{"id":"https://openalex.org/W2079932085","doi":"https://doi.org/10.1109/mc.1980.1653424","title":"Workshop Report: Computer Packaging Workshop Explores Impact of LSI","display_name":"Workshop Report: Computer Packaging Workshop Explores Impact of LSI","publication_year":1980,"publication_date":"1980-11-01","ids":{"openalex":"https://openalex.org/W2079932085","doi":"https://doi.org/10.1109/mc.1980.1653424","mag":"2079932085"},"language":"en","primary_location":{"id":"doi:10.1109/mc.1980.1653424","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mc.1980.1653424","pdf_url":null,"source":{"id":"https://openalex.org/S178916657","display_name":"Computer","issn_l":"0018-9162","issn":["0018-9162","1558-0814"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320439","host_organization_name":"IEEE Computer Society","host_organization_lineage":["https://openalex.org/P4310320439","https://openalex.org/P4310319808"],"host_organization_lineage_names":["IEEE Computer Society","Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Computer","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026624587","display_name":"Balde","orcid":null},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Balde","raw_affiliation_strings":["Computer Packaging TC"],"affiliations":[{"raw_affiliation_string":"Computer Packaging TC","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5026624587"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.21482792,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"13","issue":"11","first_page":"100","last_page":"103"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.849399983882904,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.849399983882904,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12238","display_name":"Green IT and Sustainability","score":0.8284000158309937,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.8251000046730042,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6571102738380432},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.4447157382965088},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.34407317638397217},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.33112525939941406},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20991745591163635}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6571102738380432},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.4447157382965088},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.34407317638397217},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.33112525939941406},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20991745591163635}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/mc.1980.1653424","is_oa":false,"landing_page_url":"https://doi.org/10.1109/mc.1980.1653424","pdf_url":null,"source":{"id":"https://openalex.org/S178916657","display_name":"Computer","issn_l":"0018-9162","issn":["0018-9162","1558-0814"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310320439","host_organization_name":"IEEE Computer Society","host_organization_lineage":["https://openalex.org/P4310320439","https://openalex.org/P4310319808"],"host_organization_lineage_names":["IEEE Computer Society","Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Computer","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2390279801","https://openalex.org/W2358668433","https://openalex.org/W2376932109","https://openalex.org/W2001405890","https://openalex.org/W2382290278","https://openalex.org/W2478288626","https://openalex.org/W4391913857","https://openalex.org/W2350741829","https://openalex.org/W2530322880"],"abstract_inverted_index":{"A":[0],"greater":[1],"percentage":[2],"of":[3,14],"total":[4],"system":[5,16,23],"cost":[6],"will":[7],"be":[8],"in":[9],"packaging,":[10],"making":[11],"the":[12,15],"role":[13],"packaging":[17],"engineer":[18],"crucial":[19],"for":[20],"ensuring":[21],"reasonable":[22],"cost.":[24]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}