{"id":"https://openalex.org/W2198506317","doi":"https://doi.org/10.1109/jssc.2015.2498183","title":"An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper","display_name":"An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper","publication_year":2015,"publication_date":"2015-12-01","ids":{"openalex":"https://openalex.org/W2198506317","doi":"https://doi.org/10.1109/jssc.2015.2498183","mag":"2198506317"},"language":"en","primary_location":{"id":"doi:10.1109/jssc.2015.2498183","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2015.2498183","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5076864125","display_name":"Yigit Mahsereci","orcid":"https://orcid.org/0000-0002-3560-159X"},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Yigit Mahsereci","raw_affiliation_strings":["Institut f\u00fcr Nano- und Mikroelektronische Systeme (INES), Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institut f\u00fcr Nano- und Mikroelektronische Systeme (INES), Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051851697","display_name":"Stefan Saller","orcid":null},"institutions":[{"id":"https://openalex.org/I4210158977","display_name":"Festo (Germany)","ror":"https://ror.org/03ga8q162","country_code":"DE","type":"company","lineage":["https://openalex.org/I4210158977"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Stefan Saller","raw_affiliation_strings":["Festo AG & Co. KG Ruiterstr, Esslingen, Germany"],"affiliations":[{"raw_affiliation_string":"Festo AG & Co. KG Ruiterstr, Esslingen, Germany","institution_ids":["https://openalex.org/I4210158977"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014530657","display_name":"H. Richter","orcid":"https://orcid.org/0000-0003-0205-0784"},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Harald Richter","raw_affiliation_strings":["Institute for Microelectronics Stuttgart (IMS CHIPS), Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS), Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5074267030","display_name":"Joachim N. Burghartz","orcid":"https://orcid.org/0000-0002-6013-6677"},"institutions":[{"id":"https://openalex.org/I4210164948","display_name":"Institut f\u00fcr Mikroelektronik Stuttgart","ror":"https://ror.org/05kw00716","country_code":"DE","type":"nonprofit","lineage":["https://openalex.org/I4210164948"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Joachim N. Burghartz","raw_affiliation_strings":["Institute for Microelectronics Stuttgart (IMS CHIPS), Stuttgart, Germany"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics Stuttgart (IMS CHIPS), Stuttgart, Germany","institution_ids":["https://openalex.org/I4210164948"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5076864125"],"corresponding_institution_ids":["https://openalex.org/I4210164948"],"apc_list":null,"apc_paid":null,"fwci":1.5783,"has_fulltext":false,"cited_by_count":26,"citation_normalized_percentile":{"value":0.85373724,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"51","issue":"1","first_page":"273","last_page":"280"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.681361198425293},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.6133082509040833},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.5068956017494202},{"id":"https://openalex.org/keywords/integrator","display_name":"Integrator","score":0.48122477531433105},{"id":"https://openalex.org/keywords/grippers","display_name":"Grippers","score":0.47135916352272034},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.43425580859184265},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.41317814588546753},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3824479579925537},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.30889442563056946},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2729450464248657},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.24486732482910156},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.19263437390327454}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.681361198425293},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.6133082509040833},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.5068956017494202},{"id":"https://openalex.org/C79518650","wikidata":"https://www.wikidata.org/wiki/Q2081431","display_name":"Integrator","level":3,"score":0.48122477531433105},{"id":"https://openalex.org/C2775960376","wikidata":"https://www.wikidata.org/wiki/Q1435859","display_name":"Grippers","level":2,"score":0.47135916352272034},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.43425580859184265},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.41317814588546753},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3824479579925537},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.30889442563056946},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2729450464248657},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24486732482910156},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.19263437390327454},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/jssc.2015.2498183","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2015.2498183","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W2003619281","https://openalex.org/W2003732870","https://openalex.org/W2007443511","https://openalex.org/W2007509283","https://openalex.org/W2018177065","https://openalex.org/W2022972579","https://openalex.org/W2028294265","https://openalex.org/W2030852404","https://openalex.org/W2031232791","https://openalex.org/W2038798773","https://openalex.org/W2043424648","https://openalex.org/W2049819631","https://openalex.org/W2061821008","https://openalex.org/W2062456775","https://openalex.org/W2070768625","https://openalex.org/W2087188018","https://openalex.org/W2090732831","https://openalex.org/W2115489808","https://openalex.org/W2131465806","https://openalex.org/W2161042330","https://openalex.org/W2409091553","https://openalex.org/W2491242585","https://openalex.org/W4232184452","https://openalex.org/W6651417639","https://openalex.org/W6655177992","https://openalex.org/W6662755037","https://openalex.org/W6679516552","https://openalex.org/W7036464890"],"related_works":["https://openalex.org/W2258669850","https://openalex.org/W1513401665","https://openalex.org/W4283263216","https://openalex.org/W3160851599","https://openalex.org/W2808090143","https://openalex.org/W2078285315","https://openalex.org/W2366352762","https://openalex.org/W2613964090","https://openalex.org/W2964156592","https://openalex.org/W2527333706"],"abstract_inverted_index":{"An":[0],"ultra-thin":[1,103,141],"(20":[2],"\u03bcm),":[3],"flexible":[4],"CMOS":[5,137],"stress":[6,28,44,54,57,64,84,111],"sensor":[7],"for":[8,18],"hybrid":[9],"systems-in-foil":[10],"(HySiF)":[11],"is":[12,16,45,66,105,117],"presented.":[13],"The":[14,108],"system":[15],"designed":[17],"Fin":[19],"Ray\u00ae":[20],"grippers":[21],"in":[22,32,88],"order":[23],"to":[24,48,52,80,114],"measure":[25],"the":[26,30,35,83,89,94,131],"emerging":[27],"on":[29,139],"gripper":[31],"operation,":[33],"enabling":[34],"extraction":[36],"of":[37,110,134],"object":[38],"shape":[39],"and":[40,55,68,73,98,125],"operation":[41],"status.":[42],"In-plane":[43],"linearly":[46],"converted":[47],"electrical":[49],"signals":[50],"proportional":[51],"shear":[53],"normal":[56],"difference":[58],"using":[59,120],"two":[60],"sensing":[61],"elements.":[62],"Each":[63],"signal":[65,95],"processed":[67],"digitized":[69],"by":[70,119],"an":[71,102,140],"integrator":[72],"a":[74],"10-bit":[75],"SAR":[76],"ADC.":[77],"In":[78],"contrast":[79],"rigid":[81],"chips,":[82],"cannot":[85],"be":[86],"avoided":[87],"sensitive":[90],"blocks,":[91],"such":[92],"as":[93],"processing":[96],"chain":[97],"digital":[99],"controller,":[100],"when":[101],"chip":[104],"under":[106],"deformation.":[107],"influence":[109],"levels,":[112],"up":[113],"350":[115],"MPa,":[116],"minimized":[118],"stress-insensitive":[121],"components,":[122],"design":[123,138],"measures,":[124],"layout":[126],"techniques.":[127],"This":[128],"work":[129],"represents":[130],"first":[132],"demonstration":[133],"stress-aware":[135],"top-to-bottom":[136],"chip.":[142]},"counts_by_year":[{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":3},{"year":2022,"cited_by_count":2},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":3},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":4},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2016-06-24T00:00:00"}