{"id":"https://openalex.org/W2165378828","doi":"https://doi.org/10.1109/jproc.2005.851237","title":"Macroelectronics: Perspectives on Technology and Applications","display_name":"Macroelectronics: Perspectives on Technology and Applications","publication_year":2005,"publication_date":"2005-07-01","ids":{"openalex":"https://openalex.org/W2165378828","doi":"https://doi.org/10.1109/jproc.2005.851237","mag":"2165378828"},"language":"en","primary_location":{"id":"doi:10.1109/jproc.2005.851237","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jproc.2005.851237","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5071135697","display_name":"Robert H. Reuss","orcid":null},"institutions":[{"id":"https://openalex.org/I1280581677","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08","country_code":"US","type":"government","lineage":["https://openalex.org/I1280581677","https://openalex.org/I1296703163","https://openalex.org/I1330347796"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"R.H. Reuss","raw_affiliation_strings":["Defence Advanced Research Projects Agency/MicroSystems Technology Office (DARPA/MTO), Arlington, VA, USA","Defense Adv. Res. Projects Agency Microsystems Technol. Office, Arlington, VA, USA"],"affiliations":[{"raw_affiliation_string":"Defence Advanced Research Projects Agency/MicroSystems Technology Office (DARPA/MTO), Arlington, VA, USA","institution_ids":["https://openalex.org/I1280581677"]},{"raw_affiliation_string":"Defense Adv. Res. Projects Agency Microsystems Technol. Office, Arlington, VA, USA","institution_ids":["https://openalex.org/I1280581677"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040830242","display_name":"Babu Chalamala","orcid":"https://orcid.org/0000-0003-0469-636X"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"B.R. Chalamala","raw_affiliation_strings":["Indocel Technologies, Inc., NC, USA"],"affiliations":[{"raw_affiliation_string":"Indocel Technologies, Inc., NC, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070285230","display_name":"Alina Moussessian","orcid":null},"institutions":[{"id":"https://openalex.org/I1334627681","display_name":"Jet Propulsion Laboratory","ror":"https://ror.org/027k65916","country_code":"US","type":"facility","lineage":["https://openalex.org/I122411786","https://openalex.org/I1334627681","https://openalex.org/I4210124779"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Moussessian","raw_affiliation_strings":["Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, USA","Jet Propulsion Laboratory, California Institute of  Technology, Pasadena, CA, USA"],"affiliations":[{"raw_affiliation_string":"Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, USA","institution_ids":["https://openalex.org/I1334627681"]},{"raw_affiliation_string":"Jet Propulsion Laboratory, California Institute of  Technology, Pasadena, CA, USA","institution_ids":["https://openalex.org/I1334627681"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064758243","display_name":"M. Kane","orcid":"https://orcid.org/0000-0003-4558-4284"},"institutions":[{"id":"https://openalex.org/I177697070","display_name":"Yuri Gagarin State Technical University of Saratov","ror":"https://ror.org/01qn0gc28","country_code":"RU","type":"education","lineage":["https://openalex.org/I177697070"]}],"countries":["RU"],"is_corresponding":false,"raw_author_name":"M.G. Kane","raw_affiliation_strings":["Saratov State Technical University, Princeton, NJ, USA","[Saratov State Technical University, Princeton, NJ, USA]"],"affiliations":[{"raw_affiliation_string":"Saratov State Technical University, Princeton, NJ, USA","institution_ids":["https://openalex.org/I177697070"]},{"raw_affiliation_string":"[Saratov State Technical University, Princeton, NJ, USA]","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101868441","display_name":"Amit Kumar","orcid":"https://orcid.org/0000-0002-9682-2935"},"institutions":[{"id":"https://openalex.org/I4210155581","display_name":"Acellent Technologies (United States)","ror":"https://ror.org/05s37rv07","country_code":"US","type":"company","lineage":["https://openalex.org/I4210155581"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Kumar","raw_affiliation_strings":["Acellent Technologies, Inc., Sunnyvale, CA, USA","[Acellent Technologies, Inc., Sunnyvale, CA, USA]"],"affiliations":[{"raw_affiliation_string":"Acellent Technologies, Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I4210155581"]},{"raw_affiliation_string":"[Acellent Technologies, Inc., Sunnyvale, CA, USA]","institution_ids":["https://openalex.org/I4210155581"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052713734","display_name":"D.C. Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210155581","display_name":"Acellent Technologies (United States)","ror":"https://ror.org/05s37rv07","country_code":"US","type":"company","lineage":["https://openalex.org/I4210155581"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D.C. Zhang","raw_affiliation_strings":["Acellent Technologies, Inc., Sunnyvale, CA, USA","[Acellent Technologies, Inc., Sunnyvale, CA, USA]"],"affiliations":[{"raw_affiliation_string":"Acellent Technologies, Inc., Sunnyvale, CA, USA","institution_ids":["https://openalex.org/I4210155581"]},{"raw_affiliation_string":"[Acellent Technologies, Inc., Sunnyvale, CA, USA]","institution_ids":["https://openalex.org/I4210155581"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045551635","display_name":"John A. Rogers","orcid":"https://orcid.org/0000-0002-2980-3961"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.A. Rogers","raw_affiliation_strings":["University of Illinois, Urbana-Champaign, IL, USA","University of Illinois Urbana-Champaign, IL, USA"],"affiliations":[{"raw_affiliation_string":"University of Illinois, Urbana-Champaign, IL, USA","institution_ids":["https://openalex.org/I157725225"]},{"raw_affiliation_string":"University of Illinois Urbana-Champaign, IL, USA","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108506925","display_name":"Miltiadis K. Hatalis","orcid":null},"institutions":[{"id":"https://openalex.org/I186143895","display_name":"Lehigh University","ror":"https://ror.org/012afjb06","country_code":"US","type":"education","lineage":["https://openalex.org/I186143895"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Hatalis","raw_affiliation_strings":["Lehigh University, Bethlehem, PA, USA","Lehigh University, Bethlehem, PA, USA;"],"affiliations":[{"raw_affiliation_string":"Lehigh University, Bethlehem, PA, USA","institution_ids":["https://openalex.org/I186143895"]},{"raw_affiliation_string":"Lehigh University, Bethlehem, PA, USA;","institution_ids":["https://openalex.org/I186143895"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5048998602","display_name":"D. Temple","orcid":"https://orcid.org/0000-0003-4195-6888"},"institutions":[{"id":"https://openalex.org/I180297670","display_name":"RTI International","ror":"https://ror.org/052tfza37","country_code":"US","type":"funder","lineage":["https://openalex.org/I180297670"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Temple","raw_affiliation_strings":["RTI International, Inc., NC, USA","[RTI International, Inc., NC, USA]"],"affiliations":[{"raw_affiliation_string":"RTI International, Inc., NC, USA","institution_ids":["https://openalex.org/I180297670"]},{"raw_affiliation_string":"[RTI International, Inc., NC, USA]","institution_ids":["https://openalex.org/I180297670"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023399302","display_name":"Garret Moddel","orcid":"https://orcid.org/0000-0002-1397-0319"},"institutions":[{"id":"https://openalex.org/I188538660","display_name":"University of Colorado Boulder","ror":"https://ror.org/02ttsq026","country_code":"US","type":"education","lineage":["https://openalex.org/I188538660"]},{"id":"https://openalex.org/I4210095611","display_name":"Phiar (United States)","ror":"https://ror.org/00qh9vh90","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095611"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"G. Moddel","raw_affiliation_strings":["Phiar Corporation, Boulder, CO, USA","University of Colorado, Boulder, CO, USA","[University of Colorado, Boulder, CO, USA, Phiar Corporation, Boulder, CO, USA]"],"affiliations":[{"raw_affiliation_string":"Phiar Corporation, Boulder, CO, USA","institution_ids":["https://openalex.org/I4210095611"]},{"raw_affiliation_string":"University of Colorado, Boulder, CO, USA","institution_ids":["https://openalex.org/I188538660"]},{"raw_affiliation_string":"[University of Colorado, Boulder, CO, USA, Phiar Corporation, Boulder, CO, USA]","institution_ids":["https://openalex.org/I188538660","https://openalex.org/I4210095611"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103144699","display_name":"Bertil