{"id":"https://openalex.org/W3024421094","doi":"https://doi.org/10.1109/lats49555.2020.9093674","title":"Testing Heatsink Faults in Power Transistors by means of Thermal Model","display_name":"Testing Heatsink Faults in Power Transistors by means of Thermal Model","publication_year":2020,"publication_date":"2020-03-01","ids":{"openalex":"https://openalex.org/W3024421094","doi":"https://doi.org/10.1109/lats49555.2020.9093674","mag":"3024421094"},"language":"en","primary_location":{"id":"doi:10.1109/lats49555.2020.9093674","is_oa":false,"landing_page_url":"https://doi.org/10.1109/lats49555.2020.9093674","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE Latin-American Test Symposium (LATS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5044545889","display_name":"Davide Piumatti","orcid":"https://orcid.org/0000-0001-5156-6272"},"institutions":[{"id":"https://openalex.org/I177477856","display_name":"Politecnico di Torino","ror":"https://ror.org/00bgk9508","country_code":"IT","type":"education","lineage":["https://openalex.org/I177477856"]}],"countries":["IT"],"is_corresponding":true,"raw_author_name":"Davide Piumatti","raw_affiliation_strings":["Dip. Automatica e Informatica (DAUIN), Politecnico di Torino, Torino, Italy"],"affiliations":[{"raw_affiliation_string":"Dip. Automatica e Informatica (DAUIN), Politecnico di Torino, Torino, Italy","institution_ids":["https://openalex.org/I177477856"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033472453","display_name":"Matteo Vincenzo Quitadamo","orcid":"https://orcid.org/0000-0002-1443-7452"},"institutions":[{"id":"https://openalex.org/I177477856","display_name":"Politecnico di Torino","ror":"https://ror.org/00bgk9508","country_code":"IT","type":"education","lineage":["https://openalex.org/I177477856"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Matteo Vincenzo Quitadamo","raw_affiliation_strings":["Dip. Elettronica e Telecomunicazioni (DET), Politecnico di Torino, Torino, Italy"],"affiliations":[{"raw_affiliation_string":"Dip. Elettronica e Telecomunicazioni (DET), Politecnico di Torino, Torino, Italy","institution_ids":["https://openalex.org/I177477856"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058555274","display_name":"M. Sonza Reorda","orcid":"https://orcid.org/0000-0003-2899-7669"},"institutions":[{"id":"https://openalex.org/I177477856","display_name":"Politecnico di Torino","ror":"https://ror.org/00bgk9508","country_code":"IT","type":"education","lineage":["https://openalex.org/I177477856"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Matteo Sonza Reorda","raw_affiliation_strings":["Dip. Automatica e Informatica (DAUIN), Politecnico di Torino, Torino, Italy"],"affiliations":[{"raw_affiliation_string":"Dip. Automatica e Informatica (DAUIN), Politecnico di Torino, Torino, Italy","institution_ids":["https://openalex.org/I177477856"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5063131954","display_name":"Franco Fiori","orcid":"https://orcid.org/0000-0002-7159-0322"},"institutions":[{"id":"https://openalex.org/I177477856","display_name":"Politecnico di Torino","ror":"https://ror.org/00bgk9508","country_code":"IT","type":"education","lineage":["https://openalex.org/I177477856"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Franco Fiori","raw_affiliation_strings":["Dip. Elettronica e Telecomunicazioni (DET), Politecnico di Torino, Torino, Italy"],"affiliations":[{"raw_affiliation_string":"Dip. Elettronica e Telecomunicazioni (DET), Politecnico di Torino, Torino, Italy","institution_ids":["https://openalex.org/I177477856"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5044545889"],"corresponding_institution_ids":["https://openalex.org/I177477856"],"apc_list":null,"apc_paid":null,"fwci":0.2075,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.50012157,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.7851480841636658},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.696307897567749},{"id":"https://openalex.org/keywords/power-electronics","display_name":"Power electronics","score":0.6333280801773071},{"id":"https://openalex.org/keywords/power-semiconductor-device","display_name":"Power semiconductor device","score":0.6250081658363342},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6136642098426819},{"id":"https://openalex.org/keywords/power-module","display_name":"Power module","score":0.5562978982925415},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.49274519085884094},{"id":"https://openalex.org/keywords/actuator","display_name":"Actuator","score":0.48868635296821594},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.48520901799201965},{"id":"https://openalex.org/keywords/power-cycling","display_name":"Power cycling","score":0.4756585955619812},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.4286581873893738},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.42783647775650024},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.4276999235153198},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4143977165222168},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.4079805314540863},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4047943949699402},{"id":"https://openalex.org/keywords/automotive-engineering","display_name":"Automotive