{"id":"https://openalex.org/W2082969233","doi":"https://doi.org/10.1109/jproc.2008.2007466","title":"A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages","display_name":"A Model of BGA Thermal Vias as an Example of Lumped Parameter Analysis in Thermal Modeling of SiPs and Stacked Die Packages","publication_year":2009,"publication_date":"2009-01-01","ids":{"openalex":"https://openalex.org/W2082969233","doi":"https://doi.org/10.1109/jproc.2008.2007466","mag":"2082969233"},"language":"en","primary_location":{"id":"doi:10.1109/jproc.2008.2007466","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jproc.2008.2007466","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5079004475","display_name":"Luigi Pietro Maria Colombo","orcid":"https://orcid.org/0000-0002-6637-1213"},"institutions":[{"id":"https://openalex.org/I4210142437","display_name":"Mylan (Switzerland)","ror":"https://ror.org/045sjkt56","country_code":"CH","type":"company","lineage":["https://openalex.org/I4210142437","https://openalex.org/I4210159288"]},{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"education","lineage":["https://openalex.org/I93860229"]}],"countries":["CH","IT"],"is_corresponding":true,"raw_author_name":"Luigi Pietro Maria Colombo","raw_affiliation_strings":["Dipartimento di Energetica, Politecnico di Milano, Milan, Italy","Dipt. di Energetica, Politec. di Milano, Milan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dipartimento di Energetica, Politecnico di Milano, Milan, Italy","institution_ids":["https://openalex.org/I93860229"]},{"raw_affiliation_string":"Dipt. di Energetica, Politec. di Milano, Milan","institution_ids":["https://openalex.org/I4210142437"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109049847","display_name":"Davide Paleari","orcid":null},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"education","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Davide Paleari","raw_affiliation_strings":["Dipartimento di Elettronica e Informazione, Politecnico di Milano, Milan, Italy","Dipt. di Elettron. e Inf., Politec. di Milano, Milan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dipartimento di Elettronica e Informazione, Politecnico di Milano, Milan, Italy","institution_ids":["https://openalex.org/I93860229"]},{"raw_affiliation_string":"Dipt. di Elettron. e Inf., Politec. di Milano, Milan","institution_ids":["https://openalex.org/I93860229"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030079936","display_name":"A. V. Petrushin","orcid":null},"institutions":[{"id":"https://openalex.org/I93860229","display_name":"Politecnico di Milano","ror":"https://ror.org/01nffqt88","country_code":"IT","type":"education","lineage":["https://openalex.org/I93860229"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Alexey Petrushin","raw_affiliation_strings":["Dipartimento di Elettronica e Informazione, Politecnico di Milano, Milan, Italy","Dipt. di Elettron. e Inf., Politec. di Milano, Milan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dipartimento di Elettronica e Informazione, Politecnico di Milano, Milan, Italy","institution_ids":["https://openalex.org/I93860229"]},{"raw_affiliation_string":"Dipt. di Elettron. e Inf., Politec. di Milano, Milan","institution_ids":["https://openalex.org/I93860229"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5079004475"],"corresponding_institution_ids":["https://openalex.org/I4210142437","https://openalex.org/I93860229"],"apc_list":null,"apc_paid":null,"fwci":0.3051,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.63334922,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"97","issue":"1","first_page":"70","last_page":"77"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.7550606727600098},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6466195583343506},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.6349764466285706},{"id":"https://openalex.org/keywords/heat-flow","display_name":"Heat flow","score":0.5752091407775879},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5605362057685852},{"id":"https://openalex.org/keywords/thermal-analysis","display_name":"Thermal analysis","score":0.5429366230964661},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.43918588757514954},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.3777567744255066},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.37548014521598816},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.23708519339561462},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21688830852508545},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.17525050044059753},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.16891610622406006},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.15637949109077454}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.7550606727600098},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6466195583343506},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.6349764466285706},{"id":"https://openalex.org/C2985596519","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat flow","level":3,"score":0.5752091407775879},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5605362057685852},{"id":"https://openalex.org/C129446986","wikidata":"https://www.wikidata.org/wiki/Q542419","display_name":"Thermal analysis","level":3,"score":0.5429366230964661},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.43918588757514954},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.3777567744255066},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.37548014521598816},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.23708519339561462},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21688830852508545},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.17525050044059753},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.16891610622406006},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.15637949109077454},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/jproc.2008.2007466","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jproc.2008.2007466","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},{"id":"pmh:oai:re.public.polimi.it:11311/521473","is_oa":false,"landing_page_url":"http://hdl.handle.net/11311/521473","pdf_url":null,"source":{"id":"https://openalex.org/S4306400312","display_name":"Virtual Community of Pathological Anatomy (University of Castilla La Mancha)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I79189158","host_organization_name":"University of Castilla-La Mancha","host_organization_lineage":["https://openalex.org/I79189158"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"info:eu-repo/semantics/article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.800000011920929,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":45,"referenced_works":["https://openalex.org/W1538190594","https://openalex.org/W1607939289","https://openalex.org/W1836977198","https://openalex.org/W2016436035","https://openalex.org/W2030700398","https://openalex.org/W2041794760","https://openalex.org/W2055928928","https://openalex.org/W2096012515","https://openalex.org/W2098331456","https://openalex.org/W2103068995","https://openalex.org/W2107982758","https://openalex.org/W2108365723","https://openalex.org/W2118000128","https://openalex.org/W2119296672","https://openalex.org/W2119748286","https://openalex.org/W2123893149","https://openalex.org/W2126353091","https://openalex.org/W2130457995","https://openalex.org/W2134663188","https://openalex.org/W2135370061","https://openalex.org/W2135774353","https://openalex.org/W2135947447","https://openalex.org/W2137309871","https://openalex.org/W2139752984","https://openalex.org/W2140118625","https://openalex.org/W2140673129","https://openalex.org/W2143028470","https://openalex.org/W2148117243","https://openalex.org/W2158969233","https://openalex.org/W2162063086","https://openalex.org/W2163960682","https://openalex.org/W2166805400","https://openalex.org/W2168065748","https://openalex.org/W2168480664","https://openalex.org/W2174240047","https://openalex.org/W2544293679","https://openalex.org/W2562871560","https://openalex.org/W4205088913","https://openalex.org/W4214901480","https://openalex.org/W4235298422","https://openalex.org/W6676270566","https://openalex.org/W6677706830","https://openalex.org/W6681167139","https://openalex.org/W6805625090","https://openalex.org/W6808604902"],"related_works":["https://openalex.org/W1975509756","https://openalex.org/W2122379732","https://openalex.org/W1916213107","https://openalex.org/W2359189194","https://openalex.org/W567677580","https://openalex.org/W2145671245","https://openalex.org/W2051399180","https://openalex.org/W3108867113","https://openalex.org/W4243947487","https://openalex.org/W2373848463"],"abstract_inverted_index":{"<para":[0],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[1],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">":[2],"In":[3],"this":[4],"paper,":[5],"a":[6,100,106],"review":[7],"of":[8,16,42,54,78,92,102,108],"the":[9,24,35,43,55,59,66,76,93,103],"different":[10],"approaches":[11],"to":[12,26,31,98],"stationary":[13],"thermal":[14,90,109],"analysis":[15],"stacked":[17],"die":[18],"packages":[19],"is":[20],"presented,":[21],"focusing":[22],"on":[23],"opportunity":[25],"develop":[27],"compact":[28],"models":[29,83],"suitable":[30],"be":[32],"included":[33],"in":[34,58,65,96],"design":[36],"flow.":[37],"Actually,":[38],"although":[39],"three-dimensional":[40],"integration":[41],"heat":[44],"equation":[45],"by":[46,87],"numerical":[47],"methods":[48],"may":[49],"provide":[50],"an":[51],"accurate":[52],"estimate":[53],"temperature":[56],"distribution":[57],"package,":[60],"its":[61],"main":[62],"drawbacks":[63],"lie":[64],"relatively":[67],"high":[68],"computational":[69],"cost":[70],"and":[71],"time":[72],"consumption,":[73],"together":[74],"with":[75],"need":[77],"very":[79],"experienced":[80],"users.":[81],"Simplified":[82],"are":[84],"thus":[85],"developed":[86],"gradually":[88],"lumping":[89],"parameters":[91],"various":[94],"layers":[95],"order":[97],"attain":[99],"description":[101],"device":[104],"as":[105],"network":[107],"resistances.":[110],"</para>":[111]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2026-05-05T08:41:31.759640","created_date":"2025-10-10T00:00:00"}