{"id":"https://openalex.org/W2563566737","doi":"https://doi.org/10.1109/lra.2016.2645507","title":"Automatic Virtual Metrology and Target Value Adjustment for Mass Customization","display_name":"Automatic Virtual Metrology and Target Value Adjustment for Mass Customization","publication_year":2016,"publication_date":"2016-12-28","ids":{"openalex":"https://openalex.org/W2563566737","doi":"https://doi.org/10.1109/lra.2016.2645507","mag":"2563566737"},"language":"en","primary_location":{"id":"doi:10.1109/lra.2016.2645507","is_oa":false,"landing_page_url":"https://doi.org/10.1109/lra.2016.2645507","pdf_url":null,"source":{"id":"https://openalex.org/S4210169774","display_name":"IEEE Robotics and Automation Letters","issn_l":"2377-3766","issn":["2377-3766","2377-3774"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Robotics and Automation Letters","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5077724183","display_name":"Hao Tieng","orcid":"https://orcid.org/0000-0002-6644-7708"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Hao Tieng","raw_affiliation_strings":["Institute of Manufacturing Information and Systems, National Cheng Kung University, Tainan, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Manufacturing Information and Systems, National Cheng Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052764399","display_name":"Chun-Fang Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Fang Chen","raw_affiliation_strings":["Institute of Manufacturing Information and Systems, National Cheng Kung University, Tainan, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Manufacturing Information and Systems, National Cheng Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037509897","display_name":"Fan\u2010Tien Cheng","orcid":"https://orcid.org/0000-0001-8201-223X"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Fan-Tien Cheng","raw_affiliation_strings":["Institute of Manufacturing Information and Systems, National Cheng Kung University, Tainan, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Manufacturing Information and Systems, National Cheng Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5082062201","display_name":"Haw\u2010Ching Yang","orcid":"https://orcid.org/0000-0001-6527-4879"},"institutions":[{"id":"https://openalex.org/I109289231","display_name":"National Kaohsiung First University of Science and Technology","ror":"https://ror.org/03858r716","country_code":"TW","type":"education","lineage":["https://openalex.org/I109289231"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Haw-Ching Yang","raw_affiliation_strings":["Institute of Electrical Engineering, National Kaohsiung First University of Science and Technology, Kaohsiung, Taiwan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Electrical Engineering, National Kaohsiung First University of Science and Technology, Kaohsiung, Taiwan","institution_ids":["https://openalex.org/I109289231"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.8675,"has_fulltext":false,"cited_by_count":20,"citation_normalized_percentile":{"value":0.87609267,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":"2","issue":"2","first_page":"546","last_page":"553"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.994700014591217,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11729","display_name":"Product Development and Customization","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/1405","display_name":"Management of Technology and Innovation"},"field":{"id":"https://openalex.org/fields/14","display_name":"Business, Management and Accounting"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/mass-customization","display_name":"Mass customization","score":0.8626958131790161},{"id":"https://openalex.org/keywords/metrology","display_name":"Metrology","score":0.7388601303100586},{"id":"https://openalex.org/keywords/automation","display_name":"Automation","score":0.7114921808242798},{"id":"https://openalex.org/keywords/personalization","display_name":"Personalization","score":0.6757819652557373},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.640977144241333},{"id":"https://openalex.org/keywords/machining","display_name":"Machining","score":0.5319963097572327},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.49711087346076965},{"id":"https://openalex.org/keywords/production","display_name":"Production (economics)","score":0.4821776747703552},{"id":"https://openalex.org/keywords/production-line","display_name":"Production line","score":0.48216599225997925},{"id":"https://openalex.org/keywords/quality","display_name":"Quality (philosophy)","score":0.4324912428855896},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.41148102283477783},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.34735655784606934},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3375210165977478},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.14509618282318115},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.08234310150146484}],"concepts":[{"id":"https://openalex.org/C72414096","wikidata":"https://www.wikidata.org/wiki/Q1367461","display_name":"Mass