{"id":"https://openalex.org/W1996976459","doi":"https://doi.org/10.1109/jssc.2013.2295979","title":"Large-Scale Sensing System Combining Large-Area Electronics and CMOS ICs for Structural-Health Monitoring","display_name":"Large-Scale Sensing System Combining Large-Area Electronics and CMOS ICs for Structural-Health Monitoring","publication_year":2014,"publication_date":"2014-01-31","ids":{"openalex":"https://openalex.org/W1996976459","doi":"https://doi.org/10.1109/jssc.2013.2295979","mag":"1996976459"},"language":"en","primary_location":{"id":"doi:10.1109/jssc.2013.2295979","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2013.2295979","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100978788","display_name":"Yingzhe Hu","orcid":null},"institutions":[{"id":"https://openalex.org/I20089843","display_name":"Princeton University","ror":"https://ror.org/00hx57361","country_code":"US","type":"education","lineage":["https://openalex.org/I20089843"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yingzhe Hu","raw_affiliation_strings":["Princeton University, Princeton, NJ","Princeton University , Princeton, NJ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Princeton University, Princeton, NJ","institution_ids":["https://openalex.org/I20089843"]},{"raw_affiliation_string":"Princeton University , Princeton, NJ, USA","institution_ids":["https://openalex.org/I20089843"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048510237","display_name":"Warren Rieutort\u2010Louis","orcid":null},"institutions":[{"id":"https://openalex.org/I20089843","display_name":"Princeton University","ror":"https://ror.org/00hx57361","country_code":"US","type":"education","lineage":["https://openalex.org/I20089843"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Warren S. A. Rieutort-Louis","raw_affiliation_strings":["Princeton University, Princeton, NJ","Princeton University , Princeton, NJ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Princeton University, Princeton, NJ","institution_ids":["https://openalex.org/I20089843"]},{"raw_affiliation_string":"Princeton University , Princeton, NJ, USA","institution_ids":["https://openalex.org/I20089843"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042487025","display_name":"Josue Sanz\u2010Robinson","orcid":null},"institutions":[{"id":"https://openalex.org/I20089843","display_name":"Princeton University","ror":"https://ror.org/00hx57361","country_code":"US","type":"education","lineage":["https://openalex.org/I20089843"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Josue Sanz-Robinson","raw_affiliation_strings":["Princeton University, Princeton, NJ","Princeton University , Princeton, NJ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Princeton University, Princeton, NJ","institution_ids":["https://openalex.org/I20089843"]},{"raw_affiliation_string":"Princeton University , Princeton, NJ, USA","institution_ids":["https://openalex.org/I20089843"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102183431","display_name":"Liechao Huang","orcid":null},"institutions":[{"id":"https://openalex.org/I20089843","display_name":"Princeton University","ror":"https://ror.org/00hx57361","country_code":"US","type":"education","lineage":["https://openalex.org/I20089843"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Liechao Huang","raw_affiliation_strings":["Princeton University, Princeton, NJ","Princeton University , Princeton, NJ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Princeton University, Princeton, NJ","institution_ids":["https://openalex.org/I20089843"]},{"raw_affiliation_string":"Princeton University , Princeton, NJ, USA","institution_ids":["https://openalex.org/I20089843"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020782584","display_name":"Branko Gli\u0161i\u0107","orcid":"https://orcid.org/0000-0002-1852-5310"},"institutions":[{"id":"https://openalex.org/I20089843","display_name":"Princeton University","ror":"https://ror.org/00hx57361","country_code":"US","type":"education","lineage":["https://openalex.org/I20089843"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Branko Glisic","raw_affiliation_strings":["Princeton University, Princeton, NJ","Princeton University , Princeton, NJ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Princeton University, Princeton, NJ","institution_ids":["https://openalex.org/I20089843"]},{"raw_affiliation_string":"Princeton University , Princeton, NJ, USA","institution_ids":["https://openalex.org/I20089843"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074204707","display_name":"James C. Sturm","orcid":"https://orcid.org/0000-0002-0878-5266"},"institutions":[{"id":"https://openalex.org/I20089843","display_name":"Princeton