Eliasson","orcid":"https://orcid.org/0000-0002-8453-0580"},"institutions":[{"id":"https://openalex.org/I4210095611","display_name":"Phiar (United States)","ror":"https://ror.org/00qh9vh90","country_code":"US","type":"company","lineage":["https://openalex.org/I4210095611"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"B.J. Eliasson","raw_affiliation_strings":["Phiar Corporation, Boulder, CO, USA","[Phiar Corporation, Boulder, CO, USA]"],"affiliations":[{"raw_affiliation_string":"Phiar Corporation, Boulder, CO, USA","institution_ids":["https://openalex.org/I4210095611"]},{"raw_affiliation_string":"[Phiar Corporation, Boulder, CO, USA]","institution_ids":["https://openalex.org/I4210095611"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066452620","display_name":"Michael Estes","orcid":null},"institutions":[{"id":"https://openalex.org/I4210146164","display_name":"Optics Technology (United States)","ror":"https://ror.org/04dwrr446","country_code":"US","type":"company","lineage":["https://openalex.org/I4210146164"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M.J. Estes","raw_affiliation_strings":["Melles Griot Electro-Optics, Longmont, CO, USA","[Melles Griot Electro-Optics, Longmont, CO, USA]"],"affiliations":[{"raw_affiliation_string":"Melles Griot Electro-Optics, Longmont, CO, USA","institution_ids":["https://openalex.org/I4210146164"]},{"raw_affiliation_string":"[Melles Griot Electro-Optics, Longmont, CO, USA]","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042461341","display_name":"J. Kunze","orcid":null},"institutions":[{"id":"https://openalex.org/I4210098531","display_name":"Teledyne e2v (United Kingdom)","ror":"https://ror.org/00e1g8a02","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210098531","https://openalex.org/I880619579"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"J. Kunze","raw_affiliation_strings":["S12 Technologies, Inc., Chelmsford, MA, USA","[S12 Technologies, Inc., Chelmsford, MA, USA]"],"affiliations":[{"raw_affiliation_string":"S12 Technologies, Inc., Chelmsford, MA, USA","institution_ids":["https://openalex.org/I4210098531"]},{"raw_affiliation_string":"[S12 Technologies, Inc., Chelmsford, MA, USA]","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5113448355","display_name":"E. S. Craighill Handy","orcid":null},"institutions":[{"id":"https://openalex.org/I4210098531","display_name":"Teledyne e2v (United Kingdom)","ror":"https://ror.org/00e1g8a02","country_code":"GB","type":"company","lineage":["https://openalex.org/I4210098531","https://openalex.org/I880619579"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"E.S. Handy","raw_affiliation_strings":["S12 Technologies, Inc., Chelmsford, MA, USA","[S12 Technologies, Inc., Chelmsford, MA, USA]"],"affiliations":[{"raw_affiliation_string":"S12 Technologies, Inc., Chelmsford, MA, USA","institution_ids":["https://openalex.org/I4210098531"]},{"raw_affiliation_string":"[S12 Technologies, Inc., Chelmsford, MA, USA]","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109263658","display_name":"E. S. Harmon","orcid":null},"institutions":[{"id":"https://openalex.org/I4210128304","display_name":"LightSpin Technologies (United States)","ror":"https://ror.org/03vyh9251","country_code":"US","type":"company","lineage":["https://openalex.org/I4210128304"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"E.S. Harmon","raw_affiliation_strings":["LightSpin Technologies, Inc., Norfolk, VA, USA","[LightSpin Technologies, Inc., Norfolk, VA, USA]"],"affiliations":[{"raw_affiliation_string":"LightSpin Technologies, Inc., Norfolk, VA, USA","institution_ids":["https://openalex.org/I4210128304"]},{"raw_affiliation_string":"[LightSpin Technologies, Inc., Norfolk, VA, USA]","institution_ids":["https://openalex.org/I4210128304"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013499481","display_name":"David B. Salzman","orcid":null},"institutions":[{"id":"https://openalex.org/I4210128304","display_name":"LightSpin Technologies (United States)","ror":"https://ror.org/03vyh9251","country_code":"US","type":"company","lineage":["https://openalex.org/I4210128304"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D.B. Salzman","raw_affiliation_strings":["LightSpin