{"id":"https://openalex.org/W2592041218","doi":"https://doi.org/10.1109/jproc.2016.2639520","title":"Investigation on 3-D-Printing Technologies for Millimeter- Wave and Terahertz Applications","display_name":"Investigation on 3-D-Printing Technologies for Millimeter- Wave and Terahertz Applications","publication_year":2017,"publication_date":"2017-03-01","ids":{"openalex":"https://openalex.org/W2592041218","doi":"https://doi.org/10.1109/jproc.2016.2639520","mag":"2592041218"},"language":"en","primary_location":{"id":"doi:10.1109/jproc.2016.2639520","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jproc.2016.2639520","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111195695","display_name":"Bing Zhang","orcid":"https://orcid.org/0000-0001-7296-3314"},"institutions":[{"id":"https://openalex.org/I165932596","display_name":"National University of Singapore","ror":"https://ror.org/01tgyzw49","country_code":"SG","type":"education","lineage":["https://openalex.org/I165932596"]}],"countries":["SG"],"is_corresponding":true,"raw_author_name":"Bing Zhang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore","institution_ids":["https://openalex.org/I165932596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100754016","display_name":"Yong\u2010Xin Guo","orcid":"https://orcid.org/0000-0001-8842-5609"},"institutions":[{"id":"https://openalex.org/I165932596","display_name":"National University of Singapore","ror":"https://ror.org/01tgyzw49","country_code":"SG","type":"education","lineage":["https://openalex.org/I165932596"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Yong-Xin Guo","raw_affiliation_strings":["Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, National University of Singapore, Singapore, Singapore","institution_ids":["https://openalex.org/I165932596"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085351155","display_name":"Herbert Zirath","orcid":"https://orcid.org/0000-0002-5721-4793"},"institutions":[{"id":"https://openalex.org/I1306339040","display_name":"Ericsson (Sweden)","ror":"https://ror.org/05a7rhx54","country_code":"SE","type":"company","lineage":["https://openalex.org/I1306339040"]},{"id":"https://openalex.org/I66862912","display_name":"Chalmers University of Technology","ror":"https://ror.org/040wg7k59","country_code":"SE","type":"education","lineage":["https://openalex.org/I66862912"]}],"countries":["SE"],"is_corresponding":false,"raw_author_name":"Herbert Zirath","raw_affiliation_strings":["Ericsson Research, Gothenburg, Ericsson AB, Sweden","Microwave Electronics Laboratory (MEL), Chalmers University of Technology, Gothenburg, Sweden"],"affiliations":[{"raw_affiliation_string":"Ericsson Research, Gothenburg, Ericsson AB, Sweden","institution_ids":["https://openalex.org/I1306339040"]},{"raw_affiliation_string":"Microwave Electronics Laboratory (MEL), Chalmers University of Technology, Gothenburg, Sweden","institution_ids":["https://openalex.org/I66862912"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101482092","display_name":"Yueping Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I172675005","display_name":"Nanyang Technological University","ror":"https://ror.org/02e7b5302","country_code":"SG","type":"education","lineage":["https://openalex.org/I172675005"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Yue Ping Zhang","raw_affiliation_strings":["School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore","institution_ids":["https://openalex.org/I172675005"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5111195695"],"corresponding_institution_ids":["https://openalex.org/I165932596"],"apc_list":null,"apc_paid":null,"fwci":13.1422,"has_fulltext":false,"cited_by_count":194,"citation_normalized_percentile":{"value":0.99099152,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":97,"max":100},"biblio":{"volume":"105","issue":"4","first_page":"723","last_page":"736"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9948999881744385,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11383","display_name":"Advanced Antenna and Metasurface Technologies","score":0.9943000078201294,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/terahertz-radiation","display_name":"Terahertz radiation","score":0.9091281890869141},{"id":"https://openalex.org/keywords/extremely-high-frequency","display_name":"Extremely high frequency","score":0.655700147151947},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.5422064661979675},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5070450305938721},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4964216351509094},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.34164494276046753},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.29085400700569153},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.25813472270965576},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1703166663646698}],"concepts":[{"id":"https://openalex.org/C107816215","wikidata":"https://www.wikidata.org/wiki/Q647887","display_name":"Terahertz radiation","level":2,"score":0.9091281890869141},{"id":"https://openalex.org/C45764600","wikidata":"https://www.wikidata.org/wiki/Q570342","display_name":"Extremely high