{"id":"https://openalex.org/W2146076154","doi":"https://doi.org/10.1109/jssc.2007.891680","title":"The Circuits and Robust Design Methodology of the Massively Parallel Processor Based on the Matrix Architecture","display_name":"The Circuits and Robust Design Methodology of the Massively Parallel Processor Based on the Matrix Architecture","publication_year":2007,"publication_date":"2007-04-01","ids":{"openalex":"https://openalex.org/W2146076154","doi":"https://doi.org/10.1109/jssc.2007.891680","mag":"2146076154"},"language":"en","primary_location":{"id":"doi:10.1109/jssc.2007.891680","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2007.891680","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113822636","display_name":"Hideyuki Noda","orcid":null},"institutions":[{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]},{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP","US"],"is_corresponding":true,"raw_author_name":"Hideyuki Noda","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031820726","display_name":"Tetsushi Tanizaki","orcid":null},"institutions":[{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]},{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Tetsushi Tanizaki","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079632800","display_name":"Takayuki Gyohten","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]},{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Takayuki Gyohten","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5061347950","display_name":"K. Dosaka","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]},{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Katsumi Dosaka","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108262327","display_name":"Masami Nakajima","orcid":null},"institutions":[{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]},{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Masami Nakajima","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109356213","display_name":"Katsuya Mizumoto","orcid":null},"institutions":[{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]},{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Katsuya Mizumoto","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072974019","display_name":"Kanako Yoshida","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]},{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Kanako Yoshida","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079084597","display_name":"Takenobu Iwao","orcid":null},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]},{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Takenobu Iwao","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037061406","display_name":"Tetsu Nishijima","orcid":null},"institutions":[{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]},{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Tetsu Nishijima","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109422068","display_name":"Yoshihiro Okuno","orcid":null},"institutions":[{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]},{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Yoshihiro Okuno","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5040347203","display_name":"Kazutami Arimoto","orcid":"https://orcid.org/0000-0003-2871-7479"},"institutions":[{"id":"https://openalex.org/I4210153176","display_name":"Renesas Electronics (Japan)","ror":"https://ror.org/058wb7691","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210153176"]},{"id":"https://openalex.org/I75636454","display_name":"Renesas Electronics (United States)","ror":"https://ror.org/014775w70","country_code":"US","type":"company","lineage":["https://openalex.org/I4210153176","https://openalex.org/I75636454"]}],"countries":["JP","US"],"is_corresponding":false,"raw_author_name":"Kazutami Arimoto","raw_affiliation_strings":["Renesas Technology Corporation, Itami, Hyogo, Japan","Renesas Technol. Corp., Hyogo"],"affiliations":[{"raw_affiliation_string":"Renesas Technology Corporation, Itami, Hyogo, Japan","institution_ids":["https://openalex.org/I4210153176"]},{"raw_affiliation_string":"Renesas Technol. Corp., Hyogo","institution_ids":["https://openalex.org/I75636454"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":11,"corresponding_author_ids":["https://openalex.org/A5113822636"],"corresponding_institution_ids":["https://openalex.org/I4210153176","https://openalex.org/I75636454"],"apc_list":null,"apc_paid":null,"fwci":1.6044,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.85649855,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"42","issue":"4","first_page":"804","last_page":"812"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9958999752998352,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9948999881744385,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/massively-parallel","display_name":"Massively parallel","score":0.8350428938865662},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.8136894702911377},{"id":"https://openalex.org/keywords/simd","display_name":"SIMD","score":0.7150094509124756},{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness (evolution)","score":0.6222201585769653},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.5895158052444458},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.5583838820457458},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.5102732181549072},{"id":"https://openalex.org/keywords/microarchitecture","display_name":"Microarchitecture","score":0.47962722182273865},{"id":"https://openalex.org/keywords/multi-core-processor","display_name":"Multi-core processor","score":0.44990453124046326},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.43577373027801514},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.33679550886154175},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.334272563457489},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.12279361486434937},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.07239985466003418}],"concepts":[{"id":"https://openalex.org/C190475519","wikidata":"https://www.wikidata.org/wiki/Q544384","display_name":"Massively parallel","level":2,"score":0.8350428938865662},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.8136894702911377},{"id":"https://openalex.org/C150552126","wikidata":"https://www.wikidata.org/wiki/Q339387","display_name":"SIMD","level":2,"score":0.7150094509124756},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.6222201585769653},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.5895158052444458},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.5583838820457458},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.5102732181549072},{"id":"https://openalex.org/C107598950","wikidata":"https://www.wikidata.org/wiki/Q259864","display_name":"Microarchitecture","level":2,"score":0.47962722182273865},{"id":"https://openalex.org/C78766204","wikidata":"https://www.wikidata.org/wiki/Q555032","display_name":"Multi-core processor","level":2,"score":0.44990453124046326},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.43577373027801514},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.33679550886154175},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.334272563457489},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.12279361486434937},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.07239985466003418},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/jssc.2007.891680","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jssc.2007.891680","pdf_url":null,"source":{"id":"https://openalex.org/S83637746","display_name":"IEEE Journal of Solid-State Circuits","issn_l":"0018-9200","issn":["0018-9200","1558-173X"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal of Solid-State Circuits","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.8899999856948853}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1582510115","https://openalex.org/W2008749436","https://openalex.org/W2075757554","https://openalex.org/W2098284001","https://openalex.org/W2110914625","https://openalex.org/W2162991651","https://openalex.org/W2788645991"],"related_works":["https://openalex.org/W2255048617","https://openalex.org/W2092102951","https://openalex.org/W2142204081","https://openalex.org/W1512604874","https://openalex.org/W2140636994","https://openalex.org/W1992352827","https://openalex.org/W2158982898","https://openalex.org/W1784407820","https://openalex.org/W1547865754","https://openalex.org/W2276000909"],"abstract_inverted_index":{"Novel":[0],"circuits":[1,50,98],"and":[2,60,66,83,99,114],"design":[3,101],"methodology":[4,102],"of":[5,35,57,94],"the":[6,12,29,33,55,62,72,92,95,100],"massively":[7,116],"parallel":[8,117],"processor":[9,73,119],"based":[10,27],"on":[11,28],"matrix":[13],"architecture":[14],"are":[15,51,68,88,107],"introduced.":[16],"A":[17],"fine-grained":[18],"processing":[19],"elements":[20],"(PE)":[21],"circuit":[22],"for":[23,53,70,79,109],"high-throughput":[24],"MAC":[25],"operations":[26],"Booth's":[30],"algorithm":[31],"enhances":[32],"performance":[34,113],"a":[36,111],"16-bit":[37],"fixed-point":[38],"signed":[39],"MAC,":[40],"which":[41],"operates":[42],"up":[43],"to":[44,90],"30.0GOPS/W.":[45],"The":[46,97],"dedicated":[47],"I/O":[48],"interface":[49],"designed":[52],"converting":[54],"direction":[56],"data":[58],"access":[59],"supporting":[61],"interleaved":[63],"memory":[64],"architecture,":[65],"they":[67],"implemented":[69],"maximizing":[71],"core":[74,120],"efficiency.":[75],"Power":[76],"management":[77],"techniques":[78],"suppressing":[80],"current":[81],"peaks":[82],"reducing":[84],"average":[85],"power":[86],"consumption":[87],"proposed":[89],"enhance":[91],"robustness":[93],"macro.":[96],"proposal":[103],"in":[104,122],"this":[105],"paper":[106],"attractive":[108],"achieving":[110],"high":[112],"robust":[115],"SIMD":[118],"employed":[121],"multimedia":[123],"SoCs":[124]},"counts_by_year":[{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}