{"id":"https://openalex.org/W4410536649","doi":"https://doi.org/10.1109/jetcas.2025.3572003","title":"Die-Level Transformation From 2D Shuttle Chips to 3D-IC With TSV for Advanced Rapid Prototyping Methodology With Meta Bonding","display_name":"Die-Level Transformation From 2D Shuttle Chips to 3D-IC With TSV for Advanced Rapid Prototyping Methodology With Meta Bonding","publication_year":2025,"publication_date":"2025-05-20","ids":{"openalex":"https://openalex.org/W4410536649","doi":"https://doi.org/10.1109/jetcas.2025.3572003"},"language":"en","primary_location":{"id":"doi:10.1109/jetcas.2025.3572003","is_oa":true,"landing_page_url":"https://doi.org/10.1109/jetcas.2025.3572003","pdf_url":null,"source":{"id":"https://openalex.org/S142323794","display_name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","issn_l":"2156-3357","issn":["2156-3357","2156-3365"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","raw_type":"journal-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"hybrid","oa_url":"https://doi.org/10.1109/jetcas.2025.3572003","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5041535044","display_name":"Takafumi Fukushima","orcid":"https://orcid.org/0000-0003-2303-8178"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Takafumi Fukushima","raw_affiliation_strings":["Department of Mechanical Systems Engineering, Tohoku University, Sendai, Miyagi, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Systems Engineering, Tohoku University, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006295728","display_name":"Tetsu Tanaka","orcid":"https://orcid.org/0000-0001-7414-315X"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Tetsu Tanaka","raw_affiliation_strings":["Department of Biomedical Engineering, Tohoku University, Sendai, Miyagi, Japan"],"affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, Tohoku University, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5059487693","display_name":"Mitsumasa Koyanagi","orcid":"https://orcid.org/0000-0003-4726-4217"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Mitsumasa Koyanagi","raw_affiliation_strings":["NICHe, Tohoku University, Sendai, Japan"],"affiliations":[{"raw_affiliation_string":"NICHe, Tohoku University, Sendai, Japan","institution_ids":["https://openalex.org/I201537933"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5041535044"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.7103,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.70420923,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":"15","issue":"3","first_page":"415","last_page":"426"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9955000281333923,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9955000281333923,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.992900013923645,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12784","display_name":"Modular Robots and Swarm Intelligence","score":0.9625999927520752,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/rapid-prototyping","display_name":"Rapid prototyping","score":0.5938239097595215},{"id":"https://openalex.org/keywords/transformation","display_name":"Transformation (genetics)","score":0.4971912205219269},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4946853816509247},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.41999173164367676},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.17561566829681396},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.10755676031112671}],"concepts":[{"id":"https://openalex.org/C2780395129","wikidata":"https://www.wikidata.org/wiki/Q1128971","display_name":"Rapid prototyping","level":2,"score":0.5938239097595215},{"id":"https://openalex.org/C204241405","wikidata":"https://www.wikidata.org/wiki/Q461499","display_name":"Transformation (genetics)","level":3,"score":0.4971912205219269},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4946853816509247},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.41999173164367676},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.17561566829681396},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.10755676031112671},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/jetcas.2025.3572003","is_oa":true,"landing_page_url":"https://doi.org/10.1109/jetcas.2025.3572003","pdf_url":null,"source":{"id":"https://openalex.org/S142323794","display_name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","issn_l":"2156-3357","issn":["2156-3357","2156-3365"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","raw_type":"journal-article"}],"best_oa_location":{"id":"doi:10.1109/jetcas.2025.3572003","is_oa":true,"landing_page_url":"https://doi.org/10.1109/jetcas.2025.3572003","pdf_url":null,"source":{"id":"https://openalex.org/S142323794","display_name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","issn_l":"2156-3357","issn":["2156-3357","2156-3365"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":"cc-by","license_id":"https://openalex.org/licenses/cc-by","version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","raw_type":"journal-article"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":62,"referenced_works":["https://openalex.org/W582694503","https://openalex.org/W1966960161","https://openalex.org/W1979601109","https://openalex.org/W1981612049","https://openalex.org/W1995097493","https://openalex.org/W1997935435","https://openalex.org/W2009195513","https://openalex.org/