{"id":"https://openalex.org/W2971001611","doi":"https://doi.org/10.1109/jproc.2019.2933267","title":"An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices","display_name":"An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices","publication_year":2019,"publication_date":"2019-08-27","ids":{"openalex":"https://openalex.org/W2971001611","doi":"https://doi.org/10.1109/jproc.2019.2933267","mag":"2971001611"},"language":"en","primary_location":{"id":"doi:10.1109/jproc.2019.2933267","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jproc.2019.2933267","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101482092","display_name":"Yueping Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Yueping Zhang","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore"],"raw_orcid":"https://orcid.org/0000-0001-5091-8475","affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore","institution_ids":["https://openalex.org/I172675005"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036116982","display_name":"Junfa Mao","orcid":"https://orcid.org/0000-0002-9857-535X"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Junfa Mao","raw_affiliation_strings":["Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai, China"],"raw_orcid":"https://orcid.org/0000-0002-9857-535X","affiliations":[{"raw_affiliation_string":"Key Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High-Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":218.8654,"has_fulltext":false,"cited_by_count":228,"citation_normalized_percentile":{"value":0.9997498,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":100},"biblio":{"volume":"107","issue":"11","first_page":"2265","last_page":"2280"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10069","display_name":"Antenna Design and Analysis","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10069","display_name":"Antenna Design and Analysis","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10936","display_name":"Millimeter-Wave Propagation and Modeling","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.5401533842086792},{"id":"https://openalex.org/keywords/antenna","display_name":"Antenna (radio)","score":0.538432240486145},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4933864176273346},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.4637520909309387},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.45230722427368164},{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.4506150484085083},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4503251612186432},{"id":"https://openalex.org/keywords/packaging-engineering","display_name":"Packaging engineering","score":0.4296777844429016},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3977659344673157},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3317670226097107},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.3312644362449646},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.15385174751281738},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.14679905772209167},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.10276862978935242}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.5401533842086792},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.538432240486145},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4933864176273346},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.4637520909309387},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.45230722427368164},{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.4506150484085083},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4503251612186432},{"id":"https://openalex.org/C193149544","wikidata":"https://www.wikidata.org/wiki/Q7122904","display_name":"Packaging engineering","level":2,"score":0.4296777844429016},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3977659344673157},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3317670226097107},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.3312644362449646},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.15385174751281738},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.14679905772209167},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.10276862978935242},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/jproc.2019.2933267","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jproc.2019.2933267","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.44999998807907104}],"awards":[{"id":"https://openalex.org/G4766671152","display_name":"\u57fa\u4e8e\u78b3\u7eb3\u7c73\u6750\u6599\u7684\u53ef\u8c03\u8c10\u6ee4\u6ce2\u5668\u4e0e\u5929\u7ebf\u7814\u7a76","funder_award_id":"61331004","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"},{"id":"https://openalex.org/G8687426234","display_name":"\u6beb\u7c73\u6ce2\u5f02\u8d28\u96c6\u6210\u7535\u8def\u8bbe\u8ba1\u7406\u8bba\u4e0e\u5b9e\u73b0\u65