{"id":"https://openalex.org/W2520782513","doi":"https://doi.org/10.1109/jssc.2016.2602221","title":"A 1.2 V 20 nm 307 GB/s HBM DRAM With At-Speed Wafer-Level IO Test Scheme and Adaptive Refresh Considering Temperature Distribution","display_name":"A 1.2 V 20 nm 307 GB/s HBM DRAM With At-Speed Wafer-Level IO Test Scheme and Adaptive Refresh Considering Temperature Distribution","publication_year":2016,"publication_date":"2016-09-13","ids":{"openalex":"https://openalex.org/W2520782513","doi":"https://doi.org/10.1109/jssc.2016.2602221","mag":"2520782513"},"language":"en","primary_location":{"id":"doi:10.1109/jssc.2016.2602221","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2016.2602221","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5050861404","display_name":"Kyomin Sohn","orcid":"https://orcid.org/0000-0002-8094-9843"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Kyomin Sohn","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100993148","display_name":"Won-Joo Yun","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Won-Joo Yun","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5077295565","display_name":"Reum Oh","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Reum Oh","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042962142","display_name":"Chi Sung Oh","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Chi-Sung Oh","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076338979","display_name":"Seong-Young Seo","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seong-Young Seo","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063499357","display_name":"Min Sang Park","orcid":"https://orcid.org/0000-0002-7696-5007"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Min-Sang Park","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101075076","display_name":"Dong-Hak Shin","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Dong-Hak Shin","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104074549","display_name":"Won-Chang Jung","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Won-Chang Jung","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103805612","display_name":"Sanghoon Shin","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Sang-Hoon Shin","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001098187","display_name":"Je-Min Ryu","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Je-Min Ryu","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109523816","display_name":"Hye-Seung Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hye-Seung Yu","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5107063716","display_name":"Jae\u2010Hun Jung","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jae-Hun Jung","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061111660","display_name":"Hyunui Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hyunui Lee","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110590918","display_name":"Seok-Yong Kang","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seok-Yong Kang","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044163433","display_name":"Young\u2010Soo Sohn","orcid":"https://orcid.org/0000-0002-6068-0592"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Young-Soo Sohn","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038856252","display_name":"Jung-Hwan Choi","orcid":"https://orcid.org/0000-0002-3611-4734"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jung-Hwan Choi","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102151110","display_name":"Yong-Cheol Bae","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Yong-Cheol Bae","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111921292","display_name":"Seong-Jin Jang","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seong-Jin Jang","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110477011","display_name":"Gyoyoung Jin","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Gyoyoung Jin","raw_affiliation_strings":["Samsung Electronics, Hwaseong, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics, Hwaseong, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":19,"corresponding_author_ids":["https://openalex.org/A5050861404"],"corresponding_institution_ids":["https://openalex.org/I2250650973"],"apc_list":null,"apc_paid":null,"fwci":1.4897,"has_fulltext":false,"cited_by_count":61,"citation_normalized_percentile":{"value":0.84378282,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":"52","issue":"1","first_page":"250","last_page":"260"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.9368346929550171},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.7279099225997925},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5673819184303284},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4640445113182068},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3748508393764496},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.35612910985946655},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.32498204708099365},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2942546010017395},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.28032171726226807},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21402859687805176},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11654850840568542}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.9368346929550171},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.7279099225997925},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5673819184303284},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4640445113182068},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3748508393764496},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.35612910985946655},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.32498204708099365},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2942546010017395},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.28032171726226807},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21402859687805176},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11654850840568542}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/jssc.2016.2602221","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2016.2602221","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.8199999928474426,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2081250279","https://openalex.org/W2082375193","https://openalex.org/W2114299127","https://openalex.org/W2126529028","https://openalex.org/W2288365264","https://openalex.org/W4249944618","https://openalex.org/W6670864944","https://openalex.org/W6671305378","https://openalex.org/W6677028997","https://openalex.org/W6696260413","https://openalex.org/W6831316691"],"related_works":["https://openalex.org/W3120961607","https://openalex.org/W2098207691","https://openalex.org/W3148568549","https://openalex.org/W1648516568","https://openalex.org/W361036515","https://openalex.org/W2269474412","https://openalex.org/W4386903460","https://openalex.org/W4211178602","https://openalex.org/W2537599394","https://openalex.org/W2433923775"],"abstract_inverted_index":{"A":[0],"1.2":[1],"V":[2],"20":[3],"nm":[4],"307":[5],"GB/s":[6],"high-bandwidth":[7,16],"memory":[8],"(HBM)":[9],"DRAM":[10,40],"is":[11,24],"presented":[12],"to":[13,67],"satisfy":[14],"a":[15,52,75],"requirement":[17],"of":[18,26],"high-performance":[19],"computing":[20],"application.":[21],"The":[22],"HBM":[23],"composed":[25],"buffer":[27],"die":[28,36],"and":[29,33,57,71],"multiple":[30],"core":[31,35],"dies,":[32],"each":[34],"has":[37],"8":[38],"Gb":[39,46],"cell":[41],"array":[42],"with":[43],"additional":[44],"1":[45],"ECC":[47],"array.":[48],"At-speed":[49],"wafer":[50],"level,":[51],"u-bump":[53],"IO":[54],"test":[55,69],"scheme":[56,61],"an":[58],"adaptive":[59],"refresh":[60],"considering":[62],"temperature":[63],"distribution":[64],"are":[65],"proposed":[66],"guarantee":[68],"coverage":[70],"stable":[72],"operation":[73],"in":[74],"power-efficient":[76],"manner.":[77]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":8},{"year":2023,"cited_by_count":9},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":11},{"year":2020,"cited_by_count":13},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":3}],"updated_date":"2026-03-05T09:29:38.588285","created_date":"2025-10-10T00:00:00"}