{"id":"https://openalex.org/W2589042619","doi":"https://doi.org/10.1109/jproc.2017.2653178","title":"Multimaterial and Multilayer Direct Digital Manufacturing of 3-D Structural Microwave Electronics","display_name":"Multimaterial and Multilayer Direct Digital Manufacturing of 3-D Structural Microwave Electronics","publication_year":2017,"publication_date":"2017-02-13","ids":{"openalex":"https://openalex.org/W2589042619","doi":"https://doi.org/10.1109/jproc.2017.2653178","mag":"2589042619"},"language":"en","primary_location":{"id":"doi:10.1109/jproc.2017.2653178","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jproc.2017.2653178","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5016543371","display_name":"Kenneth Church","orcid":"https://orcid.org/0000-0001-8378-6069"},"institutions":[{"id":"https://openalex.org/I4210159805","display_name":"Sciperio (United States)","ror":"https://ror.org/05h017e13","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159805"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Kenneth H. Church","raw_affiliation_strings":["Sciperio Inc., Orlando, FL, USA"],"affiliations":[{"raw_affiliation_string":"Sciperio Inc., Orlando, FL, USA","institution_ids":["https://openalex.org/I4210159805"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5044700287","display_name":"Nathan Crane","orcid":"https://orcid.org/0000-0002-9170-346X"},"institutions":[{"id":"https://openalex.org/I2613432","display_name":"University of South Florida","ror":"https://ror.org/032db5x82","country_code":"US","type":"education","lineage":["https://openalex.org/I2613432"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nathan B. Crane","raw_affiliation_strings":["Department of Mechanical Engineering, University of South Florida, Tampa, FL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of South Florida, Tampa, FL, USA","institution_ids":["https://openalex.org/I2613432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018381346","display_name":"Paul I. Deffenbaugh","orcid":"https://orcid.org/0000-0002-2954-8091"},"institutions":[{"id":"https://openalex.org/I4210159805","display_name":"Sciperio (United States)","ror":"https://ror.org/05h017e13","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159805"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul I. Deffenbaugh","raw_affiliation_strings":["Sciperio Inc., Orlando, FL, USA"],"affiliations":[{"raw_affiliation_string":"Sciperio Inc., Orlando, FL, USA","institution_ids":["https://openalex.org/I4210159805"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5012615855","display_name":"Thomas P. Ketterl","orcid":null},"institutions":[{"id":"https://openalex.org/I2613432","display_name":"University of South Florida","ror":"https://ror.org/032db5x82","country_code":"US","type":"education","lineage":["https://openalex.org/I2613432"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Thomas P. Ketterl","raw_affiliation_strings":["Department of Electrical Engineering, University of South Florida, Tampa, FL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, University of South Florida, Tampa, FL, USA","institution_ids":["https://openalex.org/I2613432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030505361","display_name":"Clayton Neff","orcid":"https://orcid.org/0000-0002-6972-0415"},"institutions":[{"id":"https://openalex.org/I2613432","display_name":"University of South Florida","ror":"https://ror.org/032db5x82","country_code":"US","type":"education","lineage":["https://openalex.org/I2613432"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Clayton G. Neff","raw_affiliation_strings":["Department of Mechanical Engineering, University of South Florida, Tampa, FL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of South Florida, Tampa, FL, USA","institution_ids":["https://openalex.org/I2613432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027080010","display_name":"Patrick B. Nesbitt","orcid":null},"institutions":[{"id":"https://openalex.org/I2613432","display_name":"University of South Florida","ror":"https://ror.org/032db5x82","country_code":"US","type":"education","lineage":["https://openalex.org/I2613432"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Patrick B. Nesbitt","raw_affiliation_strings":["Department of Electrical Engineering, University of South Florida, Tampa, FL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, University of South Florida, Tampa, FL, USA","institution_ids":["https://openalex.org/I2613432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066319911","display_name":"Justin Nussbaum","orcid":"https://orcid.org/0000-0001-6648-8158"},"institutions":[{"id":"https://openalex.org/I2613432","display_name":"University of South Florida","ror":"https://ror.org/032db5x82","country_code":"US","type":"education","lineage":["https://openalex.org/I2613432"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Justin T. Nussbaum","raw_affiliation_strings":["Department of Mechanical Engineering, University of South Florida, Tampa, FL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of South Florida, Tampa, FL, USA","institution_ids":["https://openalex.org/I2613432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068381897","display_name":"Casey Perkowski","orcid":null},"institutions":[{"id":"https://openalex.org/I4210159805","display_name":"Sciperio (United States)","ror":"https://ror.org/05h017e13","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159805"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Casey Perkowski","raw_affiliation_strings":["Sciperio Inc., Orlando, FL, USA"],"affiliations":[{"raw_affiliation_string":"Sciperio