b9\u6cd5\u7814\u7a76","funder_award_id":"61831016","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":172,"referenced_works":["https://openalex.org/W573266059","https://openalex.org/W606103520","https://openalex.org/W655067952","https://openalex.org/W905396345","https://openalex.org/W1480979875","https://openalex.org/W1505767488","https://openalex.org/W1551765164","https://openalex.org/W1569190137","https://openalex.org/W1582644438","https://openalex.org/W1604770810","https://openalex.org/W1625567360","https://openalex.org/W1625962795","https://openalex.org/W1653166915","https://openalex.org/W1692944873","https://openalex.org/W1889899283","https://openalex.org/W1965491966","https://openalex.org/W1968811797","https://openalex.org/W1976593671","https://openalex.org/W1976821108","https://openalex.org/W1980225854","https://openalex.org/W1981006584","https://openalex.org/W1985057920","https://openalex.org/W1986418233","https://openalex.org/W1986759545","https://openalex.org/W1988236595","https://openalex.org/W1992294236","https://openalex.org/W1992913046","https://openalex.org/W1999992436","https://openalex.org/W2005723183","https://openalex.org/W2006518323","https://openalex.org/W2006543168","https://openalex.org/W2010379065","https://openalex.org/W2010448176","https://openalex.org/W2011910167","https://openalex.org/W2013134182","https://openalex.org/W2013174132","https://openalex.org/W2016999686","https://openalex.org/W2021279781","https://openalex.org/W2024600179","https://openalex.org/W2024696192","https://openalex.org/W2028667419","https://openalex.org/W2030120031","https://openalex.org/W2032112318","https://openalex.org/W2037340657","https://openalex.org/W2039487563","https://openalex.org/W2040270607","https://openalex.org/W2042080752","https://openalex.org/W2043695148","https://openalex.org/W2046430535","https://openalex.org/W2046587012","https://openalex.org/W2052350981","https://openalex.org/W2052436672","https://openalex.org/W2053552037","https://openalex.org/W2054692642","https://openalex.org/W2055194299","https://openalex.org/W2055836422","https://openalex.org/W2064229960","https://openalex.org/W2065270808","https://openalex.org/W2068903983","https://openalex.org/W2073385295","https://openalex.org/W2076391420","https://openalex.org/W2076789438","https://openalex.org/W2078196439","https://openalex.org/W2080375697","https://openalex.org/W2082889510","https://openalex.org/W2085015693","https://openalex.org/W2088798533","https://openalex.org/W2093622253","https://openalex.org/W2094484796","https://openalex.org/W2096316670","https://openalex.org/W2097421090","https://openalex.org/W2097653120","https://openalex.org/W2100903289","https://openalex.org/W2103826034","https://openalex.org/W2104171598","https://openalex.org/W2105281409","https://openalex.org/W2105297912","https://openalex.org/W2107549602","https://openalex.org/W2109523969","https://openalex.org/W2112376451","https://openalex.org/W2115152201","https://openalex.org/W2117071116","https://openalex.org/W2119942312","https://openalex.org/W2121269596","https://openalex.org/W2122215659","https://openalex.org/W2125981230","https://openalex.org/W2126562357","https://openalex.org/W2127229401","https://openalex.org/W2127674035","https://openalex.org/W2131696117","https://openalex.org/W2132667967","https://openalex.org/W2132931953","https://openalex.org/W2133221944","https://openalex.org/W2135305706","https://openalex.org/W2135369720","https://openalex.org/W2136530092","https://openalex.org/W2138752820","https://openalex.org/W2139129551","https://openalex.org/W2140770542","https://openalex.org/W2141070749","https://openalex.org/W2141687502","https://openalex.org/W2141828787","https://openalex.org/W2144070475","https://openalex.org/W2147430875","https://openalex.org/W2149893201","https://openalex.org/W2151851372","https://openalex.org/W2153077243","https://openalex.org/W2159012996","https://openalex.org/W2160709449","https://openalex.org/W2163441566","https://openalex.org/W2166424613","https://openalex.org/W2167049631","https://openalex.org/W2167158290","https://openalex.org/W2167249155","https://openalex.org/W2168114100","https://openalex.org/W2169782113","https://openalex.org/W2170193665","https://openalex.org/W2171620137","https://openalex.org/W2177041154","https://openalex.org/W2216754378","https://openalex.org/W2303328940","https://openalex.org/W2313285296","https://openalex.org/W2314759052","https://openalex.org/W2415673992","https://openalex.org/W2495945888","https://openalex.org/W2499732104","https://openalex.org/W2502341198","https://openalex.org/W2534241385","https://openalex.org/W2549813230","https://openalex.org/W2553226203","https://openalex.org/W2577877263","https://openalex.org/W2586905893","https://openalex.org/W2592041218","https://openalex.org/W2594086714","https://openalex.org/W2604738006","https://openalex.org