","display_name":"D. Seippel","orcid":null},"institutions":[{"id":"https://openalex.org/I4210105601","display_name":"Infineon Technologies (United Kingdom)","ror":"https://ror.org/017ptvx95","country_code":"GB","type":"company","lineage":["https://openalex.org/I137594350","https://openalex.org/I4210105601"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"D. Seippel","raw_affiliation_strings":["Development Center, Infineon Technologies, Duisburg"],"affiliations":[{"raw_affiliation_string":"Development Center, Infineon Technologies, Duisburg","institution_ids":["https://openalex.org/I4210105601"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5029252449"],"corresponding_institution_ids":["https://openalex.org/I4210105601"],"apc_list":null,"apc_paid":null,"fwci":0.9988,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.78131746,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"46","issue":"9","first_page":"154","last_page":"161"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10323","display_name":"Analog and Mixed-Signal Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11417","display_name":"Advancements in PLL and VCO Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7494188547134399},{"id":"https://openalex.org/keywords/bluetooth","display_name":"Bluetooth","score":0.687357485294342},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6384899616241455},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.595732569694519},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.49356305599212646},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.4769412577152252},{"id":"https://openalex.org/keywords/gsm","display_name":"GSM","score":0.46863532066345215},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4630676805973053},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.45307159423828125},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4295113980770111},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4264746308326721},{"id":"https://openalex.org/keywords/mixed-signal-integrated-circuit","display_name":"Mixed-signal integrated circuit","score":0.41645729541778564},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.37088513374328613},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.25961753726005554},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17520847916603088}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7494188547134399},{"id":"https://openalex.org/C546215728","wikidata":"https://www.wikidata.org/wiki/Q39531","display_name":"Bluetooth","level":3,"score":0.687357485294342},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6384899616241455},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.595732569694519},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.49356305599212646},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.4769412577152252},{"id":"https://openalex.org/C59201141","wikidata":"https://www.wikidata.org/wiki/Q46904","display_name":"GSM","level":2,"score":0.46863532066345215},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4630676805973053},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.45307159423828125},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4295113980770111},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4264746308326721},{"id":"https://openalex.org/C62907940","wikidata":"https://www.wikidata.org/wiki/Q1541329","display_name":"Mixed-signal integrated circuit","level":3,"score":0.41645729541778564},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.37088513374328613},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.25961753726005554},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17520847916603088},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mcom.2008.4623721","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mcom.2008.4623721","pdf_url":null,"source":{"id":"https://openalex.org/S158797327","display_name":"IEEE Communications Magazine","issn_l":"0163-6804","issn":["0163-6804","1558-1896"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Communications Magazine","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.6600000262260437,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W1540199280","https://openalex.org/W1569484296","https://openalex.org/W1680416637","https://openalex.org/W2029316851","https://openalex.org/W2034537707","https://openalex.org/W2078251819","https://openalex.org/W2096611088","https://openalex.org/W2103620085","https://openalex.org/W2109610839","https://openalex.org/W2110864781","https://openalex.org/W2145287321","https://openalex.org/W2164582257","https://openalex.org/W2182987136","https://openalex.org/W6637310844"],"related_works":["https://openalex.org/W2166386585","https://openalex.org/W2537272291","https://openalex.org/W2788109704","https://openalex.org/W2145750518","https://openalex.org/W2557301296","https://openalex.org/W2138543354","https://openalex.org/W2147616974","https://openalex.org/W962052505","https://openalex.org/W2149313247","https://openalex.org/W969526214"],"abstract_inverted_index":{"Deep":[0],"submicron":[1],"CMOS":[2],"technologies":[3],"enable":[4],"sophisticated":[5],"system-on-chip":[6],"technologies,":[7],"moving":[8],"beyond":[9],"traditional":[10],"integration":[11,26,69],"of":[12,25,41,54],"digital":[13,44],"functionality":[14],"to":[15,34,47],"include":[16],"mixed-signal,":[17],"RF,":[18],"and":[19,51],"power":[20],"management":[21],"capabilities.":[22],"New":[23],"levels":[24],"bring":[27],"with":[28,60],"them":[29],"additional":[30],"challenges":[31],"that":[32],"need":[33],"be":[35],"addressed":[36],"such":[37],"as":[38,76,78],"the":[39,52,58],"cross-coupling":[40],"noise":[42],"from":[43],"switching":[45],"circuits":[46],"sensitive":[48],"analog/RF":[49],"blocks,":[50],"handling":[53],"high":[55],"voltages":[56],"by":[57],"PMU":[59],"decreasing":[61],"maximum":[62],"gate/drain-source":[63],"voltages.":[64],"This":[65],"work":[66],"describes":[67],"SoC":[68],"in":[70,79],"local":[71],"area":[72],"wireless":[73],"(e.g.,":[74,82],"Bluetooth)":[75],"well":[77],"cellular":[80],"applications":[81],"GSM).":[83]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}