customization","level":3,"score":0.8626958131790161},{"id":"https://openalex.org/C195766429","wikidata":"https://www.wikidata.org/wiki/Q394","display_name":"Metrology","level":2,"score":0.7388601303100586},{"id":"https://openalex.org/C115901376","wikidata":"https://www.wikidata.org/wiki/Q184199","display_name":"Automation","level":2,"score":0.7114921808242798},{"id":"https://openalex.org/C183003079","wikidata":"https://www.wikidata.org/wiki/Q1000371","display_name":"Personalization","level":2,"score":0.6757819652557373},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.640977144241333},{"id":"https://openalex.org/C523214423","wikidata":"https://www.wikidata.org/wiki/Q192047","display_name":"Machining","level":2,"score":0.5319963097572327},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.49711087346076965},{"id":"https://openalex.org/C2778348673","wikidata":"https://www.wikidata.org/wiki/Q739302","display_name":"Production (economics)","level":2,"score":0.4821776747703552},{"id":"https://openalex.org/C99862985","wikidata":"https://www.wikidata.org/wiki/Q10858068","display_name":"Production line","level":2,"score":0.48216599225997925},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.4324912428855896},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.41148102283477783},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.34735655784606934},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3375210165977478},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.14509618282318115},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.08234310150146484},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C136764020","wikidata":"https://www.wikidata.org/wiki/Q466","display_name":"World Wide Web","level":1,"score":0.0},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C139719470","wikidata":"https://www.wikidata.org/wiki/Q39680","display_name":"Macroeconomics","level":1,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/lra.2016.2645507","is_oa":false,"landing_page_url":"https://doi.org/10.1109/lra.2016.2645507","pdf_url":null,"source":{"id":"https://openalex.org/S4210169774","display_name":"IEEE Robotics and Automation Letters","issn_l":"2377-3766","issn":["2377-3766","2377-3774"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Robotics and Automation Letters","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5199999809265137,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":20,"referenced_works":["https://openalex.org/W1499347609","https://openalex.org/W1570385038","https://openalex.org/W1971851470","https://openalex.org/W1972844536","https://openalex.org/W2018221580","https://openalex.org/W2055555756","https://openalex.org/W2062978452","https://openalex.org/W2085914392","https://openalex.org/W2127230658","https://openalex.org/W2159554491","https://openalex.org/W2162251039","https://openalex.org/W2204334451","https://openalex.org/W2228461672","https://openalex.org/W2279096469","https://openalex.org/W2319358815","https://openalex.org/W2474845168","https://openalex.org/W2617888406","https://openalex.org/W3122455524","https://openalex.org/W6629906839","https://openalex.org/W6634071459"],"related_works":["https://openalex.org/W2351608480","https://openalex.org/W2279096469","https://openalex.org/W2370044144","https://openalex.org/W2039425720","https://openalex.org/W2388058536","https://openalex.org/W2084835788","https://openalex.org/W4226519216","https://openalex.org/W1505698635","https://openalex.org/W2172117203","https://openalex.org/W2149188425"],"abstract_inverted_index":{"One":[0],"of":[1,5,25,29,91,109,170,177],"the":[2,35,107,117,125,136,152,168,175,178,181],"core":[3],"values":[4],"Industry":[6,32],"4.0":[7,33],"targets":[8],"to":[9,83,86,94,115,138,157],"integrate":[10],"people's":[11],"demand":[12],"into":[13,145],"manufacturing":[14,37,101],"for":[15,21,100,163],"enhanced":[16],"products,":[17],"systems,":[18],"and":[19,72,147,165],"services":[20],"a":[22,64,88],"wider":[23],"variety":[24],"increasingly":[26],"personalized":[27],"customization":[28,44,161],"products.":[30],"Thus,":[31,75],"advances":[34],"traditional":[36],"techniques":[38],"from":[39],"mass":[40,43],"production":[41],"toward":[42],"(MC).":[45],"Take":[46],"wheel":[47,103],"machining":[48],"automation":[49],"(WMA)":[50],"as":[51],"an":[52],"example.":[53],"To":[54,105,173],"meet":[55,106],"MC":[56,79,110,171],"expectations,":[57],"manufacturers":[58],"should":[59],"offer":[60],"customized":[61],"wheels":[62],"at":[63],"large":[65],"scale":[66],"with":[67,78,124,142],"low":[68],"cost,":[69],"short":[70],"lead-time,":[71],"high":[73,89],"quality.":[74],"WMA":[76],"cells":[77],"capability":[80,162],"are":[81],"requested":[82],"be":[84],"designed":[85,156],"have":[87],"degree":[90],"quick":[92],"responsiveness":[93],"accurately":[95],"react":[96],"on":[97],"machining-condition":[98],"changes":[99],"different":[102],"types.":[104],"requirements":[108],"production,":[111],"this":[112],"work":[113],"proposes":[114],"apply":[116],"automatic":[118],"virtual":[119],"metrology":[120,143],"(AVM)":[121],"system":[122,132],"together":[123],"so-called":[126],"target-value-adjustment":[127],"(TVA)":[128],"scheme.":[129],"The":[130],"AVM":[131],"was":[133],"developed":[134],"by":[135],"authors":[137],"convert":[139],"sampling":[140],"inspections":[141],"delay":[144],"real-time":[146],"on-line":[148],"total":[149],"inspection,":[150],"while":[151],"TVA":[153],"scheme":[154],"is":[155,188],"enhance":[158],"AVM's":[159],"adaptive":[160],"automatically":[164],"rapidly":[166],"accomplishing":[167],"goals":[169],"production.":[172],"demonstrate":[174],"versatility":[176],"AVM-plus-TVA":[179],"approach,":[180],"other":[182],"example":[183],"in":[184],"semiconductor":[185],"etching":[186],"process":[187],"also":[189],"illustrated.":[190]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":7},{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":3}],"updated_date":"2026-07-23T08:03:31.855105","created_date":"2025-10-10T00:00:00"}