University","ror":"https://ror.org/00hx57361","country_code":"US","type":"education","lineage":["https://openalex.org/I20089843"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"James C. Sturm","raw_affiliation_strings":["Princeton University, Princeton, NJ","Princeton University , Princeton, NJ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Princeton University, Princeton, NJ","institution_ids":["https://openalex.org/I20089843"]},{"raw_affiliation_string":"Princeton University , Princeton, NJ, USA","institution_ids":["https://openalex.org/I20089843"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032133587","display_name":"S. Wagner","orcid":"https://orcid.org/0000-0002-3222-4071"},"institutions":[{"id":"https://openalex.org/I20089843","display_name":"Princeton University","ror":"https://ror.org/00hx57361","country_code":"US","type":"education","lineage":["https://openalex.org/I20089843"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sigurd Wagner","raw_affiliation_strings":["Princeton University, Princeton, NJ","Princeton University , Princeton, NJ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Princeton University, Princeton, NJ","institution_ids":["https://openalex.org/I20089843"]},{"raw_affiliation_string":"Princeton University , Princeton, NJ, USA","institution_ids":["https://openalex.org/I20089843"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101645607","display_name":"Naveen Verma","orcid":"https://orcid.org/0000-0002-8208-5030"},"institutions":[{"id":"https://openalex.org/I20089843","display_name":"Princeton University","ror":"https://ror.org/00hx57361","country_code":"US","type":"education","lineage":["https://openalex.org/I20089843"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Naveen Verma","raw_affiliation_strings":["Princeton University, Princeton, NJ","Princeton University , Princeton, NJ, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Princeton University, Princeton, NJ","institution_ids":["https://openalex.org/I20089843"]},{"raw_affiliation_string":"Princeton University , Princeton, NJ, USA","institution_ids":["https://openalex.org/I20089843"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":19.3071,"has_fulltext":false,"cited_by_count":57,"citation_normalized_percentile":{"value":0.99572579,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":100},"biblio":{"volume":"49","issue":"2","first_page":"513","last_page":"523"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10534","display_name":"Structural Health Monitoring Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10534","display_name":"Structural Health Monitoring Techniques","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12682","display_name":"Smart Materials for Construction","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2310","display_name":"Pollution"},"field":{"id":"https://openalex.org/fields/23","display_name":"Environmental Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11850","display_name":"Concrete Corrosion and Durability","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.633176326751709},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.6247988939285278},{"id":"https://openalex.org/keywords/strain-gauge","display_name":"Strain gauge","score":0.5926555395126343},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5624140501022339},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.5475640296936035},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.540318489074707},{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"Flexible electronics","score":0.49587830901145935},{"id":"https://openalex.org/keywords/lamination","display_name":"Lamination","score":0.47196733951568604},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.46384575963020325},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3950035870075226},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.38718175888061523},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.34585726261138916},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3336704969406128},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25400519371032715},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.17238479852676392},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.1516590714454651},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.08135223388671875}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.633176326751709},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.6247988939285278},{"id":"https://openalex.org/C60584519","wikidata":"https://www.wikidata.org/wiki/Q610723","display_name":"Strain gauge","level":2,"score":0.5926555395126343},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5624140501022339},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5475640296936035},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.540318489074707},{"id":"https://openalex.org/C84967400","wikidata":"https://www.wikidata.org/wiki/Q1066289","display_name":"Flexible