frequency","level":2,"score":0.655700147151947},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.5422064661979675},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5070450305938721},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4964216351509094},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.34164494276046753},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.29085400700569153},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.25813472270965576},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1703166663646698},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/jproc.2016.2639520","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jproc.2016.2639520","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},{"id":"pmh:oai:publications.lib.chalmers.se:249336","is_oa":false,"landing_page_url":"http://publications.lib.chalmers.se/publication/249336-investigation-on-3-d-printing-technologies-for-millimeter-wave-and-terahertz-applications","pdf_url":null,"source":{"id":"https://openalex.org/S4377196470","display_name":"Chalmers Publication Library (Chalmers University of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I66862912","host_organization_name":"Chalmers University of Technology","host_organization_lineage":["https://openalex.org/I66862912"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Text.Article.Journal.PeerReviewed"},{"id":"pmh:oai:research.chalmers.se:249336","is_oa":false,"landing_page_url":"https://research.chalmers.se/en/publication/249336","pdf_url":null,"source":{"id":"https://openalex.org/S4306402469","display_name":"Chalmers Research (Chalmers University of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I66862912","host_organization_name":"Chalmers University of Technology","host_organization_lineage":["https://openalex.org/I66862912"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":""}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5600000023841858,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":38,"referenced_works":["https://openalex.org/W1594127327","https://openalex.org/W1625962795","https://openalex.org/W1771912175","https://openalex.org/W1858096020","https://openalex.org/W1902067154","https://openalex.org/W1976463688","https://openalex.org/W1976821108","https://openalex.org/W1977898273","https://openalex.org/W1979715221","https://openalex.org/W1984896771","https://openalex.org/W1997557895","https://openalex.org/W2006201699","https://openalex.org/W2007555430","https://openalex.org/W2022883398","https://openalex.org/W2036160082","https://openalex.org/W2044161436","https://openalex.org/W2046291257","https://openalex.org/W2046775593","https://openalex.org/W2053552037","https://openalex.org/W2061513993","https://openalex.org/W2065579036","https://openalex.org/W2085637894","https://openalex.org/W2122048880","https://openalex.org/W2128303589","https://openalex.org/W2131902899","https://openalex.org/W2155474974","https://openalex.org/W2158387526","https://openalex.org/W2167633285","https://openalex.org/W2171378346","https://openalex.org/W2182087764","https://openalex.org/W2211738152","https://openalex.org/W2290502851","https://openalex.org/W2326633757","https://openalex.org/W2327248980","https://openalex.org/W2345081572","https://openalex.org/W2414912487","https://openalex.org/W4244857237","https://openalex.org/W6696995479"],"related_works":["https://openalex.org/W2762687161","https://openalex.org/W2353254830","https://openalex.org/W2033952283","https://openalex.org/W2351210568","https://openalex.org/W2028421553","https://openalex.org/W2890072373","https://openalex.org/W2105973023","https://openalex.org/W3000002614","https://openalex.org/W2800192479","https://openalex.org/W3040184894"],"abstract_inverted_index":{"Three-dimensional-printing":[0],"technologies":[1,36,89],"have":[2],"been":[3],"receiving":[4],"great":[5],"attention":[6],"for":[7,16,96,101,134],"a":[8,94],"wide":[9],"variety":[10],"of":[11,33,86,122,127],"applications":[12],"in":[13,23,37,90,115],"recent":[14],"years":[15],"cost":[17],"effectiveness,":[18],"eco-friendliness,":[19],"and":[20,31,42,55,68,75,83,110,130,140,147],"process":[21],"simplicity":[22],"complicated":[24],"structures.":[25],"This":[26],"paper":[27],"describes":[28],"the":[29,49,80,107,112,123],"challenges":[30],"solutions":[32],"applying":[34],"3-D-printing":[35,88,132],"fabricating":[38],"passive":[39,53,66],"millimeter-wave":[40],"(mmWave)":[41],"terahertz":[43],"(THz)":[44],"devices.":[45,57],"First,":[46],"we":[47,59,78,105],"review":[48],"state-of-the-art":[50],"dielectric":[51,129],"3-D-printed":[52,64],"mmWave":[54,67,139,146],"THz":[56,69,141,148],"Then,":[58],"focus":[60],"on":[61],"our":[62],"novel":[63],"metallic":[65,131],"devices":[70,142],"such":[71],"as":[72],"horn":[73],"antennas":[74],"waveguides.":[76],"Next,":[77],"analyze":[79],"dimensional":[81],"tolerance":[82],"surface":[84,119],"roughness":[85],"various":[87],"order":[91],"to":[92],"provide":[93],"guide":[95],"choosing":[97],"an":[98],"appropriate":[99],"technology":[100,133],"specific":[102],"applications.":[103],"Finally,":[104],"summarize":[106],"current":[108],"work":[109],"identify":[111],"future":[113],"studies":[114],"material":[116],"powder":[117],"refinement,":[118],"treatment,":[120],"optimization":[121],"print":[124],"process,":[125],"development":[126],"hybrid":[128],"realizing":[135],"not":[136],"only":[137],"simple":[138],"but":[143],"also":[144],"sophisticated":[145],"systems.":[149]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":12},{"year":2024,"cited_by_count":20},{"year":2023,"cited_by_count":26},{"year":2022,"cited_by_count":19},{"year":2021,"cited_by_count":25},{"year":2020,"cited_by_count":28},{"year":2019,"cited_by_count":35},{"year":2018,"cited_by_count":23},{"year":2017,"cited_by_count":4}],"updated_date":"2026-04-04T16:13:02.066488","created_date":"2025-10-10T00:00:00"}