{"id":"https://openalex.org/W4412536482","doi":"https://doi.org/10.1109/jetcas.2025.3590744","title":"Heterogeneous Integration in Co-Packaged Optics","display_name":"Heterogeneous Integration in Co-Packaged Optics","publication_year":2025,"publication_date":"2025-07-21","ids":{"openalex":"https://openalex.org/W4412536482","doi":"https://doi.org/10.1109/jetcas.2025.3590744"},"language":"en","primary_location":{"id":"doi:10.1109/jetcas.2025.3590744","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jetcas.2025.3590744","pdf_url":null,"source":{"id":"https://openalex.org/S142323794","display_name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","issn_l":"2156-3357","issn":["2156-3357","2156-3365"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5027740007","display_name":"Yu-Tao Yang","orcid":"https://orcid.org/0000-0003-2313-7790"},"institutions":[{"id":"https://openalex.org/I173632517","display_name":"MediaTek (China)","ror":"https://ror.org/05xvgy636","country_code":"CN","type":"company","lineage":["https://openalex.org/I173632517","https://openalex.org/I4210148979"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yu-Tao Yang","raw_affiliation_strings":["MediaTek USA Inc., San Jose, CA, USA","MediaTek USA Inc, San Jose, CA, USA"],"affiliations":[{"raw_affiliation_string":"MediaTek USA Inc., San Jose, CA, USA","institution_ids":[]},{"raw_affiliation_string":"MediaTek USA Inc, San Jose, CA, USA","institution_ids":["https://openalex.org/I173632517"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101828233","display_name":"Chih-Ming Hung","orcid":"https://orcid.org/0009-0005-6613-5834"},"institutions":[{"id":"https://openalex.org/I4210148979","display_name":"MediaTek (Taiwan)","ror":"https://ror.org/05g9jck81","country_code":"TW","type":"company","lineage":["https://openalex.org/I4210148979"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chih-Ming Hung","raw_affiliation_strings":["MediaTek Inc., Hsinchu Science Park, Hsinchu, Taiwan","MediaTek Inc, Hsinchu Science Park, Hsinchu City, Taiwan"],"affiliations":[{"raw_affiliation_string":"MediaTek Inc., Hsinchu Science Park, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I4210148979"]},{"raw_affiliation_string":"MediaTek Inc, Hsinchu Science Park, Hsinchu City, Taiwan","institution_ids":["https://openalex.org/I4210148979"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5027740007"],"corresponding_institution_ids":["https://openalex.org/I173632517"],"apc_list":null,"apc_paid":null,"fwci":2.4806,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.89988634,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":100},"biblio":{"volume":"15","issue":"3","first_page":"427","last_page":"437"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9944000244140625,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9605000019073486,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11517","display_name":"Advanced optical system design","score":0.9089999794960022,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.48588722944259644},{"id":"https://openalex.org/keywords/integrated-optics","display_name":"Integrated optics","score":0.4314725995063782},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.41773441433906555},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.40694230794906616},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.40371769666671753},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.24226656556129456}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.48588722944259644},{"id":"https://openalex.org/C2984692560","wikidata":"https://www.wikidata.org/wiki/Q523846","display_name":"Integrated