{"id":"https://openalex.org/W1524688471","doi":"https://doi.org/10.1109/jproc.2015.2414486","title":"Special issue on advanced flexible electronics for sensing applications [Scanning the Issue]","display_name":"Special issue on advanced flexible electronics for sensing applications [Scanning the Issue]","publication_year":2015,"publication_date":"2015-04-01","ids":{"openalex":"https://openalex.org/W1524688471","doi":"https://doi.org/10.1109/jproc.2015.2414486","mag":"1524688471"},"language":"en","primary_location":{"id":"doi:10.1109/jproc.2015.2414486","is_oa":true,"landing_page_url":"https://doi.org/10.1109/jproc.2015.2414486","pdf_url":"https://ieeexplore.ieee.org/ielx7/5/7110409/07110428.pdf","source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},"type":"editorial","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://ieeexplore.ieee.org/ielx7/5/7110409/07110428.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5071135697","display_name":"Robert H. Reuss","orcid":null},"institutions":[{"id":"https://openalex.org/I72816309","display_name":"Drexel University","ror":"https://ror.org/04bdffz58","country_code":"US","type":"education","lineage":["https://openalex.org/I72816309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Robert H. Reuss","raw_affiliation_strings":["Microsystems Technology Office","Drexel University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Microsystems Technology Office","institution_ids":[]},{"raw_affiliation_string":"Drexel University","institution_ids":["https://openalex.org/I72816309"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111744541","display_name":"Gregory B. Raupp","orcid":null},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]},{"id":"https://openalex.org/I55732556","display_name":"Arizona State University","ror":"https://ror.org/03efmqc40","country_code":"US","type":"education","lineage":["https://openalex.org/I55732556"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Gregory B. Raupp","raw_affiliation_strings":["Arizona State University","Purdue University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Arizona State University","institution_ids":["https://openalex.org/I55732556"]},{"raw_affiliation_string":"Purdue University","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049426435","display_name":"Bruce E. Gnade","orcid":"https://orcid.org/0000-0001-8949-0728"},"institutions":[{"id":"https://openalex.org/I182980787","display_name":"University of Dallas","ror":"https://ror.org/00v3ak792","country_code":"US","type":"education","lineage":["https://openalex.org/I182980787"]},{"id":"https://openalex.org/I4210121589","display_name":"UCLouvain Saint-Louis Brussels","ror":"https://ror.org/02ygek028","country_code":"BE","type":"education","lineage":["https://openalex.org/I4210121589","https://openalex.org/I95674353"]}],"countries":["BE","US"],"is_corresponding":false,"raw_author_name":"Bruce E. Gnade","raw_affiliation_strings":["University of Texas Dallas",", Saint Louis University"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Texas Dallas","institution_ids":["https://openalex.org/I182980787"]},{"raw_affiliation_string":", Saint Louis University","institution_ids":["https://openalex.org/I4210121589"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":true,"cited_by_count":18,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"103","issue":"4","first_page":"491","last_page":"496"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.47909998893737793,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.47909998893737793,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.8080047369003296},{"id":"https://openalex.org/keywords/conformable-matrix","display_name":"Conformable matrix","score":0.7834370136260986},{"id":"https://openalex.org/keywords/printed-electronics","display_name":"Printed electronics","score":0.6526111960411072},{"id":"https://openalex.org/keywords/context","display_name":"Context (archaeology)","score":0.6029185056686401},{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"Flexible electronics","score":0.5963727831840515},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.5707930326461792},{"id":"https://openalex.org/keywords/stretchable-electronics","display_name":"Stretchable electronics","score":0.47973647713661194},{"id":"https://openalex.org/keywords/thin-film-transistor","display_name":"Thin-film transistor","score":0.4760812819004059},{"id":"https://openalex.org/keywords/form-factor","display_name":"Form factor (electronics)","score":0.46683040261268616},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3458501100540161},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3379644751548767},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.33020326495170593},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.29863977432250977},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2773313522338867},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.11032670736312866}],"concepts":[{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.8080047369003296},{"id":"https://openalex.org/C86072612","wikidata":"https://www.wikidata.org/wiki/Q5160239","display_name":"Conformable matrix","level":2,"score":0.7834370136260986},{"id":"https://openalex.org/C25435620","wikidata":"https://www.wikidata.org/wiki/Q1497629","display_name":"Printed