electronics","level":2,"score":0.49587830901145935},{"id":"https://openalex.org/C2777557983","wikidata":"https://www.wikidata.org/wiki/Q384943","display_name":"Lamination","level":3,"score":0.47196733951568604},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.46384575963020325},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3950035870075226},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.38718175888061523},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.34585726261138916},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3336704969406128},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25400519371032715},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.17238479852676392},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.1516590714454651},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.08135223388671875},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/jssc.2013.2295979","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2013.2295979","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.6700000166893005}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W646837319","https://openalex.org/W1869009210","https://openalex.org/W1965246325","https://openalex.org/W1968554030","https://openalex.org/W1996367497","https://openalex.org/W2004728577","https://openalex.org/W2007719056","https://openalex.org/W2015621518","https://openalex.org/W2024604865","https://openalex.org/W2032659157","https://openalex.org/W2045831595","https://openalex.org/W2050248078","https://openalex.org/W2065218997","https://openalex.org/W2073899492","https://openalex.org/W2091220318","https://openalex.org/W2092155559","https://openalex.org/W2105087997","https://openalex.org/W2113219660","https://openalex.org/W2116851027","https://openalex.org/W2134531686","https://openalex.org/W2153569771","https://openalex.org/W2158019432","https://openalex.org/W2162345217","https://openalex.org/W2167601214","https://openalex.org/W6666871868"],"related_works":["https://openalex.org/W1470273002","https://openalex.org/W2972912909","https://openalex.org/W2883714160","https://openalex.org/W2769553728","https://openalex.org/W2343972419","https://openalex.org/W2319382040","https://openalex.org/W2902534443","https://openalex.org/W4251898821","https://openalex.org/W2033806636","https://openalex.org/W1632321014"],"abstract_inverted_index":{"Early-stage":[0],"damage":[1],"detection":[2],"for":[3,36,45,134],"bridges":[4],"requires":[5],"continuously":[6],"sensing":[7,21,30,48,61],"strain":[8,60,116,150],"over":[9,140,178],"large":[10],"portions":[11],"of":[12,156,164,181],"the":[13,56,71,90,95,129,141,168],"structure,":[14,55],"yet":[15],"with":[16,41,154],"centimeter-scale":[17],"resolution.":[18],"To":[19],"achieve":[20],"on":[22,89,94,123],"such":[23],"a":[24,29,54,75,124,145,161,179],"scale,":[25],"this":[26],"work":[27],"presents":[28],"sheet":[31,57,92,106,113,143],"that":[32,99],"combines":[33],"CMOS":[34,130],"ICs,":[35],"sensor":[37,135],"control":[38],"and":[39,49,84,93,120,128,138],"readout,":[40,136],"large-area":[42],"electronics":[43],"(LAE),":[44],"many-channel":[46],"distributed":[47,142],"data":[50],"aggregation.":[51],"Bonded":[52],"to":[53,63,69],"thus":[58],"enables":[59],"scalable":[62,77],"high":[64],"spatial":[65],"resolutions.":[66],"In":[67],"order":[68],"combine":[70],"two":[72],"technologies":[73],"in":[74,144],"correspondingly":[76],"manner,":[78],"non-contact":[79],"interfaces":[80],"are":[81,87],"used.":[82],"Inductive":[83],"capacitive":[85],"antennas":[86],"patterned":[88],"LAE":[91,112],"IC":[96],"packages,":[97],"so":[98],"system":[100],"assembly":[101],"is":[102,152,171],"achieved":[103,153],"via":[104],"low-cost":[105],"lamination":[107],"without":[108],"metallurgical":[109],"bonds.":[110],"The":[111],"integrates":[114],"thin-film":[115,118],"gauges,":[117],"transistors,":[119],"long":[121],"interconnects":[122],"50-\u03bcm-thick":[125],"polyimide":[126],"sheet,":[127],"ICs":[131],"integrate":[132],"subsystems":[133],"control,":[137],"communication":[139,169],"130":[146],"nm":[147],"process.":[148],"Multi-channel":[149],"readout":[151,162],"sensitivity":[155],"18":[157],"\u03bcStrain":[158],"RMS":[159],"at":[160],"energy":[163,170],"270":[165],"nJ/measurement,":[166],"while":[167],"12.8":[172],"pJ/3.3":[173],"pJ":[174],"per":[175],"bit":[176],"(Tx/Rx)":[177],"distance":[180],"7.5":[182],"m.":[183]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":4},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":5},{"year":2018,"cited_by_count":8},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":12},{"year":2015,"cited_by_count":13},{"year":2014,"cited_by_count":5}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}