Technologies, Inc., Bethesda, MD, USA","[LightSpin Technologies, Inc., Bethesda, MD, USA]"],"affiliations":[{"raw_affiliation_string":"LightSpin Technologies, Inc., Bethesda, MD, USA","institution_ids":["https://openalex.org/I4210128304"]},{"raw_affiliation_string":"[LightSpin Technologies, Inc., Bethesda, MD, USA]","institution_ids":["https://openalex.org/I4210128304"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076831896","display_name":"J. M. Woodall","orcid":"https://orcid.org/0000-0003-3347-9591"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.M. Woodall","raw_affiliation_strings":["School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA","School of Electrical and Computer Engineering, Purdue University, West lafayette, IN, USA"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Electrical and Computer Engineering, Purdue University, West lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5062737334","display_name":"Muhammad A. Alam","orcid":"https://orcid.org/0000-0001-8775-6043"},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M.A. Alam","raw_affiliation_strings":["School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA","School of Electrical and Computer Engineering, Purdue University, West lafayette, IN, USA"],"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Electrical and Computer Engineering, Purdue University, West lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103408759","display_name":"Jayathi Y. Murthy","orcid":null},"institutions":[{"id":"https://openalex.org/I219193219","display_name":"Purdue University West Lafayette","ror":"https://ror.org/02dqehb95","country_code":"US","type":"education","lineage":["https://openalex.org/I219193219"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J.Y. Murthy","raw_affiliation_strings":["School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","School of Mechanical Engineering , Purdue University , West Lafayette , IN , USA"],"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA","institution_ids":["https://openalex.org/I219193219"]},{"raw_affiliation_string":"School of Mechanical Engineering , Purdue University , West Lafayette , IN , USA","institution_ids":["https://openalex.org/I219193219"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110268812","display_name":"S.C. Jacobsen","orcid":null},"institutions":[{"id":"https://openalex.org/I4210098443","display_name":"Sarcos (United States)","ror":"https://ror.org/00yc2my06","country_code":"US","type":"company","lineage":["https://openalex.org/I4210098443"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"S.C. Jacobsen","raw_affiliation_strings":["Sarcos, Salt Lake, UT, USA","[Sarcos, Salt Lake, UT, USA]"],"affiliations":[{"raw_affiliation_string":"Sarcos, Salt Lake, UT, USA","institution_ids":["https://openalex.org/I4210098443"]},{"raw_affiliation_string":"[Sarcos, Salt Lake, UT, USA]","institution_ids":["https://openalex.org/I4210098443"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111257046","display_name":"M. Olivier","orcid":null},"institutions":[{"id":"https://openalex.org/I4210098443","display_name":"Sarcos (United States)","ror":"https://ror.org/00yc2my06","country_code":"US","type":"company","lineage":["https://openalex.org/I4210098443"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Olivier","raw_affiliation_strings":["Sarcos, Salt Lake, UT, USA","[Sarcos, Salt Lake, UT, USA]"],"affiliations":[{"raw_affiliation_string":"Sarcos, Salt Lake, UT, USA","institution_ids":["https://openalex.org/I4210098443"]},{"raw_affiliation_string":"[Sarcos, Salt Lake, UT, USA]","institution_ids":["https://openalex.org/I4210098443"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111931477","display_name":"D. Markus","orcid":null},"institutions":[{"id":"https://openalex.org/I4210098443","display_name":"Sarcos (United States)","ror":"https://ror.org/00yc2my06","country_code":"US","type":"company","lineage":["https://openalex.org/I4210098443"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D. Markus","raw_affiliation_strings":["Sarcos, Salt Lake, UT, USA","[Sarcos, Salt Lake, UT, USA]"],"affiliations":[{"raw_affiliation_string":"Sarcos, Salt Lake, UT, USA","institution_ids":["https://openalex.org/I4210098443"]},{"raw_affiliation_string":"[Sarcos, Salt