{"id":"https://openalex.org/W1575474762","doi":"https://doi.org/10.1109/iwsoc.2003.1213055","title":"The glue in a confident SoC flow","display_name":"The glue in a confident SoC flow","publication_year":2004,"publication_date":"2004-04-23","ids":{"openalex":"https://openalex.org/W1575474762","doi":"https://doi.org/10.1109/iwsoc.2003.1213055","mag":"1575474762"},"language":"en","primary_location":{"id":"doi:10.1109/iwsoc.2003.1213055","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iwsoc.2003.1213055","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications, 2003. Proceedings.","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5053501895","display_name":"John Ferguson","orcid":"https://orcid.org/0000-0001-6609-2073"},"institutions":[{"id":"https://openalex.org/I105695857","display_name":"Siemens (Hungary)","ror":"https://ror.org/01rk7mv85","country_code":"HU","type":"company","lineage":["https://openalex.org/I105695857","https://openalex.org/I1325886976"]},{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["HU","US"],"is_corresponding":true,"raw_author_name":"J. Ferguson","raw_affiliation_strings":["Mentor Graphics Corporation, Oregon","Mentor Graphics Corp. Wilsonville, OR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, Oregon","institution_ids":["https://openalex.org/I4210156212"]},{"raw_affiliation_string":"Mentor Graphics Corp. Wilsonville, OR, USA","institution_ids":["https://openalex.org/I105695857"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5053501895"],"corresponding_institution_ids":["https://openalex.org/I105695857","https://openalex.org/I4210156212"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.06320944,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"316","last_page":"319"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12122","display_name":"Physical Unclonable Functions (PUFs) and Hardware Security","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9962999820709229,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.6883935332298279},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.666439950466156},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.5578370690345764},{"id":"https://openalex.org/keywords/electronic-design-automation","display_name":"Electronic design automation","score":0.5530128479003906},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.5440726280212402},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5350415110588074},{"id":"https://openalex.org/keywords/integrated-circuit-design","display_name":"Integrated circuit design","score":0.5000801086425781},{"id":"https://openalex.org/keywords/engineering-design-process","display_name":"Engineering design process","score":0.49288439750671387},{"id":"https://openalex.org/keywords/systems-engineering","display_name":"Systems engineering","score":0.47358137369155884},{"id":"https://openalex.org/keywords/glue","display_name":"GLUE","score":0.45331764221191406},{"id":"https://openalex.org/keywords/software-engineering","display_name":"Software engineering","score":0.4228549003601074},{"id":"https://openalex.org/keywords/foundry","display_name":"Foundry","score":0.42213237285614014},{"id":"https://openalex.org/keywords/design-process","display_name":"Design process","score":0.41998130083084106},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.37644270062446594},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.3252597451210022},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27929168939590454},{"id":"https://openalex.org/keywords/work-in-process","display_name":"Work in process","score":0.15788716077804565},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.15526175498962402},{"id":"https://openalex.org/keywords/operations-management","display_name":"Operations management","score":0.09039977192878723}],"concepts":[{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.6883935332298279},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.666439950466156},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.5578370690345764},{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.5530128479003906},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.5440726280212402},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5350415110588074},{"id":"https://openalex.org/C74524168","wikidata":"https://www.wikidata.org/wiki/Q1074539","display_name":"Integrated circuit design","level":2,"score":0.5000801086425781},{"id":"https://openalex.org/C34972735","wikidata":"https://www.wikidata.org/wiki/Q2920267","display_name":"Engineering design process","level":2,"score":0.49288439750671387},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.47358137369155884},{"id":"https://openalex.org/C2779937294","wikidata":"https://www.wikidata.org/wiki/Q5513666","display_name":"GLUE","level":2,"score":0.45331764221191406},{"id":"https://openalex.org/C115903868","wikidata":"https://www.wikidata.org/wiki/Q80993","display_name":"Software engineering","level":1,"score":0.4228549003601074},{"id":"https://openalex.org/C2781087836","wikidata":"https://www.wikidata.org/wiki/Q13883136","display_name":"Foundry","level":2,"score":0.42213237285614014},{"id":"https://openalex.org/C48262172","wikidata":"https://www.wikidata.org/wiki/Q16908765","display_name":"Design process","level":3,"score":0.41998130083084106},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.37644270062446594},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.3252597451210022},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27929168939590454},{"id":"https://openalex.org/C174998907","wikidata":"https://www.wikidata.org/wiki/Q357662","display_name":"Work in process","level":2,"score":0.15788716077804565},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.15526175498962402},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.09039977192878723},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iwsoc.2003.1213055","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iwsoc.2003.1213055","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 3rd IEEE International Workshop on System-on-Chip for Real-Time Applications, 2003. Proceedings.","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9","score":0.6499999761581421}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4253195573","https://openalex.org/W2020934033","https://openalex.org/W2051886008","https://openalex.org/W2535520145","https://openalex.org/W1716153929","https://openalex.org/W2743305891","https://openalex.org/W2059530328","https://openalex.org/W3011978806","https://openalex.org/W3205162826","https://openalex.org/W2610167993"],"abstract_inverted_index":{"System-on-chip":[0],"(SoC)":[1],"design":[2,9,15,55,79,90,114,162],"combines":[3],"individual":[4],"components":[5,131],"created":[6],"by":[7,26,149],"various":[8,89],"groups,":[10],"and":[11,18,51,54,70,83,105,119,163],"developed":[12],"using":[13],"numerous":[14],"styles,":[16],"methodologies":[17,71],"knowledge":[19],"levels.":[20],"Despite":[21],"the":[22,43,78,98,112,125,129,143,150,158],"functionality":[23],"strength":[24],"realized":[25],"this":[27],"engineering":[28],"diversity,":[29],"each":[30],"component":[31],"must":[32],"meet":[33,142],"a":[34,94,101,133],"common":[35,95],"standard":[36,96],"during":[37],"development-the":[38],"physical":[39,103],"verification":[40,104,146],"requirements":[41],"of":[42],"foundry":[44],"or":[45],"manufacturer.":[46],"As":[47],"designs":[48],"become":[49,57],"larger":[50],"more":[52,58],"complex,":[53],"rules":[56],"numerous,":[59],"greater":[60],"demand":[61],"is":[62],"placed":[63],"on":[64],"EDA":[65,137],"toolmakers":[66],"to":[67],"develop":[68],"tools":[69,138],"that":[72,127,139],"will":[73,86,108],"not":[74,109,140],"only":[75,110,141],"help":[76],"streamline":[77,111],"process":[80],"with":[81],"efficiency":[82],"accuracy,":[84],"but":[85,121,152],"also":[87,122,153],"accommodate":[88],"styles":[91],"while":[92],"establishing":[93],"across":[97],"industry.":[99],"Adopting":[100],"single":[102],"extraction":[106],"flow":[107],"SoC":[113,167],"process,":[115],"thereby":[116],"saving":[117],"time":[118],"resources,":[120],"act":[123],"as":[124],"glue":[126],"binds":[128],"many":[130],"into":[132],"cohesive":[134],"system.":[135],"Choosing":[136],"rigorous":[144],"internal":[145],"standards":[147],"set":[148],"foundry,":[151],"are":[154],"widely":[155],"adopted":[156],"throughout":[157],"industry,":[159],"ensures":[160],"confident":[161],"data":[164],"transfer":[165],"among":[166],"providers.":[168]},"counts_by_year":[{"year":2016,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}