/W2615425758","https://openalex.org/W2621187463","https://openalex.org/W2730683903","https://openalex.org/W2734954796","https://openalex.org/W2742987108","https://openalex.org/W2743695911","https://openalex.org/W2743895749","https://openalex.org/W2763141569","https://openalex.org/W2764018319","https://openalex.org/W2770880660","https://openalex.org/W2777871853","https://openalex.org/W2789348156","https://openalex.org/W2789893842","https://openalex.org/W2790457714","https://openalex.org/W2790986675","https://openalex.org/W2798864485","https://openalex.org/W2800324696","https://openalex.org/W2802275715","https://openalex.org/W2804156356","https://openalex.org/W2807707058","https://openalex.org/W2885809152","https://openalex.org/W2886500942","https://openalex.org/W2887553645","https://openalex.org/W3005798181","https://openalex.org/W4238574806","https://openalex.org/W6630264892","https://openalex.org/W6634899023","https://openalex.org/W6635990686","https://openalex.org/W6637487730","https://openalex.org/W6652130693","https://openalex.org/W6666534038","https://openalex.org/W6670527953","https://openalex.org/W6674882058","https://openalex.org/W6675479308","https://openalex.org/W6681867354","https://openalex.org/W6684114955","https://openalex.org/W6751974933"],"related_works":["https://openalex.org/W2243331684","https://openalex.org/W2895920022","https://openalex.org/W2918291679","https://openalex.org/W3189070795","https://openalex.org/W2138574771","https://openalex.org/W1528217121","https://openalex.org/W2015719117","https://openalex.org/W1970419561","https://openalex.org/W4392663406","https://openalex.org/W4255571144"],"abstract_inverted_index":{"Antenna-in-package":[0],"(AiP)":[1],"technology,":[2],"in":[3,17,30,52,87,211],"which":[4],"there":[5],"is":[6,67,142,161],"an":[7,23,117,216],"antenna":[8,25,76,105,140],"(or":[9,15],"antennas)":[10],"with":[11],"a":[12,18,191,212,225],"transceiver":[13],"die":[14],"dies)":[16],"standard":[19],"surface-mounted":[20],"device,":[21],"represents":[22],"important":[24],"and":[26,44,62,77,84,106,130,166,170,185,199,224,234],"packaging":[27,78,107],"technology":[28,34,71,99,108],"achievement":[29],"recent":[31],"years.":[32],"AiP":[33,70,98,123,133,197,207,249],"has":[35,48,100],"been":[36],"widely":[37],"adopted":[38],"by":[39],"chipmakers":[40],"for":[41,109,132,154,163],"60-GHz":[42],"radios":[43],"gesture":[45],"radars.":[46],"It":[47,66,125,135,202],"also":[49,73,189],"found":[50],"applications":[51],"77-GHz":[53],"automotive":[54],"radars,":[55],"94-GHz":[56],"phased":[57],"arrays,":[58],"122-GHz":[59],"imaging":[60],"sensors,":[61],"300-GHz":[63],"wireless":[64],"links.":[65],"believed":[68],"that":[69,97,138,149,157,167],"will":[72,115,126,136,232],"provide":[74,116],"elegant":[75],"solutions":[79],"to":[80,194,205,241],"the":[81,88,103,120,139,155,158,168,243,246],"fifth":[82],"generation":[83],"beyond":[85],"operating":[86],"lower":[89],"millimeter-wave":[90],"(mmWave)":[91],"bands.":[92],"Thus,":[93],"one":[94],"can":[95,150],"conclude":[96],"emerged":[101],"as":[102,178],"mainstream":[104],"various":[110],"mmWave":[111,196],"applications.":[112],"This":[113,187],"article":[114,188,231],"overview":[118],"of":[119,122,245,248],"development":[121],"technology.":[124,134,250],"consider":[127],"antennas,":[128],"packages,":[129],"interconnects":[131],"show":[137],"choice":[141,160],"usually":[143],"based":[144],"on":[145,204,238],"those":[146],"popular":[147],"antennas":[148],"be":[151],"easily":[152],"designed":[153],"application,":[156],"package":[159],"governed":[162],"automatic":[164],"assembly,":[165],"materials":[169],"processes":[171],"choices":[172],"involve":[173],"tradeoffs":[174],"among":[175],"constraints,":[176],"such":[177],"electrical":[179],"performance,":[180],"thermal-mechanical":[181],"reliability,":[182],"compactness,":[183],"manufacturability,":[184],"cost.":[186],"shows":[190],"probe-based":[192],"setup":[193],"measure":[195],"impedance":[198],"radiation":[200],"characteristics.":[201],"goes":[203],"give":[206],"examples":[208],"implemented,":[209],"respectively,":[210],"low-temperature":[213],"co-fired":[214],"ceramic,":[215],"embedded":[217],"wafer":[218],"level":[219],"ball":[220],"grid":[221],"array":[222],"process,":[223],"high-density":[226],"interconnect":[227],"processes.":[228],"Finally,":[229],"this":[230],"summarize":[233],"present":[235],"some":[236],"recommendations":[237],"research":[239],"topics":[240],"further":[242],"state":[244],"art":[247]},"counts_by_year":[{"year":2026,"cited_by_count":7},{"year":2025,"cited_by_count":33},{"year":2024,"cited_by_count":37},{"year":2023,"cited_by_count":39},{"year":2022,"cited_by_count":39},{"year":2021,"cited_by_count":56},{"year":2020,"cited_by_count":16},{"year":2019,"cited_by_count":1}],"updated_date":"2026-07-15T18:14:33.161393","created_date":"2025-10-10T00:00:00"}