Lake, UT, USA]","institution_ids":["https://openalex.org/I4210098443"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103577736","display_name":"P. M. Campbell","orcid":null},"institutions":[{"id":"https://openalex.org/I1288214837","display_name":"United States Naval Research Laboratory","ror":"https://ror.org/04d23a975","country_code":"US","type":"facility","lineage":["https://openalex.org/I1288214837","https://openalex.org/I1330347796","https://openalex.org/I175003984","https://openalex.org/I3130687028"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"P.M. Campbell","raw_affiliation_strings":["Naval Research Laboratory, Inc., Washington D.C., USA","[Naval Research Laboratory, Inc., Washington D.C., USA, ]"],"affiliations":[{"raw_affiliation_string":"Naval Research Laboratory, Inc., Washington D.C., USA","institution_ids":["https://openalex.org/I1288214837"]},{"raw_affiliation_string":"[Naval Research Laboratory, Inc., Washington D.C., USA, ]","institution_ids":["https://openalex.org/I1288214837"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5060304371","display_name":"Eric Snow","orcid":"https://orcid.org/0000-0002-7464-8323"},"institutions":[{"id":"https://openalex.org/I1288214837","display_name":"United States Naval Research Laboratory","ror":"https://ror.org/04d23a975","country_code":"US","type":"facility","lineage":["https://openalex.org/I1288214837","https://openalex.org/I1330347796","https://openalex.org/I175003984","https://openalex.org/I3130687028"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"E. Snow","raw_affiliation_strings":["Naval Research Laboratory, Inc., Washington D.C., USA","[Naval Research Laboratory, Inc., Washington D.C., USA, ]"],"affiliations":[{"raw_affiliation_string":"Naval Research Laboratory, Inc., Washington D.C., USA","institution_ids":["https://openalex.org/I1288214837"]},{"raw_affiliation_string":"[Naval Research Laboratory, Inc., Washington D.C., USA, ]","institution_ids":["https://openalex.org/I1288214837"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":24,"corresponding_author_ids":["https://openalex.org/A5071135697"],"corresponding_institution_ids":["https://openalex.org/I1280581677"],"apc_list":null,"apc_paid":null,"fwci":24.2757,"has_fulltext":false,"cited_by_count":352,"citation_normalized_percentile":{"value":0.99743268,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":97,"max":100},"biblio":{"volume":"93","issue":"7","first_page":"1239","last_page":"1256"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11272","display_name":"Nanowire Synthesis and Applications","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/nanocrystalline-material","display_name":"Nanocrystalline material","score":0.6644507646560669},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6327738165855408},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.49789977073669434},{"id":"https://openalex.org/keywords/amorphous-semiconductors","display_name":"Amorphous semiconductors","score":0.45998185873031616},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.42024150490760803},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.3777755796909332},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3744187355041504},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3203381597995758},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3149397671222687},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.10835936665534973}],"concepts":[{"id":"https://openalex.org/C140676511","wikidata":"https://www.wikidata.org/wiki/Q6964018","display_name":"Nanocrystalline material","level":2,"score":0.6644507646560669},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6327738165855408},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.49789977073669434},{"id":"https://openalex.org/C2986957394","wikidata":"https://www.wikidata.org/wiki/Q474163","display_name":"Amorphous semiconductors","level":3,"score":0.45998185873031616},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.42024150490760803},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3777755796909332},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3744187355041504},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3203381597995758},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3149397671222687},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.10835936665534973}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/jproc.2005.851237","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jproc.2005.851237","pdf_url":null,"source":{"id":"https://openalex.org/S68686220","display_name":"Proceedings