Inc., Orlando, FL, USA","institution_ids":["https://openalex.org/I4210159805"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091091073","display_name":"Harvey Tsang","orcid":"https://orcid.org/0000-0003-3081-9693"},"institutions":[{"id":"https://openalex.org/I4210159805","display_name":"Sciperio (United States)","ror":"https://ror.org/05h017e13","country_code":"US","type":"company","lineage":["https://openalex.org/I4210159805"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Harvey Tsang","raw_affiliation_strings":["Sciperio Inc., Orlando, FL, USA"],"affiliations":[{"raw_affiliation_string":"Sciperio Inc., Orlando, FL, USA","institution_ids":["https://openalex.org/I4210159805"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101811345","display_name":"Juan Castro","orcid":"https://orcid.org/0000-0002-6817-7211"},"institutions":[{"id":"https://openalex.org/I2613432","display_name":"University of South Florida","ror":"https://ror.org/032db5x82","country_code":"US","type":"education","lineage":["https://openalex.org/I2613432"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Juan Castro","raw_affiliation_strings":["Department of Electrical Engineering, University of South Florida, Tampa, FL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, University of South Florida, Tampa, FL, USA","institution_ids":["https://openalex.org/I2613432"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100378619","display_name":"Jing Wang","orcid":"https://orcid.org/0000-0002-9380-4467"},"institutions":[{"id":"https://openalex.org/I2613432","display_name":"University of South Florida","ror":"https://ror.org/032db5x82","country_code":"US","type":"education","lineage":["https://openalex.org/I2613432"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jing Wang","raw_affiliation_strings":["Department of Electrical Engineering, University of South Florida, Tampa, FL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, University of South Florida, Tampa, FL, USA","institution_ids":["https://openalex.org/I2613432"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5016164381","display_name":"T. Weller","orcid":"https://orcid.org/0000-0003-4418-7922"},"institutions":[{"id":"https://openalex.org/I2613432","display_name":"University of South Florida","ror":"https://ror.org/032db5x82","country_code":"US","type":"education","lineage":["https://openalex.org/I2613432"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Thomas M. Weller","raw_affiliation_strings":["Department of Electrical Engineering, University of South Florida, Tampa, FL, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, University of South Florida, Tampa, FL, USA","institution_ids":["https://openalex.org/I2613432"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":12,"corresponding_author_ids":["https://openalex.org/A5016543371"],"corresponding_institution_ids":["https://openalex.org/I4210159805"],"apc_list":null,"apc_paid":null,"fwci":3.3346,"has_fulltext":false,"cited_by_count":44,"citation_normalized_percentile":{"value":0.92436257,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":94,"max":99},"biblio":{"volume":"105","issue":"4","first_page":"688","last_page":"701"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11383","display_name":"Advanced Antenna and Metasurface Technologies","score":0.9926000237464905,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9833999872207642,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.728132963180542},{"id":"https://openalex.org/keywords/fixture","display_name":"Fixture","score":0.6725419759750366},{"id":"https://openalex.org/keywords/printed-electronics","display_name":"Printed electronics","score":0.6228850483894348},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.5154300928115845},{"id":"https://openalex.org/keywords/digital-manufacturing","display_name":"Digital manufacturing","score":0.4837248623371124},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.48318901658058167},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.4433751702308655},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.3731392025947571},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3664706349372864},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.32235682010650635},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.29263973236083984}],"concepts":[{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.728132963180542},{"id":"https://openalex.org/C2781122048","wikidata":"https://www.wikidata.org/wiki/Q15983064","display_name":"Fixture","level":2,"score":0.6725419759750366},{"id":"https://openalex.org/C25435620","wikidata":"https://www.wikidata.org/wiki/Q1497629","display_name":"Printed electronics","level":3,"score":0.6228850483894348},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5154300928115845},{"id":"https://openalex.org/C2780841897","wikidata":"https://www.wikidata.org/wiki/Q25349015","display_name":"Digital manufacturing","level":2,"score":0.4837248623371124},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.48318901658058167},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4433751702308655},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3731392025947571},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3664706349372864},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.32235682010650635},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.29263973236083984},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/jproc.2017.2653178","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jproc.2017.2653178","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},{"id":"pmh:oai:scholarcommons.usf.edu:egr_facpub-1026","is_oa":false,"landing_page_url":"https://scholarcommons.usf.edu/egr_facpub/26","pdf_url":null,"source":{"id":"https://openalex.org/S4377196272","display_name":"Digital