optics","level":2,"score":0.4314725995063782},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.41773441433906555},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.40694230794906616},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.40371769666671753},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.24226656556129456}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/jetcas.2025.3590744","is_oa":false,"landing_page_url":"https://doi.org/10.1109/jetcas.2025.3590744","pdf_url":null,"source":{"id":"https://openalex.org/S142323794","display_name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","issn_l":"2156-3357","issn":["2156-3357","2156-3365"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":31,"referenced_works":["https://openalex.org/W1496014055","https://openalex.org/W2159032199","https://openalex.org/W2787828608","https://openalex.org/W2887926058","https://openalex.org/W2887979054","https://openalex.org/W2913848248","https://openalex.org/W2922098227","https://openalex.org/W2933780027","https://openalex.org/W3006808337","https://openalex.org/W3015421532","https://openalex.org/W3016083641","https://openalex.org/W3048274750","https://openalex.org/W3110492894","https://openalex.org/W3125745071","https://openalex.org/W3135438122","https://openalex.org/W3137477516","https://openalex.org/W3209126808","https://openalex.org/W3211730428","https://openalex.org/W4220769636","https://openalex.org/W4312968147","https://openalex.org/W4360605414","https://openalex.org/W4377082372","https://openalex.org/W4380303683","https://openalex.org/W4385525472","https://openalex.org/W4391594491","https://openalex.org/W4400033923","https://openalex.org/W4400034213","https://openalex.org/W4400062335","https://openalex.org/W4402475795","https://openalex.org/W4407694456","https://openalex.org/W4408182646"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W4404995717","https://openalex.org/W2016187641","https://openalex.org/W4404725684","https://openalex.org/W4246450666","https://openalex.org/W4388998267","https://openalex.org/W4409278740","https://openalex.org/W2898370298","https://openalex.org/W4410118003","https://openalex.org/W2137437058"],"abstract_inverted_index":{"Generative":[0],"artificial":[1],"intelligence":[2],"(GAI)":[3],"and":[4,16,48,56,82,96,100,108,112,115,125,143,155,169],"Large":[5],"Language":[6],"Model":[7],"(LLM)":[8],"require":[9],"data":[10,44],"center":[11,45],"to":[12,161],"have":[13],"higher":[14],"bandwidth,":[15],"better":[17],"energy":[18],"efficiency.":[19],"To":[20],"achieve":[21],"this,":[22],"Co-packaged":[23],"optics":[24],"(CPO)":[25],"is":[26,67,71,123,126],"one":[27],"of":[28,106,117,128],"the":[29,93,98,101,163,172],"future":[30,176],"directions":[31],"that":[32],"leverages":[33],"advanced":[34,141],"packaging":[35,70],"with":[36,73,140],"integrated":[37,145],"photonics.":[38],"However,":[39],"this":[40,60],"tight":[41],"integration":[42,63],"complicates":[43],"system":[46,178],"design":[47],"multi-physics":[49],"interactions,":[50],"including":[51,88],"electrical,":[52],"optical,":[53],"thermal,":[54],"mechanical,":[55],"material":[57],"aspects.":[58],"In":[59],"paper,":[61],"heterogeneous":[62],"(HI)":[64],"in":[65,77,167],"CPO":[66,168,177],"discussed.":[68],"Multi-physics":[69],"exemplified":[72],"two":[74],"cases.":[75],"Challenges":[76],"HI":[78,165],"technologies":[79],"are":[80,86],"reviewed":[81],"corresponding":[83],"mitigation":[84],"methods":[85],"provided,":[87],"(1)":[89,129],"thermal":[90],"crosstalk":[91],"within":[92],"electrical":[94,99],"domain":[95],"between":[97],"optical":[102,133,146,151,156],"interaction,":[103],"(2)":[104,132],"SIPI":[105],"wide-and-slow":[107],"narrow-and-fast":[109],"channel":[110],"links,":[111],"(3)":[113,136],"pros":[114],"cons":[116],"interposer":[118],"material.":[119],"Integrated":[120],"photonics":[121],"part":[122],"introduced":[124],"composed":[127],"light":[130],"sources,":[131],"coupling":[134],"strategies,":[135],"fiber":[137],"attach":[138],"schemes":[139],"packaging,":[142],"(4)":[144],"technologies,":[147],"e.g.":[148],"novel":[149],"microlens,":[150],"TSV,":[152],"3D":[153],"waveguide,":[154],"3DIC.":[157],"This":[158],"article":[159],"aims":[160],"identify":[162],"key":[164],"challenges":[166],"points":[170],"out":[171],"potential":[173],"solutions":[174],"for":[175],"advancement.":[179]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":1}],"updated_date":"2026-03-05T09:29:38.588285","created_date":"2025-10-10T00:00:00"}