{"id":"https://openalex.org/W2025934277","doi":"https://doi.org/10.1109/jssc.2012.2204930","title":"Liquid\u2013Metal Vertical Interconnects for Flip Chip Assembly of GaAs C-Band Power Amplifiers Onto Micro-Rectangular Coaxial Transmission Lines","display_name":"Liquid\u2013Metal Vertical Interconnects for Flip Chip Assembly of GaAs C-Band Power Amplifiers Onto Micro-Rectangular Coaxial Transmission Lines","publication_year":2012,"publication_date":"2012-09-12","ids":{"openalex":"https://openalex.org/W2025934277","doi":"https://doi.org/10.1109/jssc.2012.2204930","mag":"2025934277"},"language":"en","primary_location":{"id":"doi:10.1109/jssc.2012.2204930","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2012.2204930","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088000046","display_name":"Parrish Ralston","orcid":null},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]},{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Parrish Ralston","raw_affiliation_strings":["Virginia Polytechnic Institute, State University, Blacksburg, VA, USA","Virginia Polytech. Inst. and State Univ., Blacksburg, VA, USA"],"affiliations":[{"raw_affiliation_string":"Virginia Polytechnic Institute, State University, Blacksburg, VA, USA","institution_ids":["https://openalex.org/I859038795"]},{"raw_affiliation_string":"Virginia Polytech. Inst. and State Univ., Blacksburg, VA, USA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067091937","display_name":"Marcus Oliver","orcid":null},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]},{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Marcus Oliver","raw_affiliation_strings":["Virginia Polytechnic Institute, State University, Blacksburg, VA, USA","Virginia Polytech. Inst. and State Univ., Blacksburg, VA, USA"],"affiliations":[{"raw_affiliation_string":"Virginia Polytechnic Institute, State University, Blacksburg, VA, USA","institution_ids":["https://openalex.org/I859038795"]},{"raw_affiliation_string":"Virginia Polytech. Inst. and State Univ., Blacksburg, VA, USA","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020586074","display_name":"Krishna Vummidi","orcid":null},"institutions":[{"id":"https://openalex.org/I37891753","display_name":"Integrated Device Technology (United States)","ror":"https://ror.org/03yvs0f43","country_code":"US","type":"company","lineage":["https://openalex.org/I37891753","https://openalex.org/I4210153176"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Krishna Vummidi","raw_affiliation_strings":["Integrated Device Technologies, Inc., San Jose, CA, USA","Integrated Device Technol., San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"Integrated Device Technologies, Inc., San Jose, CA, USA","institution_ids":["https://openalex.org/I37891753"]},{"raw_affiliation_string":"Integrated Device Technol., San Jose, CA, USA","institution_ids":["https://openalex.org/I37891753"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5067633048","display_name":"Sanjay Raman","orcid":"https://orcid.org/0000-0002-1155-1057"},"institutions":[{"id":"https://openalex.org/I859038795","display_name":"Virginia Tech","ror":"https://ror.org/02smfhw86","country_code":"US","type":"education","lineage":["https://openalex.org/I859038795"]},{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sanjay Raman","raw_affiliation_strings":["Virginia Polytechnic Institute, State University, Blacksburg, VA, USA","Virginia Polytech. Inst. and State Univ., Blacksburg, VA, USA"],"affiliations":[{"raw_affiliation_string":"Virginia Polytechnic Institute, State University, Blacksburg, VA, USA","institution_ids":["https://openalex.org/I859038795"]},{"raw_affiliation_string":"Virginia Polytech. Inst. and State Univ., Blacksburg, VA, USA","institution_ids":["https://openalex.org/I51556381"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5088000046"],"corresponding_institution_ids":["https://openalex.org/I51556381","https://openalex.org/I859038795"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":10,"citation_normalized_percentile":{"value":0.09199105,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":"47","issue":"10","first_page":"2327","last_page":"2334"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9811000227928162,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9811000227928162,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9700000286102295,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9678999781608582,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/monolithic-microwave-integrated-circuit","display_name":"Monolithic microwave integrated circuit","score":0.8778131008148193},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.8139816522598267},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7404409646987915},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6532856822013855},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5699307322502136},{"id":"https://openalex.org/keywords/parasitic-extraction","display_name":"Parasitic extraction","score":0.5437740683555603},{"id":"https://openalex.org/keywords/amplifier","display_name":"Amplifier","score":0.5316600799560547},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.48017826676368713},{"id":"https://openalex.org/keywords/liquid-metal","display_name":"Liquid