of the IEEE","issn_l":"0018-9219","issn":["0018-9219","1558-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the IEEE","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.550000011920929,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":54,"referenced_works":["https://openalex.org/W573155485","https://openalex.org/W614372590","https://openalex.org/W969181653","https://openalex.org/W1925473201","https://openalex.org/W1963494445","https://openalex.org/W1967976553","https://openalex.org/W1972367479","https://openalex.org/W1975321587","https://openalex.org/W1976856814","https://openalex.org/W1980958611","https://openalex.org/W1983821985","https://openalex.org/W1992261746","https://openalex.org/W1993991870","https://openalex.org/W2004074762","https://openalex.org/W2005921149","https://openalex.org/W2008607059","https://openalex.org/W2009147281","https://openalex.org/W2010648620","https://openalex.org/W2016749504","https://openalex.org/W2020418994","https://openalex.org/W2021887777","https://openalex.org/W2030426070","https://openalex.org/W2043439067","https://openalex.org/W2046374806","https://openalex.org/W2078362644","https://openalex.org/W2096306082","https://openalex.org/W2102694060","https://openalex.org/W2109564520","https://openalex.org/W2118780041","https://openalex.org/W2125402791","https://openalex.org/W2133823067","https://openalex.org/W2141715461","https://openalex.org/W2142715026","https://openalex.org/W2150593724","https://openalex.org/W2159695171","https://openalex.org/W2164827488","https://openalex.org/W2167566230","https://openalex.org/W2168114694","https://openalex.org/W2168341111","https://openalex.org/W2217647653","https://openalex.org/W2273193692","https://openalex.org/W2295797196","https://openalex.org/W2328438385","https://openalex.org/W2538668925","https://openalex.org/W2739561835","https://openalex.org/W3041059378","https://openalex.org/W3132777343","https://openalex.org/W4230375040","https://openalex.org/W4246467014","https://openalex.org/W4248278717","https://openalex.org/W6642412289","https://openalex.org/W6676279278","https://openalex.org/W6741399193","https://openalex.org/W6780162973"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W2037060333","https://openalex.org/W2073434522","https://openalex.org/W2028000957","https://openalex.org/W4254684751","https://openalex.org/W2580376382","https://openalex.org/W4254946810","https://openalex.org/W2606756240","https://openalex.org/W4242877987","https://openalex.org/W2987852857"],"abstract_inverted_index":{"Flexible,":[0],"large":[1],"area":[2],"electronics":[3],"-":[4,6],"macroelectronics":[5,32,41],"using":[7],"amorphous":[8],"silicon,":[9],"low-temperature":[10],"polysilicon,":[11],"or":[12],"various":[13],"organic":[14],"and":[15,68,72],"inorganic":[16],"nanocrystalline":[17],"semiconductor":[18],"materials":[19],"is":[20,42],"beginning":[21,53],"to":[22,44,54,76,81],"show":[23],"great":[24],"promise.":[25],"While":[26],"much":[27],"of":[28,38],"the":[29,65,69],"activity":[30],"in":[31],"has":[33],"been":[34],"display-centric,":[35],"a":[36],"number":[37],"applications":[39,80],"where":[40],"needed":[43],"enable":[45,77],"solutions":[46],"that":[47],"are":[48,52],"otherwise":[49],"not":[50],"feasible":[51],"attract":[55],"technical":[56],"and/or":[57],"commercial":[58],"interest.":[59],"In":[60],"this":[61],"paper,":[62],"we":[63],"discuss":[64],"application":[66],"drivers":[67],"technology":[70],"needs":[71],"device":[73],"performance":[74,79],"requirements":[75],"high":[78],"include":[82],"RF":[83],"systems.":[84]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":4},{"year":2024,"cited_by_count":5},{"year":2023,"cited_by_count":8},{"year":2022,"cited_by_count":6},{"year":2021,"cited_by_count":6},{"year":2020,"cited_by_count":10},{"year":2019,"cited_by_count":6},{"year":2018,"cited_by_count":15},{"year":2017,"cited_by_count":9},{"year":2016,"cited_by_count":17},{"year":2015,"cited_by_count":25},{"year":2014,"cited_by_count":27},{"year":2013,"cited_by_count":34},{"year":2012,"cited_by_count":30}],"updated_date":"2026-03-12T08:34:05.389933","created_date":"2025-10-10T00:00:00"}