W2011389441","https://openalex.org/W2017387783","https://openalex.org/W2021090473","https://openalex.org/W2029530099","https://openalex.org/W2050628845","https://openalex.org/W2060096974","https://openalex.org/W2063114735","https://openalex.org/W2063406919","https://openalex.org/W2066750354","https://openalex.org/W2090414396","https://openalex.org/W2101466724","https://openalex.org/W2106608281","https://openalex.org/W2107268071","https://openalex.org/W2116759779","https://openalex.org/W2121044629","https://openalex.org/W2122072014","https://openalex.org/W2124583578","https://openalex.org/W2125551870","https://openalex.org/W2145163207","https://openalex.org/W2146042676","https://openalex.org/W2154309229","https://openalex.org/W2159032199","https://openalex.org/W2178969816","https://openalex.org/W2335374743","https://openalex.org/W2471989733","https://openalex.org/W2529942914","https://openalex.org/W2532445741","https://openalex.org/W2537189011","https://openalex.org/W2538379839","https://openalex.org/W2538857334","https://openalex.org/W2619080707","https://openalex.org/W2673295456","https://openalex.org/W2734717308","https://openalex.org/W2767528953","https://openalex.org/W2885282057","https://openalex.org/W2885678651","https://openalex.org/W2893878515","https://openalex.org/W2900627689","https://openalex.org/W3015486632","https://openalex.org/W3015951929","https://openalex.org/W3041133899","https://openalex.org/W3083002590","https://openalex.org/W3171321731","https://openalex.org/W4210371209","https://openalex.org/W4239250096","https://openalex.org/W4248860257","https://openalex.org/W4285103121","https://openalex.org/W4285103241","https://openalex.org/W4317794250","https://openalex.org/W4320001363","https://openalex.org/W4382052492","https://openalex.org/W4400033937","https://openalex.org/W4400034113","https://openalex.org/W4400034197","https://openalex.org/W4400034655"],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W4404521051","https://openalex.org/W4404995717","https://openalex.org/W2016187641","https://openalex.org/W2042913821","https://openalex.org/W4404725684","https://openalex.org/W4246450666","https://openalex.org/W4388998267","https://openalex.org/W4409278740","https://openalex.org/W2898370298"],"abstract_inverted_index":{"Three-dimensional":[0],"integrated":[1],"circuit":[2],"(3D-IC)":[3],"technology,":[4,13],"often":[5],"referred":[6],"to":[7,58,80,116,121,177],"as":[8,27,45,194],"through-silicon":[9],"via":[10],"(TSV)":[11],"formation":[12,65],"has":[14],"been":[15],"steadily":[16],"maturing":[17],"and":[18,35,90,147,197,216],"is":[19,104],"increasingly":[20],"used":[21],"in":[22],"advanced":[23],"semiconductor":[24],"devices":[25],"such":[26,193],"3D":[28,46],"complementary":[29],"metal-oxide-semiconductor":[30],"image":[31],"sensors,":[32],"high-bandwidth":[33],"memory,":[34],"static":[36],"random-access":[37],"memory":[38],"on":[39,184],"central":[40],"processing":[41],"units":[42],"(commonly":[43],"known":[44],"V-Cache).":[47],"However,":[48],"the":[49,59,67,84,101,162,202,205],"initial":[50],"development":[51],"costs":[52],"remain":[53,141],"prohibitively":[54],"high,":[55],"primarily":[56,182],"due":[57],"substantial":[60],"investment":[61],"required":[62],"for":[63,219],"TSV":[64],"at":[66,130],"wafer":[68],"level.":[69],"Meanwhile,":[70],"conventional":[71],"system-on-chip":[72],"designs":[73],"are":[74],"transitioning":[75],"from":[76,113,171,175],"fin":[77],"field-effect":[78],"transistor":[79],"gate-all-around":[81],"architectures":[82,129],"using":[83,150,168],"latest":[85],"sub-3":[86],"nm":[87],"technology":[88,110],"nodes":[89],"incorporating":[91],"extreme":[92],"ultraviolet":[93],"lithography":[94],"along":[95],"with":[96,127],"other":[97],"cutting-edge":[98],"techniques.":[99],"Simultaneously,":[100],"academic":[102],"community":[103],"fostering":[105],"an":[106],"environment":[107],"that":[108,160],"supports":[109],"node":[111],"utilization":[112],"legacy":[114],"180":[115],"7":[117],"nm,":[118],"enabling":[119,191],"designers":[120],"develop":[122],"two-dimensional":[123],"IC":[124],"(2D-IC)":[125],"chips":[126,170],"novel":[128],"reduced":[131],"costs.":[132],"Despite":[133],"these":[134],"advancements,":[135],"foundry":[136],"shuttle":[137,169],"services":[138],"utilizing":[139],"TSVs":[140],"largely":[142],"inaccessible,":[143],"making":[144],"proof-of-principle":[145],"demonstrations":[146],"functional":[148],"verification":[149],"3D-ICs":[151,167],"extremely":[152],"challenging.":[153],"This":[154],"study":[155,203],"introduces":[156],"recent":[157],"technological":[158],"advancements":[159],"enable":[161],"transformation":[163],"of":[164,207],"2D-ICs":[165],"into":[166],"multi-project":[172],"wafers,":[173],"ranging":[174],"small":[176],"large-scale":[178],"implementations.":[179],"The":[180],"discussion":[181],"focuses":[183],"die-level,":[185],"short-turnaround-time":[186],"3D-IC":[187,222],"fabrication,":[188],"emphasizing":[189],"key":[190],"technologies":[192],"multichip":[195],"thinning":[196],"TSV/microbump":[198],"formation.":[199],"In":[200],"addition,":[201],"explores":[204],"effectiveness":[206],"Meta":[208],"BondingTM":[209],"techniques,":[210],"including":[211],"fine-pitch":[212],"microbump,":[213],"direct":[214],"bonding,":[215,218],"hybrid":[217],"future":[220],"high-performance":[221],"prototyping.":[223]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-05-21T00:00:00"}