metal","score":0.46191927790641785},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.4536319971084595},{"id":"https://openalex.org/keywords/coaxial","display_name":"Coaxial","score":0.44788026809692383},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.41902098059654236},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1809225082397461},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.17537429928779602},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17535513639450073},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.08231037855148315}],"concepts":[{"id":"https://openalex.org/C128450285","wikidata":"https://www.wikidata.org/wiki/Q1945036","display_name":"Monolithic microwave integrated circuit","level":4,"score":0.8778131008148193},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.8139816522598267},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7404409646987915},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6532856822013855},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5699307322502136},{"id":"https://openalex.org/C159818811","wikidata":"https://www.wikidata.org/wiki/Q7135947","display_name":"Parasitic extraction","level":2,"score":0.5437740683555603},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.5316600799560547},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.48017826676368713},{"id":"https://openalex.org/C2778492893","wikidata":"https://www.wikidata.org/wiki/Q6557453","display_name":"Liquid metal","level":2,"score":0.46191927790641785},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.4536319971084595},{"id":"https://openalex.org/C51221625","wikidata":"https://www.wikidata.org/wiki/Q1751466","display_name":"Coaxial","level":2,"score":0.44788026809692383},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.41902098059654236},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1809225082397461},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.17537429928779602},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17535513639450073},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.08231037855148315},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/jssc.2012.2204930","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2012.2204930","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.7099999785423279,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W1528672294","https://openalex.org/W2011398265","https://openalex.org/W2013192049","https://openalex.org/W2049187160","https://openalex.org/W2105931511","https://openalex.org/W2107245241","https://openalex.org/W2117179005","https://openalex.org/W2130569905","https://openalex.org/W2134878430","https://openalex.org/W2153406304","https://openalex.org/W2155667670","https://openalex.org/W2158672299","https://openalex.org/W2161649967","https://openalex.org/W2480855420","https://openalex.org/W3144699329","https://openalex.org/W3215955199","https://openalex.org/W4212824459","https://openalex.org/W6682708245"],"related_works":["https://openalex.org/W2105297912","https://openalex.org/W2028496493","https://openalex.org/W2744915997","https://openalex.org/W2738910201","https://openalex.org/W1988649604","https://openalex.org/W2035624775","https://openalex.org/W1961878373","https://openalex.org/W2124912291","https://openalex.org/W2904294967","https://openalex.org/W2025934277"],"abstract_inverted_index":{"Prior":[0],"work":[1],"has":[2],"demonstrated":[3,89],"a":[4,22,31],"new":[5],"process":[6],"utilizing":[7],"room-temperature":[8],"liquid":[9],"metal,":[10],"Galinstan,":[11],"as":[12,131],"an":[13],"interconnect":[14,20,50],"material":[15],"for":[16,101],"flip-chip":[17,32],"bonding.":[18],"This":[19,44],"forms":[21],"flexible":[23],"bond":[24],"between":[25],"chips":[26,53],"and":[27,66,88],"carriers,":[28],"and,":[29],"therefore,":[30],"assembly":[33],"using":[34],"this":[35,47],"technology":[36],"is":[37,99,122],"much":[38],"less":[39],"susceptible":[40],"to":[41,49,54,63,81],"thermomechanical":[42],"stresses.":[43],"paper":[45],"applies":[46],"concept":[48],"GaAs":[51,96],"MMIC":[52,97,121,138],"3-D":[55],"Polystrata":[56],"transmission-line":[57],"structures.":[58],"Passive":[59],"assemblies":[60],"are":[61],"utilized":[62],"model,":[64],"test,":[65],"verify":[67],"liquid-metal":[68,74,102],"interconnections,":[69],"giving":[70],"average":[71],"losses":[72],"per":[73,86,128],"transition":[75,130],"of":[76,119,136],"about":[77],"0.11":[78],"dB":[79,124,127],"out":[80],"26.5":[82],"GHz,":[83],"low":[84],"parasitics":[85],"transition,":[87],"reliability":[90],"after":[91],"temperature":[92],"cycling.":[93],"A":[94],"prefabricated":[95],"chip":[98],"postprocessed":[100],"assembly.":[103],"Measured":[104],"results":[105],"show,":[106],"over":[107],"the":[108,113,120,137],"MMIC's":[109],"4.9-8.5-GHz":[110],"frequency":[111],"range,":[112],"system's":[114],"overall":[115],"reduction":[116],"in":[117],"gain":[118],"1.4":[123],"or":[125],"0.7":[126],"RF":[129],"compared":[132],"with":[133],"direct":[134],"probing":[135],"chip.":[139]},"counts_by_year":[{"year":2025,"cited_by_count":5},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}