Commons - University of South Florida (University of South Florida)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I2613432","host_organization_name":"University of South Florida","host_organization_lineage":["https://openalex.org/I2613432"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Mechanical Engineering Faculty Publications","raw_type":"text"},{"id":"pmh:oai:digitalcommons.usf.edu:egr_facpub-1026","is_oa":false,"landing_page_url":"https://digitalcommons.usf.edu/egr_facpub/26","pdf_url":null,"source":{"id":"https://openalex.org/S4377196272","display_name":"Digital Commons - University of South Florida (University of South Florida)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I2613432","host_organization_name":"University of South Florida","host_organization_lineage":["https://openalex.org/I2613432"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Mechanical Engineering Faculty Publications","raw_type":"article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.5899999737739563}],"awards":[{"id":"https://openalex.org/G1715796964","display_name":null,"funder_award_id":"contract #N00014-14-C-0155","funder_id":"https://openalex.org/F4320337345","funder_display_name":"Office of Naval Research"}],"funders":[{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"},{"id":"https://openalex.org/F4320337345","display_name":"Office of Naval Research","ror":"https://ror.org/00rk2pe57"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":52,"referenced_works":["https://openalex.org/W1484204811","https://openalex.org/W1544047461","https://openalex.org/W1549156645","https://openalex.org/W1581389895","https://openalex.org/W1586219442","https://openalex.org/W1596910215","https://openalex.org/W1620791355","https://openalex.org/W1771912175","https://openalex.org/W1777057793","https://openalex.org/W1858096020","https://openalex.org/W1941965874","https://openalex.org/W1966795995","https://openalex.org/W1968270144","https://openalex.org/W1978568424","https://openalex.org/W2005155548","https://openalex.org/W2005382745","https://openalex.org/W2048025313","https://openalex.org/W2092786211","https://openalex.org/W2095219446","https://openalex.org/W2096703017","https://openalex.org/W2099952369","https://openalex.org/W2102966814","https://openalex.org/W2103417572","https://openalex.org/W2114389817","https://openalex.org/W2120146334","https://openalex.org/W2120358100","https://openalex.org/W2125660801","https://openalex.org/W2129612637","https://openalex.org/W2129925529","https://openalex.org/W2138726915","https://openalex.org/W2140521569","https://openalex.org/W2181500729","https://openalex.org/W2186875482","https://openalex.org/W2196000203","https://openalex.org/W2215407585","https://openalex.org/W2259021812","https://openalex.org/W2298477900","https://openalex.org/W2308320691","https://openalex.org/W2314924494","https://openalex.org/W2346129644","https://openalex.org/W2463291733","https://openalex.org/W2513413123","https://openalex.org/W2521475505","https://openalex.org/W2523759495","https://openalex.org/W2616637566","https://openalex.org/W2784588457","https://openalex.org/W4214749394","https://openalex.org/W6636699648","https://openalex.org/W6697608121","https://openalex.org/W6747793897","https://openalex.org/W6990515041","https://openalex.org/W7033988562"],"related_works":["https://openalex.org/W2070716619","https://openalex.org/W2387394119","https://openalex.org/W4286373909","https://openalex.org/W2566168132","https://openalex.org/W2163132205","https://openalex.org/W2735618819","https://openalex.org/W2033442285","https://openalex.org/W3165159289","https://openalex.org/W2381919764","https://openalex.org/W4378377397"],"abstract_inverted_index":{"Direct":[0],"digital":[1,38],"manufacturing":[2,39],"(DDM)":[3],"is":[4,9,58,91],"an":[5],"emerging":[6],"technology":[7,33],"that":[8],"finding":[10],"its":[11],"place":[12],"across":[13],"a":[14,22,35,69,85,92],"wide":[15],"array":[16],"of":[17,37,52,95,110,122,133],"industries":[18],"and":[19,28,49,75,81,107,130,136],"applications":[20,55],"as":[21,68,103,105],"cost-effective":[23],"solution":[24],"for":[25,56,98],"low":[26],"volume":[27],"mass":[29],"customizable":[30],"production.":[31],"This":[32,116],"encompasses":[34],"class":[36,94],"techniques":[40],"which":[41,99],"can":[42],"be":[43],"combined":[44],"to":[45],"enable":[46],"multimaterial":[47],"fabrication":[48],"postprocessing.":[50],"One":[51],"the":[53,78,100,111,119,128],"promising":[54],"DDM":[57,123],"structural":[59,73,89],"electronics,":[60],"where":[61],"lightweight":[62],"printed":[63,139],"plastics":[64],"provide":[65],"mechanical":[66,131],"support":[67],"fixture,":[70],"package,":[71],"or":[72],"member":[74],"also":[76],"host":[77],"electrical":[79,106,129],"interconnects":[80],"devices,":[82],"all":[83],"in":[84],"contiguous":[86],"fashion.":[87],"Microwave":[88],"electronics":[90],"specific":[93],"such":[96],"systems":[97],"printing":[101],"resolution":[102],"well":[104],"surface":[108],"properties":[109,132],"materials":[112],"are":[113],"especially":[114],"important.":[115],"paper":[117],"presents":[118],"current":[120],"state":[121],"technology,":[124],"fundamental":[125],"research":[126],"into":[127],"as-printed":[134],"structures,":[135],"novel":[137],"3-D":[138],"structures":[140],"operating":[141],"from":[142],"C-band":[143],"through":[144],"Ku-band.":[145]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":11},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":4},{"year":2021,"cited_by_count":4},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":5},{"year":2018,"cited_by_count":5},{"year":2017,"cited_by_count":5}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}