engineering","score":0.39701777696609497},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3449477553367615},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.34390872716903687},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3130855858325958}],"concepts":[{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.7851480841636658},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.696307897567749},{"id":"https://openalex.org/C178911571","wikidata":"https://www.wikidata.org/wiki/Q593143","display_name":"Power electronics","level":3,"score":0.6333280801773071},{"id":"https://openalex.org/C129014197","wikidata":"https://www.wikidata.org/wiki/Q906544","display_name":"Power semiconductor device","level":3,"score":0.6250081658363342},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6136642098426819},{"id":"https://openalex.org/C141812795","wikidata":"https://www.wikidata.org/wiki/Q7236534","display_name":"Power module","level":3,"score":0.5562978982925415},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.49274519085884094},{"id":"https://openalex.org/C172707124","wikidata":"https://www.wikidata.org/wiki/Q423488","display_name":"Actuator","level":2,"score":0.48868635296821594},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.48520901799201965},{"id":"https://openalex.org/C2777900271","wikidata":"https://www.wikidata.org/wiki/Q17105337","display_name":"Power cycling","level":4,"score":0.4756585955619812},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.4286581873893738},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.42783647775650024},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.4276999235153198},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4143977165222168},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.4079805314540863},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4047943949699402},{"id":"https://openalex.org/C171146098","wikidata":"https://www.wikidata.org/wiki/Q124192","display_name":"Automotive engineering","level":1,"score":0.39701777696609497},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3449477553367615},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.34390872716903687},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3130855858325958},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/lats49555.2020.9093674","is_oa":false,"landing_page_url":"https://doi.org/10.1109/lats49555.2020.9093674","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE Latin-American Test Symposium (LATS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.9100000262260437}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W623871457","https://openalex.org/W1569857962","https://openalex.org/W1595368737","https://openalex.org/W1780575547","https://openalex.org/W2135904172","https://openalex.org/W2343133302","https://openalex.org/W2945841471","https://openalex.org/W3147597193","https://openalex.org/W4251694261"],"related_works":["https://openalex.org/W4317382130","https://openalex.org/W2294980933","https://openalex.org/W2120246139","https://openalex.org/W4312314747","https://openalex.org/W2626444938","https://openalex.org/W2207954180","https://openalex.org/W4295036958","https://openalex.org/W2135904172","https://openalex.org/W3011505842","https://openalex.org/W2798417595"],"abstract_inverted_index":{"In":[0,104],"safety-critical":[1,86],"systems,":[2],"power":[3,21,30,41,51],"electronics":[4],"is":[5,90,126],"widely":[6],"used,":[7],"e.g.,":[8],"for":[9,35,119],"driving":[10],"actuators.":[11],"High":[12],"currents":[13],"and":[14,38,58,61],"high":[15],"voltages":[16],"are":[17,43,65],"often":[18],"used":[19],"in":[20,49],"electronics,":[22],"which":[23],"may":[24,53],"cause":[25],"considerable":[26,56],"heating":[27],"of":[28,40,75,101,116,132,144],"the":[29,50,76,98,102,114,120,133,141,145,150,154],"devices.":[31],"Hence,":[32,88],"different":[33],"mechanisms":[34,95],"heat":[36],"dissipation":[37,77,121,151],"cooling":[39,134],"devices":[42,52,64],"adopted.":[44],"An":[45],"excessive":[46],"temperature":[47],"increase":[48],"lead":[54],"to":[55,67,92,96,111,139],"electrical":[57,63,155],"mechanical":[59],"stresses,":[60],"overheated":[62],"subject":[66],"more":[68],"rapid":[69],"ageing.":[70],"Therefore,":[71],"an":[72,129],"incorrect":[73],"behaviour":[74,100],"system":[78,152],"can":[79],"seriously":[80],"damage":[81],"or":[82],"even":[83],"block":[84],"a":[85,109,117],"system.":[87,122,135],"it":[89],"necessary":[91],"introduce":[93],"test":[94,118],"check":[97],"correct":[99],"heatsinks.":[103],"this":[105],"paper,":[106],"we":[107],"propose":[108],"strategy":[110],"quantitatively":[112],"evaluate":[113],"effectiveness":[115],"The":[123],"proposed":[124],"approach":[125],"based":[127],"on":[128],"electrothermal":[130],"model":[131],"It":[136],"allows":[137],"one":[138],"identify":[140],"maximum":[142],"size":[143],"thermal":[146],"fault":[147],"tolerated":[148],"by":[149],"before":[153],"device":[156],"break":[157],"down.":[158]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2026-03-25T13:04:00.132906","created_date":"2025-10-10T00:00:00"}