electronics","level":3,"score":0.6526111960411072},{"id":"https://openalex.org/C2779343474","wikidata":"https://www.wikidata.org/wiki/Q3109175","display_name":"Context (archaeology)","level":2,"score":0.6029185056686401},{"id":"https://openalex.org/C84967400","wikidata":"https://www.wikidata.org/wiki/Q1066289","display_name":"Flexible electronics","level":2,"score":0.5963727831840515},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.5707930326461792},{"id":"https://openalex.org/C2781196758","wikidata":"https://www.wikidata.org/wiki/Q7623486","display_name":"Stretchable electronics","level":3,"score":0.47973647713661194},{"id":"https://openalex.org/C87359718","wikidata":"https://www.wikidata.org/wiki/Q1271916","display_name":"Thin-film transistor","level":3,"score":0.4760812819004059},{"id":"https://openalex.org/C2776249927","wikidata":"https://www.wikidata.org/wiki/Q1437700","display_name":"Form factor (electronics)","level":2,"score":0.46683040261268616},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3458501100540161},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3379644751548767},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33020326495170593},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.29863977432250977},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2773313522338867},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.11032670736312866},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/jproc.2015.2414486","is_oa":true,"landing_page_url":"https://doi.org/10.1109/jproc.2015.2414486","pdf_url":"https://ieeexplore.ieee.org/ielx7/5/7110409/07110428.pdf","source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1109/jproc.2015.2414486","is_oa":true,"landing_page_url":"https://doi.org/10.1109/jproc.2015.2414486","pdf_url":"https://ieeexplore.ieee.org/ielx7/5/7110409/07110428.pdf","source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":true,"pdf":true},"content_urls":{"pdf":"https://content.openalex.org/works/W1524688471.pdf","grobid_xml":"https://content.openalex.org/works/W1524688471.grobid-xml"},"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W3142756468","https://openalex.org/W2528725261","https://openalex.org/W1865275338","https://openalex.org/W2911687781","https://openalex.org/W2981157619","https://openalex.org/W2805639326","https://openalex.org/W2944787873","https://openalex.org/W2801442908","https://openalex.org/W2978914726","https://openalex.org/W4316653873"],"abstract_inverted_index":{"This":[0],"articles":[1],"in":[2,41,156],"this":[3],"special":[4],"issue":[5],"on":[6,38,175],"flexible":[7,68,177],"hybrid":[8,32],"electronics":[9,116,149,188],"provides":[10],"insight":[11],"into":[12],"the":[13,23,39,56,95,101,166],"technical":[14],"problems":[15],"that":[16,125,151],"must":[17],"be":[18,127],"overcome":[19],"as":[20,22,190],"well":[21,93],"new":[24],"capabilities":[25],"they":[26],"will":[27],"provide.":[28],"The":[29,143],"term,":[30],"'flexible":[31],"electronics'":[33],"means":[34,111],"different":[35],"things":[36],"based":[37],"context":[40],"which":[42],"it":[43],"is":[44,97,145,193],"being":[45],"discussed.":[46],"It":[47],"could":[48,126],"mean":[49,70],"adaptable":[50],"for":[51],"multiple":[52],"applications,":[53],"but,":[54],"here":[55],"term":[57],"refers":[58],"to":[59,76,98,146,168,195,207],"mechanical":[60],"properties,":[61],"although":[62],"not":[63,92],"necessarily":[64],"precisely":[65],"defined.":[66],"Mechanically":[67],"might":[69],"anything":[71],"from":[72,100],"conformable":[73],"(nonlinear":[74],"shape)":[75],"bendable":[77,182],"or":[78,86],"rollable":[79],"(around":[80],"a":[81,157],"defined":[82],"radius":[83],"of":[84,106,114],"curvature),":[85],"even":[87],"foldable":[88],"and":[89,201],"stretchable.":[90],"Although":[91],"defined,":[94],"intent":[96],"differentiate":[99],"rectangular,":[102],"rigid":[103],"form":[104,161],"factor":[105,162],"conventional":[107,115,130,187],"semiconductor":[108],"electronics.":[109],"Hybrid":[110],"heterogeneous":[112],"integration":[113,185],"with":[117,186],"other":[118],"electronic":[119],"components":[120],"(passive":[121],"devices,":[122],"sensors,":[123],"etc.)":[124],"fabricated":[128,209],"using":[129],"thin-film":[131],"transistor":[132],"(TFT)":[133],"process":[134],"technology":[135],"by":[136],"additive":[137],"printing":[138,164],"(ink":[139],"jet,":[140],"gravure,":[141],"etc.).":[142],"purpose":[144],"provide":[147],"an":[148],"solution":[150],"has":[152],"adequate":[153],"performance,":[154],"but":[155],"low":[158],"cost,":[159],"novel":[160],"because":[163,199],"offers":[165],"ability":[167],"inexpensively":[169],"fabricate":[170],"structures":[171],"over":[172],"large":[173],"areas":[174],"mechanically":[176],"substrates":[178],"(plastics,":[179],"metal":[180],"sheets,":[181],"glass).":[183],"However,":[184],"such":[189],"silicon":[191],"CMOS":[192],"necessary":[194],"achieve":[196],"required":[197],"performance":[198],"TFT":[200],"printed":[202],"devices":[203],"are":[204],"significantly":[205],"inferior":[206],"conventionally":[208],"devices.":[210]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2022,"cited_by_count":3},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":5},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":3}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}